专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08968607B2 Paste composition for solar cell electrodes and electrode fabricated using the same 有权
标题翻译：用于太阳能电池电极的糊剂组合物和使用其制造的电极
公开(公告)号：US08968607B2
公开(公告)日：2015-03-03
申请号：US13951600
申请日：2013-07-26
申请人： Young Wook Choi , Eun Kyung Kim , Young Ki Park , Dae Seop Song
发明人： Young Wook Choi , Eun Kyung Kim , Young Ki Park , Dae Seop Song
IPC分类号： H01B1/22 , H01L31/0224 , B05D5/12
CPC分类号： H01L31/022425 , H01B1/22 , Y02E10/50
摘要： A paste composition for a solar cell electrode includes including an organic vehicle, a conductive powder, and a glass frit, the glass frit including TeO2, and a transition metal oxide component, the transitional metal oxide component including one or more of a transition metal oxide having a melting point of about 1300° C. or more.
摘要翻译：一种用于太阳能电池电极的糊剂组合物，包括有机载体，导电粉末和玻璃料，所述玻璃料包括TeO 2和过渡金属氧化物组分，所述过渡金属氧化物组分包括一种或多种过渡金属氧化物具有约1300℃以上的熔点。

2. 发明授权

US09512032B2 Glass frit, composition for solar cell electrodes including the same, and electrode fabricated using the same 有权
标题翻译：玻璃料，包含该玻璃料的太阳能电池电极组合物，以及使用其制成的电极
公开(公告)号：US09512032B2
公开(公告)日：2016-12-06
申请号：US14133763
申请日：2013-12-19
申请人： Young Wook Choi , Eun Kyung Kim , Ju Hee Kim , Young Ki Park , Dae Seop Song , Jae Ho Kim , Sang Hyun Yang
发明人： Young Wook Choi , Eun Kyung Kim , Ju Hee Kim , Young Ki Park , Dae Seop Song , Jae Ho Kim , Sang Hyun Yang
IPC分类号： C03C3/00 , C03C8/10 , C03C8/04 , C03C3/062 , C03C3/07 , C03C3/12 , C03C8/02 , C03C8/18 , H01L31/0224
CPC分类号： C03C8/10 , C03C3/062 , C03C3/07 , C03C3/122 , C03C8/02 , C03C8/04 , C03C8/18 , H01L31/022425 , H01L31/022466 , H01L31/022483 , Y02E10/50
摘要： A glass frit includes at least three metal oxides selected from the group of lead oxide, silicon oxide, tellurium oxide, bismuth oxide, zinc oxide, and tungsten oxide, wherein the glass frit exhibits a phase transition peak in the range of about 300° C. to about 600° C. on a cooling curve obtained via an TG-DTA analysis while a mixture of the glass frit and silver powder, obtained by mixing the glass frit with the silver powder in a weight ratio of 1:1, is cooled at a cooling rate of 10° C./min, after heating the mixture to 850° C. at a heating rate of 20° C./min and held there for a wait-time of 10 minutes.
摘要翻译：玻璃料包括选自氧化铅，氧化硅，氧化碲，氧化铋，氧化锌和氧化钨中的至少三种金属氧化物，其中玻璃料在约300℃的范围内显示相变峰在通过TG-DTA分析获得的冷却曲线上至约600℃，同时通过将玻璃料与银粉以1:1的重量比混合而获得的玻璃料和银粉的混合物被冷却以10℃/分钟的冷却速度，以20℃/分钟的加热速度将混合物加热至850℃，并保持10分钟的等待时间。

3. 发明授权

US5949022A Sealing structure for a single-bodied end cap of splice closure for optical cables 失效
标题翻译：用于光缆的单体端盖的密封端盖的密封结构
公开(公告)号：US5949022A
公开(公告)日：1999-09-07
申请号：US617084
申请日：1996-03-18
申请人： Young Ki Park , Yun-Won Chang
发明人： Young Ki Park , Yun-Won Chang
IPC分类号： G02B6/44 , H02G15/013 , H02G15/04
CPC分类号： H02G15/013 , G02B6/4446 , G02B6/4444
摘要： A cable splice closure assembly includes an end cap body having at least one cable passage hole therein for the passage of a cable therethrough, the end cap body defining a seal zone for retaining a sealing material and a thread zone, and a screw plug having a cable passage hole therein for the passage of a cable therethrough, the screw plug being adapted for mating engagement with the thread zone of the end cap body.
摘要翻译：电缆接头闭合组件包括端盖体，其中至少有一个电缆通道孔用于使电缆穿过其中，端盖主体限定用于保持密封材料和螺纹区域的密封区域，以及具有电缆通道孔在其中，用于使电缆穿过其中，螺塞适于与端盖主体的螺纹区域配合接合。

