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    • 10. 发明授权
    • Efficient fabrication process for dual well type structures
    • 双井型结构的高效制造工艺
    • US06396100B2
    • 2002-05-28
    • US09901035
    • 2001-07-10
    • Mark A. Helm
    • Mark A. Helm
    • H01L29788
    • H01L21/823842H01L21/823857H01L21/823892
    • An efficient method for fabricating dual well type structures uses the same number of masks used in single well type structure fabrication. In a preferred embodiment, the current invention allows low voltage and high voltage n-channel transistors and low voltage and high voltage p-channel transistors to be formed in a single substrate. One mask is used for forming a diffusion well, a second mask for both forming a retrograde well and doping the well to achieve an intermediate threshold voltage in that well, and a third mask for both differentiating the gate oxides for the low voltage devices and doping the threshold voltages to achieve the final threshold voltages.
    • 用于制造双井型结构的有效方法使用在单井型结构制造中使用的相同数量的掩模。 在优选实施例中,本发明允许在单个衬底中形成低电压和高电压n沟道晶体管,并且低电压和高压p沟道晶体管形成。 用于形成扩散阱的一个掩模,用于形成逆行阱并掺杂阱以在该阱中实现中间阈值电压的第二掩模,以及用于区分低电压器件的栅极氧化物和掺杂的第三掩模 阈值电压以达到最终阈值电压。