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1. 发明申请

US20160134289A1 POWER MANAGEMENT SYSTEM FOR INTEGRATED CIRCUITS 有权
标题翻译：集成电路电源管理系统
公开(公告)号：US20160134289A1
公开(公告)日：2016-05-12
申请号：US14539697
申请日：2014-11-12
申请人： Xilinx, Inc.
发明人： Austin H. Lesea
IPC分类号： H03K19/177 , H03K19/0175
CPC分类号： H03K19/17772 , H03K19/00384 , H03K19/017509 , H03K19/17784
摘要： An apparatus includes a plurality of programmable hardware resources and an analog-to-digital converter (ADC) disposed on an IC die. The ADC is configured to quantize values of one or more analog parameters of the IC die. The apparatus also includes a configuration control circuit configured to program the programmable hardware resources in response to a set of configuration data. The programmable hardware resources are programmed to implement a set of circuits specified by the configuration data and to connect the ADC to respective nodes of the IC die for sampling the analog parameters. The apparatus also includes an interface circuit coupled to the ADC and configured to generate a control signal based on quantized values of the one or more analog parameters from the ADC. The interface circuit outputs the control signal to a power supply coupled to a power terminal of the IC die.
摘要翻译：一种装置包括多个可编程硬件资源和设置在IC芯片上的模数转换器（ADC）。 ADC被配置为量化IC芯片的一个或多个模拟参数的值。该装置还包括配置控制电路，配置为响应于一组配置数据对可编程硬件资源进行编程。可编程硬件资源被编程为实现由配置数据指定的一组电路，并将ADC连接到IC芯片的相应节点，以对模拟参数进行采样。该装置还包括耦合到ADC并被配置为基于来自ADC的一个或多个模拟参数的量化值产生控制信号的接口电路。接口电路将控制信号输出到耦合到IC芯片的电源端子的电源。

2. 发明申请

US20150348915A1 INTEGRATED CIRCUIT PACKAGE WITH THERMAL NEUTRON SHIELDING 有权
标题翻译：集成电路封装与热中子屏蔽
公开(公告)号：US20150348915A1
公开(公告)日：2015-12-03
申请号：US14257853
申请日：2014-04-21
申请人： Xilinx, Inc.
发明人： Pierre Maillard , Jeffrey Barton , Austin H. Lesea
IPC分类号： H01L23/552
CPC分类号： H01L23/552 , H01L21/563 , H01L23/3128 , H01L25/0655 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/16152 , H01L2924/00
摘要： A semiconductor package with thermal neutron shielding is disclosed. The semiconductor package includes a substrate and an integrated circuit die disposed on the substrate. The semiconductor package also has a thermal neutron shield including a shielding material. The shielding material includes boron-10 and is configured to inhibit a portion of thermal neutrons that encounter the thermal neutron shield from passing through the thermal neutron shield.
摘要翻译：公开了一种具有热中子屏蔽的半导体封装。半导体封装包括衬底和设置在衬底上的集成电路管芯。半导体封装还具有包括屏蔽材料的热中子屏蔽。屏蔽材料包括硼-10并且被配置为抑制遇到热中子屏蔽的热中子的一部分通过热中子屏蔽。

3. 发明授权

US10573598B2 Integration of a programmable device and a processing system in an integrated circuit package 有权
公开(公告)号：US10573598B2
公开(公告)日：2020-02-25
申请号：US15719288
申请日：2017-09-28
申请人： Xilinx, Inc.
发明人： Austin H. Lesea , Sundararajarao Mohan , Stephen M. Trimberger
IPC分类号： G06F15/78 , H01L23/538 , H01L23/50
摘要： An example integrated circuit (IC) package includes: a processing system and a programmable IC disposed on a substrate, the processing system coupled to the programmable IC through interconnect of the substrate; the processing system including components coupled to a ring interconnect, the components including a processor and an interface controller. The programmable IC includes: an interface endpoint coupled to the interface controller through the interconnect; and at least one peripheral coupled to the interface endpoint and configured for communication with the ring interconnect of the processing system through the interconnect endpoint and the interface controller.

