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1. 发明授权

US5987165A Image processing system 失效
标题翻译：图像处理系统
公开(公告)号：US5987165A
公开(公告)日：1999-11-16
申请号：US706249
申请日：1996-09-04
申请人： Tomoyasu Matsuzaki , Yoshiharu Hibi , Toshio Yamazaki , Noriyuki Kurabayashi , Takahide Inoue
发明人： Tomoyasu Matsuzaki , Yoshiharu Hibi , Toshio Yamazaki , Noriyuki Kurabayashi , Takahide Inoue
IPC分类号： G06T5/00 , G09G5/02 , H04N1/46 , H04N1/60 , G06K9/00
CPC分类号： H04N1/6011 , H04N1/6058
摘要： An original image 402, conversion images 404a-404c provided by executing gamut compression systems, and a mix percentage scale 406 are displayed on a display. The user can click on any one of the conversion images 404a-404c for specifying a user-adjusted image 403. Further, when the user clicks on the mix percentage scale 406, the conversion images 404a-404c are mixed in response to the point on which the user clicks (point 406p), and the result is specified as the user-adjusted image 403.
摘要翻译：在显示器上显示原始图像402，通过执行色域压缩系统提供的转换图像404a-404c和混合百分比尺度406。用户可以点击任何一个转换图像404a-404c来指定用户调整图像403.此外，当用户点击混合百分比尺度406时，转换图像404a-404c响应于点用户点击（点406p），并将结果指定为用户调整图像403。

2. 发明授权

US06091520A Color image forming device 失效
标题翻译：彩色图像形成装置
公开(公告)号：US06091520A
公开(公告)日：2000-07-18
申请号：US6202
申请日：1998-01-13
申请人： Yoshiharu Hibi , Atsushi Kitagawara , Toru Misaizu , Toshio Yamazaki , Hitoshi Ogatsu
发明人： Yoshiharu Hibi , Atsushi Kitagawara , Toru Misaizu , Toshio Yamazaki , Hitoshi Ogatsu
IPC分类号： B41J5/30 , H04N1/40 , H04N1/409 , H04N1/48 , H04N1/60
CPC分类号： H04N1/6094 , H04N1/40 , H04N1/4092
摘要： A color image forming device produces a good image form, superior in color and gradation reproduction, and little over-enhancement in sharpness during generation duplicating. The device has an image processing parameter storage unit that stores parameters for processing which correspond to original document modes in respective processing blocks. An image processing parameter detector detects the original document mode, and provides the mode to the respective components as an original document mode directive TAG. When generation duplicating is designated, the generation duplicating mode corresponding to the set original document mode is set, and various parameter settings are indicated corresponding to the set generation duplicating mode in the image processing parameter storage unit. By such, the operation in each image processing module is converted to the set generation duplicating mode.
摘要翻译：彩色图像形成装置产生良好的图像形状，颜色和灰度再现性优异，并且在生成复制期间的锐度几乎不会过度增强。该设备具有图像处理参数存储单元，其存储与各个处理块中的原始文档模式相对应的用于处理的参数。图像处理参数检测器检测原始文档模式，并将模式作为原始文档模式指令TAG提供给各个组件。当指定生成复制时，设置与设置的原始文档模式对应的生成复制模式，并且在图像处理参数存储单元中对应于设置的生成复制模式指示各种参数设置。这样，每个图像处理模块中的操作被转换成设定的生成复制模式。

