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    • 1. 发明申请
    • MICROWAVE HEAT TREATMENT METHOD
    • 微波热处理方法
    • US20140283734A1
    • 2014-09-25
    • US14223547
    • 2014-03-24
    • TOKYO ELECTRON LIMITED
    • Taichi MONDENJunichi KITAGAWASeokhyoung HONGYoshiro KABE
    • C30B1/02C30B30/00
    • C30B1/023C30B29/06C30B30/00
    • The present disclosure relates to a heat treatment method of performing a single crystallization of amorphous silicon formed on a substrate to be processed by irradiating the substrate with a microwave. The heat treatment method includes: irradiating the substrate with a microwave to increase a temperature of the substrate to a first temperature such that the amorphous silicon formed on the substrate becomes a single crystal at an interface between the substrate and the amorphous silicon and a nucleation does not occur in a region except the interface; irradiating the substrate with a microwave to heat the substrate at the first temperature for a predetermined period; irradiating the substrate with the microwave to increase the first temperature to a second temperature, which is higher than the first temperature; and irradiating the substrate with the microwave to heat the substrate at the second temperature.
    • 本公开内容涉及通过用微波照射基板来在待处理的基板上进行单晶结晶化的热处理方法。 热处理方法包括:用微波照射基板以将基板的温度升高到第一温度,使得形成在基板上的非晶硅在基板和非晶硅之间的界面处成为单晶,并且成核确定 不在界面以外的区域发生; 用微波照射基板,在第一温度下加热基板一段预定时间; 用微波照射基板以将第一温度升高到高于第一温度的第二温度; 以及在所述第二温度下用所述微波照射所述基板以加热所述基板。
    • 6. 发明申请
    • MICROWAVE HEAT TREATMENT APPARATUS AND MICROWAVE HEAT TREATMENT METHOD
    • 微波热处理装置和微波加热处理方法
    • US20150144622A1
    • 2015-05-28
    • US14550065
    • 2014-11-21
    • Tokyo Electron Limited
    • Seokhyoung HONGTaichi MONDENYoshihiro MIYAGAWAMasaki KOIZUMI
    • H05B6/80H01L21/67H05B6/64
    • A microwave heat treatment apparatus includes: a processing vessel configured to accommodate a substrate therein; a support member configured to rotatably support the substrate in the processing vessel; a microwave introduction device configured to generate a microwave for processing the substrate and introduce the microwave into the processing vessel; a first cooling gas introduction part installed to face a main surface of the substrate supported by the support member, the main surface being a target to be processed; a second cooling gas introduction part installed in a lateral side of the substrate supported by the support member; and a control unit configured to independently control the introduction of a cooling gas from the first cooling gas introduction part and the introduction of the cooling gas from the second cooling gas introduction part.
    • 微波热处理装置包括:处理容器,其构造成在其中容纳基板; 支撑构件,其构造成将所述基板可旋转地支撑在所述处理容器中; 微波引入装置,被配置为产生用于处理所述基板并将所述微波引入所述处理容器的微波; 第一冷却气体导入部,其安装成面对由所述支撑构件支撑的所述基板的主表面,所述主表面为待加工对象物; 第二冷却气体引入部,安装在由所述支撑构件支撑的所述基板的侧面中; 以及控制单元,其被配置为独立地控制从所述第一冷却气体导入部引入冷却气体和从所述第二冷却气体导入部引入所述冷却气体。