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    • 5. 发明授权
    • Airflow barriers for efficient cooling of memory modules
    • 用于高效冷却内存模块的气流屏障
    • US08102651B2
    • 2012-01-24
    • US12572301
    • 2009-10-02
    • Patrick M. BlandVinod KamathJimmy G. Foster, Sr.Ivan R. Zapata
    • Patrick M. BlandVinod KamathJimmy G. Foster, Sr.Ivan R. Zapata
    • H05K7/20
    • G06F1/20
    • Method and apparatus providing airflow through a chassis including an upstream column of memory modules and a downstream column of memory modules. The airflow is divided into first and second separate airflow streams extending from an upstream end of the upstream column to a downstream end of the downstream column. The first airflow stream is guided into contact with a single memory module operably-installed in the upstream column and to avoid contact with any memory module in the downstream column. The second airflow stream is guided to avoid contact with any memory module in the upstream column and into contact with a single memory module operably-installed in the downstream column. The improved cooling enables the extended use of a single memory module per channel, even though the thermal load on such a memory module is greater. The result is an overall savings of power, since cooling requirements no longer dictate the installation of additional memory modules per channel in order to share and distribute the thermal load.
    • 提供通过包括存储器模块的上游列和存储器模块的下游列的底盘的气流的方法和装置。 气流被分为从上游塔的上游端延伸到下游塔的下游端的第一和第二分开的气流。 第一气流引导与可操作地安装在上游塔中的单个存储器模块接触,并且避免与下游塔中的任何存储器模块接触。 引导第二气流流以避免与上游塔中的任何存储器模块接触并与可操作地安装在下游塔中的单个存储器模块接触。 即使在这样的存储器模块上的热负载较大,改进的冷却也能够每通道扩展使用单个存储器模块。 结果是总体上节省了电力,因为冷却要求不再要求每个通道安装额外的内存模块,以便共享和分配热负载。
    • 6. 发明申请
    • Airflow Barriers for Efficient Cooling of Memory Modules
    • 用于高效冷却内存模块的气流障碍
    • US20110080700A1
    • 2011-04-07
    • US12572301
    • 2009-10-02
    • Patrick M. BlandVinod KamathJimmy G. Foster, SR.Ivan R. Zapata
    • Patrick M. BlandVinod KamathJimmy G. Foster, SR.Ivan R. Zapata
    • G06F1/20
    • G06F1/20
    • Method and apparatus providing airflow through a chassis including an upstream column of memory modules and a downstream column of memory modules. The airflow is divided into first and second separate airflow streams extending from an upstream end of the upstream column to a downstream end of the downstream column. The first airflow stream is guided into contact with a single memory module operably-installed in the upstream column and to avoid contact with any memory module in the downstream column. The second airflow stream is guided to avoid contact with any memory module in the upstream column and into contact with a single memory module operably-installed in the downstream column. The improved cooling enables the extended use of a single memory module per channel, even though the thermal load on such a memory module is greater. The result is an overall savings of power, since cooling requirements no longer dictate the installation of additional memory modules per channel in order to share and distribute the thermal load.
    • 提供通过包括存储器模块的上游列和存储器模块的下游列的底盘的气流的方法和装置。 气流被分为从上游塔的上游端延伸到下游塔的下游端的第一和第二分开的气流。 第一气流引导与可操作地安装在上游塔中的单个存储器模块接触,并且避免与下游塔中的任何存储器模块接触。 引导第二气流流以避免与上游塔中的任何存储器模块接触并与可操作地安装在下游塔中的单个存储器模块接触。 即使在这样的存储器模块上的热负载较大,改进的冷却也能够每通道扩展使用单个存储器模块。 结果是总体上节省了电力,因为冷却要求不再要求每个通道安装额外的内存模块,以便共享和分配热负载。