3. 发明授权

US09922441B2 Image processing device, image processing method, and program 有权
公开(公告)号：US09922441B2
公开(公告)日：2018-03-20
申请号：US13990824
申请日：2011-10-24
申请人： Seiji Kobayashi , Toshio Yamazaki
发明人： Seiji Kobayashi , Toshio Yamazaki
IPC分类号： G06T15/00 , H04N13/00 , H04N13/04 , H04N13/02
CPC分类号： G06T15/00 , H04N13/117 , H04N13/239 , H04N13/261 , H04N13/302 , H04N13/351 , H04N2013/0081
摘要： An image processing device with a configuration enabling generating of images from a new viewpoint by simple signal processing is provided. Input image signals for the right eye, and input image signals for the left eye to be applied to image display are input, and a right image converting unit generates a converted image where the input image signals for the right eye have been subjected to phase change in the right direction or the left direction, in accordance with features of the image. In the same way, a left image converting unit generates a converted image where the input image signals for the left eye have been subjected to phase change in the left direction or the right direction, in accordance with features of the image. The generated image of the right image converting unit and the generated image of the left image converting unit are output as multiple new viewpoint images. A converted image is generated by processing where a luminance differential signal of an input image, or a nonlinear conversion signal of the luminance differential signal is added or subtracted, to or from the input image signal, for example.

4. 发明申请

US20120312094A1 ANGULAR SPEED SENSOR AND COMPOSITE SENSOR FOR DETECTING ANGULAR SPEED AND ACCELERATION 有权
标题翻译：用于检测角速度和加速度的角速传感器和复合传感器
公开(公告)号：US20120312094A1
公开(公告)日：2012-12-13
申请号：US13579346
申请日：2011-02-16
申请人： Takashi Uchida , Toshio Yamazaki , Tomohiro Mitani
发明人： Takashi Uchida , Toshio Yamazaki , Tomohiro Mitani
IPC分类号： G01C19/56 , G01C19/5607
CPC分类号： G01C19/5607 , B81B7/0016 , B81B2201/0242 , G01C19/5628 , G01C19/574 , G01C19/5769
摘要： A placing member (80) is configured to be supported from an outside by a terminal (81) electrically connected to a terminal electrode, and an X-axis-direction extended portion (84), a Y-axis-direction extended portion (82), and a Z-axis-direction extended portion (83) are provided in the terminal (81). This configuration provides an angular velocity sensor, in which a problem such that Y-axis-direction and Z-axis-direction vibrations applied from the outside cannot be damped is eliminated, and all the vibrations in three axis directions can be damped.
摘要翻译：配置构件（80）通过与端子电极电连接的端子（81）和X轴方向延伸部（84），Y轴方向延伸部（82））和Z轴方向延伸部（83）设置在端子（81）中。这种结构提供了一种角速度传感器，其中消除了从外部施加的Y轴方向和Z轴方向振动不能被阻尼的问题，并且可以抑制三轴方向上的所有振动。

5. 发明授权

US08110646B2 Preparation of triorganosiloxy end-capped organopolysiloxane 有权
标题翻译：三有机甲硅烷基封端的有机聚硅氧烷的制备
公开(公告)号：US08110646B2
公开(公告)日：2012-02-07
申请号：US12851898
申请日：2010-08-06
申请人： Kazuhiro Oishi , Toshio Yamazaki
发明人： Kazuhiro Oishi , Toshio Yamazaki
IPC分类号： C08G77/08
CPC分类号： C08G77/20 , C08G77/12 , C08G77/24
摘要： A triorganosiloxy end-capped organopolysiloxane, i.e., organopolysiloxane having a backbone consisting essentially of repeating (3,3,3-trifluoropropyl)methylsiloxane units and end-capped with triorganosiloxy groups is prepared by copolymerizing tris(3,3,3-trifluoropropyl)trimethylcyclo-trisiloxane with a silanol end-capped organopolysiloxane in the presence of an alkyllithium or lithium silanolate catalyst to form a silanol end-capped copolymer, and adding a trialkylsilyl triflate or strong acid in excess relative to the catalyst and a hexaorganodisilazane for effecting end-capping and neutralization.
摘要翻译：三有机甲硅烷氧基封端的有机聚硅氧烷，即具有主要由重复（3,3,3-三氟丙基）甲基硅氧烷单元并用三有机甲硅烷氧基封端的主链的有机聚硅氧烷通过共聚三（3,3,3-三氟丙基）三甲基环 - 三硅氧烷与硅烷醇封端的有机聚硅氧烷在烷基锂或硅烷醇锂催化剂的存在下形成硅烷醇封端共聚物，并相对于催化剂加入过量的三烷基甲硅烷基三氟甲磺酸酯或强酸和用于进行封端的六有机二硅氮烷和中和。