4. 发明申请

US20100221454A1 Methods for Preparation of High-Purity Polysilicon Rods Using a Metallic Core Means 有权
标题翻译：使用金属核心手段制备高纯度多晶硅棒的方法
公开(公告)号：US20100221454A1
公开(公告)日：2010-09-02
申请号：US12160837
申请日：2007-05-21
申请人： Hee Young Kim , Kyung Koo Yoon , Young Ki Park , Won Choon Choi , Sang Jin Moon
发明人： Hee Young Kim , Kyung Koo Yoon , Young Ki Park , Won Choon Choi , Sang Jin Moon
IPC分类号： C23C16/24 , C23C16/46
CPC分类号： C23C16/4581 , C01B33/035 , C23C16/24 , Y10T428/2913
摘要： The present invention relates to a method for preparing a polysilicon rod using a metallic core means, comprising: installing a core means in an inner space of a deposition reactor used for preparing a silicon rod, wherein the core means (C) is constituted by forming one or a plurality of separation layer(s) on the surface of a metallic core element and is connected to an electrode means (E), heating the core means (C) by supplying electricity through the electrode means (E), and supplying a reaction gas (Gf) into the inner space (Ri) for silicon deposition, thereby forming a deposition output in an outward direction on the surface of the core means (C). According to the present invention, the deposition output (D) and the core means (C) can be separated easily from the silicon rod output obtained by the process of silicon deposition, and the contamination of the deposition output caused by impurities of the metallic core element (Ca) can be minimized, thereby a high-purity silicon can be prepared in a more economic and convenient way.
摘要翻译：本发明涉及一种使用金属芯装置制备多晶硅棒的方法，包括：在用于制备硅棒的沉积反应器的内部空间中安装芯装置，其中芯装置（C）由成形金属芯体表面上的一个或多个分离层，并连接到电极装置（E），通过电极装置（E）供电来加热芯装置（C），并且将反应气体（Gf）进入用于硅沉积的内部空间（Ri）中，从而在芯装置（C）的表面上沿向外的方向形成沉积输出。根据本发明，沉积输出（D）和芯装置（C）可以容易地从通过硅沉积过程获得的硅棒输出分离，并且由金属芯的杂质引起的沉积输出的污染元素（Ca）可以最小化，从而可以以更经济和方便的方式制备高纯度硅。

5. 发明授权

US06209194B1 Apparatus for loading and unloading semiconductor device packages using servo motors 失效
标题翻译：使用伺服电机装载和卸载半导体器件封装的装置
公开(公告)号：US06209194B1
公开(公告)日：2001-04-03
申请号：US08943231
申请日：1997-10-03
申请人： Ju Il Kang , Byung Ro Kim , Sung Yeol Lee , Hyun Ho Kim , Young Ki Park
发明人： Ju Il Kang , Byung Ro Kim , Sung Yeol Lee , Hyun Ho Kim , Young Ki Park
IPC分类号： B23P1900
CPC分类号： G01R31/2893 , G01R31/2851 , G01R31/2887 , Y10T29/49137 , Y10T29/53174 , Y10T29/53178
摘要： An automatic loading and unloading apparatus using servo motors allows simultaneous loading and unloading of two or more semiconductor device packages into and from test devices. The loading and unloading apparatus has a feeding mechanism which has a feed container carrying two semiconductor device packages which have not yet been tested; a loading tool for transferring those two semiconductor device packages from the feed container to a centering position; a DC test contact tool; an insertion tool; a removal tool; and a sorting station for sorting the semiconductor device packages depending on results of a burn-in test. The tools of the apparatus are driven by the action of servo motors, thereby allowing independent movements thereof in the vertical and horizontal directions.
摘要翻译：使用伺服电动机的自动装卸装置允许将两个或多个半导体器件封装同时装入和卸载进入测试装置和从测试装置卸载。装载和卸载装置具有进给机构，其具有携带两个尚未被测试的半导体器件封装的馈送容器; 用于将这两个半导体器件封装从进料容器转移到定心位置的装载工具; DC测试接触工具; 插入工具; 移除工具; 以及根据老化测试的结果对半导体器件封装进行分类的分类站。该装置的工具由伺服电机的作用驱动，从而允许其在垂直和水平方向上的独立移动。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式