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    • 6. 发明授权
    • Packaging architecture for 32 processor server
    • 32处理器服务器的包装架构
    • US06452789B1
    • 2002-09-17
    • US09562593
    • 2000-04-29
    • Lisa Heid PallottiEric C. PetersonChristian L BeladyTerrel L. MorrisMichael C. Day
    • Lisa Heid PallottiEric C. PetersonChristian L BeladyTerrel L. MorrisMichael C. Day
    • G06F1200
    • G06F15/16
    • The inventive system uses a backplane to interconnect a plurality of modular cell boards. Each cell board comprises a plurality of processors, a processor controller chip, a memory subsystem, and a power subsystem. The processor controller chip manages communications between components on the cell board. A mechanical subassembly provides support for the cell board, as well as ventilation passages for cooling. Controller chips are connected to one side of the backplane, while the cell boards are connected to the other side. The controller chips manage cell board to cell board communications, and communications between the backplane and the computer system. The cell boards are arranged in back to back pairs, with the outer most cell boards having their components extend beyond the height of the backplane. This allows for an increase of spacing between the front to front interface of adjacent cell boards.
    • 本发明的系统使用背板来互连多个模块化单元板。 每个单元板包括多个处理器,处理器控制器芯片,存储器子系统和电源子系统。 处理器控制器芯片管理单元板上的组件之间的通信。 机械子组件为电池板提供支撑,以及用于冷却的通风通道。 控制器芯片连接到背板的一侧,而单元板连接到另一侧。 控制器芯片管理单元板到单元板通信,以及背板和计算机系统之间的通信。 单元板布置成背靠背对,其中最外面的单元板具有其组件延伸超出背板的高度。 这允许相邻电池板的前面与前面之间的间隔增加。
    • 9. 发明授权
    • AC coupled termination of a printed circuit board power plane in its
characteristic impedance
    • 印刷电路板电源平面的AC耦合端接在其特性阻抗中
    • US5708400A
    • 1998-01-13
    • US739532
    • 1996-10-30
    • Terrel L. Morris
    • Terrel L. Morris
    • H05K1/02H05K3/46H05K9/00
    • H05K1/0246H05K1/0234H05K9/0039H05K1/0231H05K2201/09309H05K2201/10022H05K2201/10446H05K2201/10522
    • High speed power supply transients are suppressed in a system having fast edges and where a radial transmission line exists between the power supply and ground planes, by terminating the edges of the PCB in it characteristic impedance. In practice, this means approximating a continuous construct with many spaced instances of a discrete resistance. The dissipative terminations themselves are resistive, and if placed directly between the power supply and ground would needlessly dissipate a great deal of DC power. To prevent that they are AC coupled with a high quality coupling capacitor of sufficient capacitance to allow the resulting impedance to appear predominately resistive at and above the lowest frequency of interest, say, 100 MHz. Because of the confused nature of the reflection that may be generated at arbitrary locations within the interior of the PCB, there may well be "hot spots" within that interior that would benefit from the placement of a selected AC coupled load at or near such a spot.
    • 在具有快速边缘的系统中以及在电源和接地层之间存在径向传输线的高速电源瞬变被抑制,通过将PCB的边缘端接在其特性阻抗中。 实际上,这意味着近似具有离散电阻的多个间隔实例的连续构造。 耗散端子本身是电阻性的,如果直接放置在电源和地之间,则不必要地消耗大量的直流电源。 为了防止它们与具有足够电容的高质量耦合电容器交流耦合,以允许所得到的阻抗在感兴趣的最低频率(例如100MHz)处出现在主要电阻上。 由于可能在PCB内部的任意位置产生的反射的混淆性质,在该内部可能会有“热点”,这将受益于将所选择的AC耦合负载放置在这样的位置处或附近 点。