6. 发明申请

US20110251311A1 ADDITION CURABLE SELF-ADHESIVE SILICONE RUBBER COMPOSITION 有权
标题翻译：添加可固化自粘硅橡胶组合物
公开(公告)号：US20110251311A1
公开(公告)日：2011-10-13
申请号：US13079248
申请日：2011-04-04
申请人： Nobu KATO , Noriyuki Meguriya , Toshio Yamazaki
发明人： Nobu KATO , Noriyuki Meguriya , Toshio Yamazaki
IPC分类号： C08L83/05 , C08K5/29 , C08K5/1515
CPC分类号： C08G77/38 , C08G77/12 , C08G77/20 , C08K5/5435 , C08K5/5455 , C09D183/04 , C08L83/00
摘要： An addition curable self-adhesive silicone rubber composition comprising (A) an organopolysiloxane containing at least two alkenyl groups, (B) an organohydrogenpolysiloxane containing at least three SiH groups, (C) an aromatic ring-free organohydrogenpolysiloxane containing at least two SiH groups, and (F) an addition reaction catalyst, with a SiH/alkenyl molar ratio ranging from 0.8 to 5.0, is briefly moldable and cures to various metals and organic resins.
摘要翻译：一种可加成固化的自粘性硅橡胶组合物，其包含（A）含有至少两个烯基的有机聚硅氧烷，（B）含有至少三个SiH基团的有机氢聚硅氧烷，（C）含有至少两个SiH基团的无芳族环的有机氢聚硅氧烷，和（F）SiH /烯基摩尔比范围为0.8至5.0的加成反应催化剂，可简单地模塑并固化成各种金属和有机树脂。

7. 发明授权

US07205645B2 Wiring board, semiconductor device, and method of manufacturing wiring board 有权
标题翻译：接线板，半导体器件及制造布线板的方法
公开(公告)号：US07205645B2
公开(公告)日：2007-04-17
申请号：US10203652
申请日：2001-02-21
申请人： Hidehiro Nakamura , Tetsuya Enomoto , Toshio Yamazaki , Hiroshi Kawazoe
发明人： Hidehiro Nakamura , Tetsuya Enomoto , Toshio Yamazaki , Hiroshi Kawazoe
IPC分类号： H01L23/02 , H01L23/48 , H01L23/52
CPC分类号： H01L21/568 , H01L21/4846 , H01L21/486 , H01L21/6835 , H01L23/3121 , H01L23/498 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L25/0657 , H01L2224/05599 , H01L2224/16225 , H01L2224/16238 , H01L2224/32225 , H01L2224/48091 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01019 , H01L2924/01057 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/07802 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H05K3/4007 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A wiring substrate (1) comprises an insulating base (10) with connection holes (11), buried conductors (12) provided in the connection holes (11) without reaching a rear surface of the insulating base (10), and wiring layers 14 connected to the buried conductors (12). The buried conductors (12) thicken the wiring layers (14), and can form aligning parts (110) on the rear surface of the connection holes (11) to be used for three-dimensional mounting structure. Each wiring layer (14) includes thin terminals (14A), wirings (14B) and thick electrodes (14C). Not only the terminals (14A) and wirings (14B) but also the buried conductors (12) are raised by the same manufacturing process. A semiconductor element (2) is attached to the electrodes (14C) of the wiring substrate (1).
摘要翻译：布线基板（1）包括具有连接孔（11）的绝缘基座（10），设置在连接孔（11）中的埋入导体（12），而不到达绝缘基座（10）的后表面，并且布线层14 连接到埋地导体（12）。掩埋导体（12）使布线层（14）变厚，并且可以在用于三维安装结构的连接孔（11）的后表面上形成对准部分（110）。每个布线层（14）包括薄端子（14A），布线（14B）和厚电极（14C）。不仅端子（14A）和布线（14B）以及埋地导体（12）都通过相同的制造工艺升高。半导体元件（2）附着到布线基板（1）的电极（14C）上。

