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1. 发明申请

US20100117530A1 LIGHT-EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：发光二极管装置及其制造方法
公开(公告)号：US20100117530A1
公开(公告)日：2010-05-13
申请号：US12267872
申请日：2008-11-10
申请人： Tzu-Han LIN , Tzy-Ying LIN , Jui-Ping WENG , Wei-Hung Kang
发明人： Tzu-Han LIN , Tzy-Ying LIN , Jui-Ping WENG , Wei-Hung Kang
IPC分类号： H01J1/62 , H01L21/00
CPC分类号： H01L33/507 , H01L24/24 , H01L24/97 , H01L33/486 , H01L33/62 , H01L2224/48227 , H01L2924/10253 , H01L2924/12036 , H01L2924/12041 , H01L2933/0041 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting diode (LED) device is disclosed. The LED device includes a semiconductor substrate with a planar top surface, a light-emitting diode (LED) chip disposed over the top surface of the semiconductor substrate, at least two isolated outer wiring layers formed through the semiconductor substrate and electrically connected to the light-emitting diode chip, serving as input terminals, a transparent encapsulating layer with a substantially planar top surface formed over the semiconductor substrate, capping the LED chip and the at least two isolated outer wiring layers, and a lens module adhered to the substantially planar top surface of the transparent encapsulating layer to cap the light-emitting diode chip. In one embodiment, the lens module includes a fluorescent layer and a lens covering or covered by the fluorescent layer.
摘要翻译：公开了一种发光二极管（LED）装置。 LED装置包括：具有平面顶面的半导体基板，设置在半导体基板的上表面上的发光二极管（LED）芯片，至少两个隔离的外部布线层，形成在半导体基板上并电连接到该光用作输入端子的透明封装层，形成在所述半导体衬底上方的基本上平坦的顶表面，对所述LED芯片和所述至少两个隔离的外部布线层进行封盖;以及透镜模块，其粘附到所述基本平坦的顶部透明封装层的表面覆盖发光二极管芯片。在一个实施例中，透镜模块包括荧光层和覆盖或被荧光层覆盖的透镜。

2. 发明授权

US07928655B2 Light-emitting diode device and method for fabricating the same 有权
标题翻译：发光二极管装置及其制造方法
公开(公告)号：US07928655B2
公开(公告)日：2011-04-19
申请号：US12267872
申请日：2008-11-10
申请人： Tzu-Han Lin , Tzy-Ying Lin , Jui-Ping Weng , Wei-Hung Kang
发明人： Tzu-Han Lin , Tzy-Ying Lin , Jui-Ping Weng , Wei-Hung Kang
IPC分类号： H05B33/04
CPC分类号： H01L33/507 , H01L24/24 , H01L24/97 , H01L33/486 , H01L33/62 , H01L2224/48227 , H01L2924/10253 , H01L2924/12036 , H01L2924/12041 , H01L2933/0041 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting diode (LED) device is disclosed. The LED device includes a semiconductor substrate with a planar top surface, a light-emitting diode (LED) chip disposed over the top surface of the semiconductor substrate, at least two isolated outer wiring layers formed through the semiconductor substrate and electrically connected to the light-emitting diode chip, serving as input terminals, a transparent encapsulating layer with a substantially planar top surface formed over the semiconductor substrate, capping the LED chip and the at least two isolated outer wiring layers, and a lens module adhered to the substantially planar top surface of the transparent encapsulating layer to cap the light-emitting diode chip. In one embodiment, the lens module includes a fluorescent layer and a lens covering or covered by the fluorescent layer.
摘要翻译：公开了一种发光二极管（LED）装置。 LED装置包括：具有平面顶面的半导体基板，设置在半导体基板的上表面上的发光二极管（LED）芯片，至少两个隔离的外部布线层，形成在半导体基板上并电连接到该光用作输入端子的透明封装层，形成在所述半导体衬底上方的基本上平坦的顶表面，对所述LED芯片和所述至少两个隔离的外部布线层进行封盖;以及透镜模块，其粘附到所述基本平坦的顶部透明封装层的表面覆盖发光二极管芯片。在一个实施例中，透镜模块包括荧光层和覆盖或被荧光层覆盖的透镜。

