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    • 2. 发明申请
    • ELECTRONIC FABRIC
    • 电子织物
    • US20160320037A1
    • 2016-11-03
    • US15139648
    • 2016-04-27
    • William S. WongJohn S. Morreale
    • William S. WongJohn S. Morreale
    • F21V23/00F21V33/00F21V3/00
    • F21V33/0008A41D1/005A41D27/085F21Y2107/70F21Y2115/10H05K1/038H05K1/114H05K1/189H05K2201/10106
    • An electronic fabric can include a first fabric layer, a second fabric layer, and a plurality of electronic devices. The first fabric layer can include a first set of conductive wires extending longitudinally in a first direction. The second fabric layer can define a plurality of apertures, can include a second set of conductive wires extending longitudinally in a second direction, and can be coupled to the first fabric layer such that each of the first set of conductive wires is arranged at a location of one of the plurality of apertures. Each electronic device can have a first terminal electrically coupled with one of the first set of conductive wires and a second terminal electrically coupled to one of the second set of conductive wires. The first terminal can be electrically coupled with the one of the first set of conductive wires through one of the plurality of apertures.
    • 电子织物可以包括第一织物层,第二织物层和多个电子器件。 第一织物层可以包括沿第一方向纵向延伸的第一组导线。 第二织物层可以限定多个孔,可以包括沿第二方向纵向延伸的第二组导线,并且可以耦合到第一织物层,使得第一组导线中的每一个布置在位置 的多个孔中的一个。 每个电子设备可以具有与第一组导线中的一个电耦合的第一端子和电耦合到第二组导线之一的第二端子。 第一端子可以通过多个孔中的一个与第一组导线中的一个电耦合。
    • 3. 发明授权
    • Geometry and design for conformal electronics
    • 适形电子学的几何和设计
    • US08492876B2
    • 2013-07-23
    • US12253390
    • 2008-10-17
    • William S. WongBrent S. KrusorRobert A. Street
    • William S. WongBrent S. KrusorRobert A. Street
    • H01L29/06
    • H05K3/0044G02F2201/56H01L27/14603H01L27/14692H01L27/14812H01L29/78603
    • A method of forming a three-dimensional electronic device includes forming at least one electronic device on a two-dimensional, flexible substrate, the electronic device being formed according to a three-dimensional structure, cutting the two-dimensional, flexible substrate, the cuts being located to allow the two-dimensional substrate to be shaped, the cuts having at least one stress relief feature, and shaping the two-dimensional, flexible substrate to form the three-dimensional structure, the stress relief features arranged to alleviate stress in the three-dimensional structure. A method of forming a three-dimensional electronic device includes forming at least one electronic device on a two-dimensional, flexible substrate, the electronic device being formed according to a three-dimensional structure, cutting the two-dimensional, flexible substrate, the cuts being arranged to as to increase a radius of curvature to meet a stress relief parameter when the substrate is shaped, and shaping the two-dimensional, flexible substrate to form the three-dimensional structure. A three-dimensional electronic device having an electronic device formed on a flexible substrate, the flexible substrate formed into a three-dimensional structure, wedged-shaped portions removed from the substrate to allow the substrate to be formed into the three-dimensional structure, and a stress relief feature arranged adjacent to the wedge-shaped portions.
    • 形成三维电子器件的方法包括在二维柔性基板上形成至少一个电子器件,该电子器件根据三维结构形成,切割二维柔性基片,切割 被设置成允许二维基底成形,切口具有至少一个应力消除特征,并且成形二维柔性基底以形成三维结构,应力消除特征被设置为减轻二维基底中的应力 三维结构。 形成三维电子器件的方法包括在二维柔性基板上形成至少一个电子器件,该电子器件根据三维结构形成,切割二维柔性基片,切割 被布置成当基底成形时增加曲率半径以满足应力消除参数,并且将二维柔性基底成形以形成三维结构。 一种具有形成在柔性基板上的电子器件的三维电子器件,形成为三维结构的柔性衬底,从衬底移除楔形部分以使衬底形成三维结构;以及 紧邻楔形部分布置的应力消除特征。