8. 发明授权

US06746897B2 Fabrication process of semiconductor package and semiconductor package 失效
公开(公告)号：US06746897B2
公开(公告)日：2004-06-08
申请号：US10008616
申请日：2001-10-23
申请人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
发明人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
IPC分类号： H01L2144
CPC分类号： H01L21/568 , H01L21/4803 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2221/68377 , H01L2224/16237 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/83001 , H01L2224/83102 , H01L2224/8319 , H01L2224/83385 , H01L2224/8381 , H01L2224/8385 , H01L2224/85001 , H01L2224/92125 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15183 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/203 , H01L2924/351 , H05K3/20 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2924/0002
摘要： A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.

9. 发明授权

US5786434A Water-absorptive soft contact lens material and contact lens made thereof 失效
标题翻译：吸水软性隐形眼镜材料及其隐形眼镜
公开(公告)号：US5786434A
公开(公告)日：1998-07-28
申请号：US709691
申请日：1996-09-10
申请人： Ichiro Ando , Toru Kawaguchi , Shoji Ichinohe , Toshio Yamazaki
发明人： Ichiro Ando , Toru Kawaguchi , Shoji Ichinohe , Toshio Yamazaki
IPC分类号： G02C7/04 , C08F20/52 , C08F30/08 , C08F220/56 , C08F226/06 , C08F230/08 , G02B1/04 , C08F220/18
CPC分类号： C08F230/08 , G02B1/043
摘要： A water-absorptive soft contact lens material having a high transparency, an excellent flexibility, a high oxygen permeability independent of water content, a high mechanical strength and an adequate hardness, which comprises a copolymer prepared by the polymerization of a monomer mixture comprising an N,N-dialkyl acrylamide or methacrylamide, an N-vinyllactam and a bis(silicon-containing alkyl) fumarate in a specific ratio, and which provides water-absorptive soft contact lenses having excellent properties such as high transparency and high oxygen permeability.
摘要翻译：一种具有高透明度，优异的柔韧性，与水含量无关的高透氧性，高机械强度和足够硬度的吸水软性隐形眼镜材料，其包含通过将包含N的单体混合物聚合制备的共聚物，N-二烷基丙烯酰胺或甲基丙烯酰胺，N-乙烯基内酰胺和具有比例的双（含硅烷基）富马酸酯，并且提供具有优异性能例如高透明度和高透氧性的吸水软性隐形眼镜。

10. 发明授权

US5777032A Ocular lens and a method for its production 失效
标题翻译：眼镜及其制作方法
公开(公告)号：US5777032A
公开(公告)日：1998-07-07
申请号：US805575
申请日：1997-02-25
申请人： Yasuhiro Yokoyama , Yuriko Watanabe , Sadayasu Tanikawa , Shoji Ichinohe , Toshio Yamazaki
发明人： Yasuhiro Yokoyama , Yuriko Watanabe , Sadayasu Tanikawa , Shoji Ichinohe , Toshio Yamazaki
IPC分类号： C08J7/12 , G02B1/04 , C08F8/30
CPC分类号： C08J7/12 , G02B1/043 , C08J2300/104
摘要： An ocular lens obtained by reacting a hydroxyl group-containing polymer shaped to have an ocular lens shape, with a silicon-containing compound of the formula (I): O.dbd.C.dbd.N--R.sup.1 --Si.sub.n O.sub.n-1 (CH.sub.3).sub.2n+1 (I) wherein R.sup.1 is a C.sub.1-6 linear or branched alkylene group, and n is an integer of from 1 to 15.
摘要翻译：通过使具有眼透镜形状的含羟基的聚合物与式（I）的含硅化合物反应获得的眼晶状体：O = C = N-R1-SinOn-1（CH3）2n + 1 （I）其中R1为C1-6直链或支链亚烷基，n为1〜15的整数。

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