3. 发明申请

US20100252845A1 WHITE-LIGHT LIGHT EMITTING DIODE CHIPS AND FABRICATION METHODS THEREOF 有权
标题翻译：白光发光二极管灯及其制造方法
公开(公告)号：US20100252845A1
公开(公告)日：2010-10-07
申请号：US12417412
申请日：2009-04-02
申请人： Chun-Chi Lin , Tzu-Han Lin , Wei-Hung Kang
发明人： Chun-Chi Lin , Tzu-Han Lin , Wei-Hung Kang
IPC分类号： H01L33/00 , H01L21/78
CPC分类号： H01L33/508
摘要： A white-light LED chip and a fabrication method thereof are provided. The white-light LED chip comprises a blue-light LED chip and a phosphor layer directly disposed on a top surface of the blue-light LED chip. The method comprises providing a plurality of blue-light LED chips attached to a substrate, wherein at least one contact pad is formed on the top surface of each blue-light LED chip. A protective layer is formed on the contact pad. A phosphor layer is formed on the top surface of the blue-light LED chip by a molding process, exposing the contact pad. Finally, the protective layer and the substrate are removed from the blue-light LED chip to form a white-light LED chip.
摘要翻译：提供了一种白光LED芯片及其制造方法。白光LED芯片包括蓝光LED芯片和直接设置在蓝光LED芯片的顶表面上的荧光体层。该方法包括提供附着在基板上的多个蓝光LED芯片，其中至少一个接触焊盘形成在每个蓝光LED芯片的顶表面上。在接触垫上形成保护层。通过成型工艺在蓝光LED芯片的顶表面上形成荧光体层，露出接触垫。最后，从蓝光LED芯片去除保护层和基板，以形成白光LED芯片。

4. 发明授权

US07994531B2 White-light light emitting diode chips and fabrication methods thereof 有权
标题翻译：白光发光二极管芯片及其制造方法
公开(公告)号：US07994531B2
公开(公告)日：2011-08-09
申请号：US12417412
申请日：2009-04-02
申请人： Chun-Chi Lin , Tzu-Han Lin , Wei-Hung Kang
发明人： Chun-Chi Lin , Tzu-Han Lin , Wei-Hung Kang
IPC分类号： H01L33/00
CPC分类号： H01L33/508
摘要： A white-light LED chip and a fabrication method thereof are provided. The white-light LED chip comprises a blue-light LED chip and a phosphor layer directly disposed on a top surface of the blue-light LED chip. The method comprises providing a plurality of blue-light LED chips attached to a substrate, wherein at least one contact pad is formed on the top surface of each blue-light LED chip. A protective layer is formed on the contact pad. A phosphor layer is formed on the top surface of the blue-light LED chip by a molding process, exposing the contact pad. Finally, the protective layer and the substrate are removed from the blue-light LED chip to form a white-light LED chip.
摘要翻译：提供了一种白光LED芯片及其制造方法。白光LED芯片包括蓝光LED芯片和直接设置在蓝光LED芯片的顶表面上的荧光体层。该方法包括提供附着在基板上的多个蓝光LED芯片，其中至少一个接触焊盘形成在每个蓝光LED芯片的顶表面上。在接触垫上形成保护层。通过成型工艺在蓝光LED芯片的顶表面上形成荧光体层，露出接触垫。最后，从蓝光LED芯片去除保护层和基板，以形成白光LED芯片。

5. 发明授权

US07920328B2 Lens module and a method for fabricating the same 有权
标题翻译：透镜模块及其制造方法
公开(公告)号：US07920328B2
公开(公告)日：2011-04-05
申请号：US12039257
申请日：2008-02-28
申请人： Wei-Hung Kang , Chia-Yang Chang , Jung-Jung Kuo , Yu-Hui Lee
发明人： Wei-Hung Kang , Chia-Yang Chang , Jung-Jung Kuo , Yu-Hui Lee
IPC分类号： G02B27/10 , G02B7/02
CPC分类号： H01L27/14618 , B29D11/00375 , B29D11/00413 , H01L2924/0002 , H01L2924/00
摘要： A lens module and a method for fabricating the same are disclosed. The module comprises a substrate and a lens structure. The substrate comprises a through-hole therein. The lens structure is embedded in the through-hole.
摘要翻译：公开了一种透镜模块及其制造方法。该模块包括基底和透镜结构。基板在其中包括通孔。透镜结构嵌入通孔中。

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