4. 发明授权

US10476598B1 Optical communication circuits 有权
公开(公告)号：US10476598B1
公开(公告)日：2019-11-12
申请号：US15219005
申请日：2016-07-25
申请人： Xilinx, Inc.
发明人： Austin H. Lesea , Stephen M. Trimberger
IPC分类号： H01L25/00 , H04B10/50 , H04B10/508
摘要： Various apparatuses, circuits, systems, and methods for optical communication are disclosed. In some implementations, an apparatus includes a package substrate and f first interposer mounted on the package substrate. The apparatus also includes a logic circuit and an optical interface circuit connected to the logic circuit via the first interposer. One of the optical interface circuit or the logic circuit is mounted on the first interposer. The optical interface circuit includes a driver circuit configured to receive electronic data signals from the logic circuit. The optical interface circuit also includes an optical transmitter circuit coupled to the driver circuit and configured to output optical data signals encoding the electronic data signals.

5. 发明授权

US10282326B1 Active interrupt handler performance monitoring in microprocessors 有权
公开(公告)号：US10282326B1
公开(公告)日：2019-05-07
申请号：US14527659
申请日：2014-10-29
申请人： Xilinx, Inc.
发明人： Yi-Hua E. Yang , Patrick Lysaght , Austin H. Lesea , Graham F. Schelle , Paul R. Schumacher
IPC分类号： G06F13/24 , G06F13/26
摘要： An integrated circuit is provided for obtaining interrupt performance metrics. The integrated circuit includes a microprocessor executing an interrupt service routing monitoring framework that includes an interrupt handler and an application programming interface. The interrupt handler executes in response to a trigger condition and obtains timing data that includes at least one sample of a value of a timing logic according to a sampling schedule. The API exposes interrupt configuration functionality for registering the interrupt handler with a supervisory program and for configuring the interrupt handler to obtain the timing data.

6. 发明授权

US09933639B1 Electro-absorption modulation with an integrated photodetector 有权
公开(公告)号：US09933639B1
公开(公告)日：2018-04-03
申请号：US15346521
申请日：2016-11-08
申请人： Xilinx, Inc.
发明人： Sen Lin , Kun-Yung Chang , Austin H. Lesea
IPC分类号： G02F1/035 , G02F1/025 , H04B10/54 , H04B10/80 , G02F1/01 , G02F1/015
CPC分类号： G02F1/025 , G02F1/0147 , G02F2001/0155 , G02F2201/58 , H04B10/505 , H04B10/541 , H04B10/801 , H04B10/807
摘要： Systems, and related methods, relating generally to electro-absorption modulation are described. In a system therefor, there is a waveguide. A photodetector is configured with respect to the waveguide for detecting luminous intensity of an optical signal. An electro-absorption modulator is configured with respect to the waveguide for electro-absorption modulation of the optical signal. An integrated heating element is located alongside and spaced apart from both the photodetector and the electro-absorption modulator. the integrated heating element is configured for controllably heating the photodetector and the electro-absorption modulator.

7. 发明授权

US09847323B1 Integrated circuit package having voltage regulation circuitry 有权
公开(公告)号：US09847323B1
公开(公告)日：2017-12-19
申请号：US14830372
申请日：2015-08-19
申请人： Xilinx, Inc.
发明人： Austin H. Lesea
IPC分类号： H05K7/10 , H05K7/12 , H01L25/18 , G06F17/50 , H01L23/498 , H01L23/50 , H01L23/00 , H05K1/18
CPC分类号： H01L25/18 , G06F17/5054 , H01L23/49816 , H01L23/49822 , H01L23/49894 , H01L23/50 , H01L24/17 , H01L2224/16227 , H01L2924/1427 , H01L2924/1431 , H05K1/0262
摘要： In an example, an IC package includes a package substrate including a plurality of bumps configured for coupling to a printed circuit board, the package substrate including a core disposed between a plurality of top-side conductive layers and a plurality of bottom-side conductive layers. The IC package further includes an IC die coupled to the package substrate and disposed on top of the plurality of top-side conductive layers. The IC die further includes a voltage regulator IC die disposed on the package substrate adjacent to the IC die, the voltage regulator IC die being coupled to the IC die using two of four top-most layers of the plurality of top-side conductive layers nearest the IC die.

