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    • 3. 发明授权
    • Light emitting diode
    • 发光二极管
    • US08796716B2
    • 2014-08-05
    • US13479233
    • 2012-05-23
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • H01L33/00
    • H01L33/24H01L33/005
    • A light emitting diode including a first semiconductor layer, an active layer, and a second semiconductor layer is provided. The first semiconductor layer includes a first surface and a second surface, and the first surface is connected to the substrate. The active layer and the second semiconductor layer are stacked on the second surface in that order, and a surface of the second semiconductor layer away from the active layer is configured as the light emitting surface. A first electrode covers the entire surface of the first semiconductor layer. A second electrode is electrically connected with the second semiconductor layer. A number of three-dimensional nano-structures are located on the surface of the first surface of the first semiconductor layer and aligned side by side, and a cross section of each of the three-dimensional nano-structure is M-shaped.
    • 提供了包括第一半导体层,有源层和第二半导体层的发光二极管。 第一半导体层包括第一表面和第二表面,并且第一表面连接到基板。 有源层和第二半导体层以该顺序堆叠在第二表面上,并且第二半导体层远离有源层的表面被配置为发光表面。 第一电极覆盖第一半导体层的整个表面。 第二电极与第二半导体层电连接。 多个三维纳米结构位于第一半导体层的第一表面的表面上并排排列,并且每个三维纳米结构的横截面为M形。
    • 4. 发明授权
    • Light emitting diode
    • 发光二极管
    • US08759858B2
    • 2014-06-24
    • US13479230
    • 2012-05-23
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • H01L33/00
    • H01L33/24H01L33/06H01L33/22
    • A light emitting diode including a substrate, a first semiconductor layer, an active layer, and a second semiconductor layer is provided. The substrate includes an epitaxial growth surface and a light emitting surface. The first semiconductor layer, the active layer and the second semiconductor layer is stacked on the epitaxial growth surface. The first semiconductor layer includes a first surface and a second surface, and the first surface is connected to the substrate. The active layer and the second semiconductor layer are stacked on the second surface in that order. A first electrode electrically is connected with the first semiconductor layer. A second electrode is electrically connected with the second semiconductor layer. A number of three-dimensional nano-structures are located on the surface of the first surface of the first semiconductor layer and aligned side by side, and a cross section of each of the three-dimensional nano-structure is M-shaped.
    • 提供了包括基板,第一半导体层,有源层和第二半导体层的发光二极管。 衬底包括外延生长表面和发光表面。 第一半导体层,有源层和第二半导体层堆叠在外延生长表面上。 第一半导体层包括第一表面和第二表面,并且第一表面连接到基板。 有源层和第二半导体层以该顺序堆叠在第二表面上。 第一电极与第一半导体层电连接。 第二电极与第二半导体层电连接。 多个三维纳米结构位于第一半导体层的第一表面的表面上并排排列,并且每个三维纳米结构的横截面为M形。
    • 5. 发明授权
    • Method for making light emitting diode
    • 制造发光二极管的方法
    • US08790940B2
    • 2014-07-29
    • US13479232
    • 2012-05-23
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • H01L21/00H01L33/00
    • H01L33/0079H01L21/0237H01L21/0242H01L21/02458H01L21/02513H01L21/0254H01L21/0262H01L21/02658H01L33/005H01L33/24
    • A method for making light emitting diode includes the following steps. A substrate is provided. A first semiconductor layer is grown on a surface of the substrate. A patterned mask layer is located on a surface of the first semiconductor layer, and the patterned mask layer includes a number of bar-shaped protruding structures, a slot is defined between each two adjacent protruding structures to expose a portion of the first semiconductor layer. The exposed first semiconductor layer is etched to form a protruding pair. A number of three-dimensional nano-structures are formed. An active layer and a second semiconductor layers are grown on the number of three-dimensional nano-structures in that order. The substrate is removed and a surface of the first semiconductor layer is exposed. A first electrode is applied to cover the exposed surface. A second electrode is electrically connected with the second semiconductor layer.
