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    • 2. 发明申请
    • BONE REPAIR OR AUGMENTATION DEVICE
    • 骨修复或修复装置
    • US20100234966A1
    • 2010-09-16
    • US12301995
    • 2007-05-24
    • Wei Jen Lo
    • Wei Jen Lo
    • A61F2/28A61K35/12A61K38/18A61K38/43A61P19/00A61F2/00B29C43/02
    • A61L27/56A61F2/3094A61F2/44A61F2/4455A61F2002/2817A61F2002/30032A61F2002/30062A61F2002/30065A61F2002/30225A61F2002/30677A61F2002/30784A61F2002/3092A61F2210/0004A61F2210/0071A61F2230/0069A61F2250/003A61F2310/00293A61F2310/00329A61L27/425A61L27/427A61L2430/02
    • Bone repair or augmentation devices comprising a porous body (2) comprising pores (4), the porous body comprising a portion with a reinforcing agent within the pores of that portion of the porous body (8). Methods of making bone augmentation or repair devices are also provided, the devices having a perimeter and an internal region, the method comprising: (a) mixing a biodegradable reinforcing agent with a biomaterial selected from the group comprising ceramic materials and bioactive glasses to form a mixture; (b) heating the mixture to above the softening point of the reinforcing agent; (c) moulding the mixture around at least a portion of the internal region. A further method is a device having a depth, width, a perimeter and internal region, the method comprising: (i) forming a porous body, the porous body comprising a ceramic material having a plurality of pores (ii) placing a mask on at least the upper surface of the porous body to cover some of the pores and to leave some of the pores exposed (iii) at least partially filling the exposed pores with a reinforcing agent and (iv) removing the mask from at least the upper surface of the porous body to expose pores located under the mask.
    • 包括多孔体(2)的骨修复或增强装置包括孔(4),所述多孔体包括在所述多孔体(8)的该部分的孔内的具有增强剂的部分。 还提供了制造骨增强或修复装置的方法,所述装置具有周边和内部区域,所述方法包括:(a)将可生物降解的增强剂与选自陶瓷材料和生物活性眼镜的生物材料混合以形成 混合物; (b)将混合物加热到增强剂的软化点以上; (c)在内部区域的至少一部分周围模制混合物。 另一种方法是具有深度,宽度,周边和内部区域的装置,所述方法包括:(i)形成多孔体,所述多孔体包括具有多个孔的陶瓷材料(ii)将掩模放置在 至少多孔体的上表面以覆盖一些孔隙并且留下暴露的一些孔(iii)至少部分地用增强剂填充暴露的孔,并且(iv)从至少上面的表面去除掩模 该多孔体暴露位于掩模下面的孔。