8. 发明授权

US09525423B1 Power distribution network IP block 有权
标题翻译：配电网IP块
公开(公告)号：US09525423B1
公开(公告)日：2016-12-20
申请号：US14862962
申请日：2015-09-23
申请人： Xilinx, Inc.
发明人： Austin H. Lesea
IPC分类号： H03K19/177 , G06F1/26 , G01R31/317 , G01R31/3185
CPC分类号： H03K19/17772 , G01R31/318513 , G01R31/318516 , H03K19/17764 , H03K19/17784
摘要： A device comprises a semiconductor substrate, a programmable logic device on the semiconductor substrate, a power distribution network comprising at least one voltage regulator on the semiconductor substrate, and a power management bus for communication between the at least one voltage regulator and the programmable logic device. The programmable logic device comprises a processing module configured to perform a diagnostic analysis of the power distribution network.
摘要翻译：一种器件包括半导体衬底，半导体衬底上的可编程逻辑器件，包括半导体衬底上的至少一个电压调节器的配电网络和用于在至少一个电压调节器与可编程逻辑器件之间进行通信的电力管理总线。可编程逻辑器件包括被配置为执行配电网络的诊断分析的处理模块。

9. 发明申请

US20190096813A1 INTEGRATION OF A PROGRAMMABLE DEVICE AND A PROCESSING SYSTEM IN AN INTEGRATED CIRCUIT PACKAGE 审中-公开
公开(公告)号：US20190096813A1
公开(公告)日：2019-03-28
申请号：US15719288
申请日：2017-09-28
申请人： Xilinx, Inc.
发明人： Austin H. Lesea , Sundararajarao Mohan , Stephen M. Trimberger
IPC分类号： H01L23/538 , H01L23/50
CPC分类号： H01L23/5386 , G06F15/7892 , H01L23/50
摘要： An example integrated circuit (IC) package includes: a processing system and a programmable IC disposed on a substrate, the processing system coupled to the programmable IC through interconnect of the substrate; the processing system including components coupled to a ring interconnect, the components including a processor and an interface controller. The programmable IC includes: an interface endpoint coupled to the interface controller through the interconnect; and at least one peripheral coupled to the interface endpoint and configured for communication with the ring interconnect of the processing system through the interconnect endpoint and the interface controller.

10. 发明授权

US10054806B2 Segmented electro-absorption modulation 有权
公开(公告)号：US10054806B2
公开(公告)日：2018-08-21
申请号：US15346474
申请日：2016-11-08
申请人： Xilinx, Inc.
发明人： Sen Lin , Kun-Yung Chang , Austin H. Lesea
IPC分类号： H04B10/04 , G02F1/025 , H04B10/516 , G02F1/015
CPC分类号： G02F1/025 , G02F2001/0157 , G02F2201/122 , G02F2201/16 , G02F2201/58 , H04B10/516
摘要： Systems and methods therefor relating generally to electro-absorption modulation are disclosed. In a system thereof, a waveguide is for propagating an optical signal. A segmented electro-absorption modulator (“SEAM”) includes: a segmented anode having at least two anode segments spaced apart from one another alongside a first side of the waveguide; and a segmented cathode having at least two cathode segments spaced apart from one another alongside a second side of the waveguide corresponding to the at least two anode segments.

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