    • 制造发光二极管的方法包括以下步骤。 提供基板。 在衬底的表面上生长第一半导体层。 图案化的掩模层位于第一半导体层的表面上,并且图案化掩模层包括多个棒状突出结构,在每个两个相邻的突出结构之间限定狭缝以暴露第一半导体层的一部分。 暴露的第一半导体层被蚀刻以形成突出的一对。 形成多个三维纳米结构。 在三维纳米结构的数量上依次生长活性层和第二半导体层。 去除衬底并暴露第一半导体层的表面。 施加第一电极以覆盖暴露的表面。 第二电极与第二半导体层电连接。
    • 6. 发明授权
    • Light emitting diode with three-dimensional nano-structures
    • 具有三维纳米结构的发光二极管
    • US08629424B2
    • 2014-01-14
    • US13479227
    • 2012-05-23
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • H01L29/06
    • H01L33/24H01L33/06H01L33/20H01L33/22
    • A light emitting diode including a substrate, a first semiconductor layer, an active layer, and a second semiconductor layer is provided. The first semiconductor layer includes a first surface and a second surface, and the first surface is connected to the substrate. The active layer and the second semiconductor layer are stacked on the second surface in that order, and a surface of the second semiconductor layer away from the active layer is configured as the light emitting surface. A first electrode electrically is connected with the first semiconductor layer. A second electrode is electrically connected with the second semiconductor layer. A number of three-dimensional nano-structures are located on the surface of the first surface of the first semiconductor layer and the light emitting surface, and a cross section of each of the three-dimensional nano-structures is M-shaped.
    • 提供了包括基板,第一半导体层,有源层和第二半导体层的发光二极管。 第一半导体层包括第一表面和第二表面,并且第一表面连接到基板。 有源层和第二半导体层以该顺序堆叠在第二表面上,并且第二半导体层远离有源层的表面被配置为发光表面。 第一电极与第一半导体层电连接。 第二电极与第二半导体层电连接。 多个三维纳米结构位于第一半导体层和发光面的第一表面的表面上,并且每个三维纳米结构的横截面为M形。
    • 7. 发明授权
    • Method for making light emitting diode
    • 制造发光二极管的方法
    • US08778709B2
    • 2014-07-15
    • US13479229
    • 2012-05-23
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • H01L21/00H01L33/00
    • H01L33/0079H01L33/0066H01L33/06H01L33/22H01L33/24
    • A method for making light emitting diode includes following steps. A substrate is provided. A first semiconductor layer is grown on a surface of the substrate. A patterned mask layer is located on a surface of the first semiconductor layer, and the patterned mask layer includes a number of bar-shaped protruding structures, a slot is defined between each two adjacent protruding structures to expose a portion of the first semiconductor layer. The exposed first semiconductor layer is etched to form a protruding pair. A number of three-dimensional nano-structures are formed by removing the patterned mask layer. An active layer and a second semiconductor layers are grown on the number of three-dimensional nano-structures in that order. A first electrode is electrically connected with the first semiconductor layer. A second electrode is located to cover the entire surface of the second semiconductor layer which is away from the active layer.
    • 制造发光二极管的方法包括以下步骤。 提供基板。 在衬底的表面上生长第一半导体层。 图案化的掩模层位于第一半导体层的表面上,并且图案化掩模层包括多个棒状突出结构,在每个两个相邻的突出结构之间限定狭缝以暴露第一半导体层的一部分。 暴露的第一半导体层被蚀刻以形成突出的一对。 通过去除图案化掩模层形成多个三维纳米结构。 在三维纳米结构的数量上依次生长有源层和第二半导体层。 第一电极与第一半导体层电连接。 第二电极被定位成覆盖远离有源层的第二半导体层的整个表面。
    • 9. 发明授权
    • Light emitting diode
    • 发光二极管
    • US08785955B2
    • 2014-07-22
    • US13477273
    • 2012-05-22
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • H01L33/00
    • H01L33/24H01L33/32
    • A light emitting diode including a substrate, a first semiconductor layer, an active layer, and a second semiconductor layer is provided. The first semiconductor layer includes a first surface and a second surface, and the first surface is connected to the substrate. The active layer and the second semiconductor layer are stacked on the second surface in that order, and a surface of the second semiconductor layer away from the active layer is configured as the light emitting surface. A first electrode electrically is connected with the first semiconductor layer. A second electrode is electrically connected with the second semiconductor layer. A number of three-dimensional nano-structures are located on the surface of the first surface of the first semiconductor layer and aligned side by side, and a cross section of each of the three-dimensional nano-structure is M-shaped.
    • 提供了包括基板,第一半导体层,有源层和第二半导体层的发光二极管。 第一半导体层包括第一表面和第二表面,并且第一表面连接到基板。 有源层和第二半导体层以该顺序堆叠在第二表面上,并且第二半导体层远离有源层的表面被配置为发光表面。 第一电极与第一半导体层电连接。 第二电极与第二半导体层电连接。 多个三维纳米结构位于第一半导体层的第一表面的表面上并排排列,并且每个三维纳米结构的横截面是M形的。
    • 10. 发明授权
    • Method for making light emitting diode
    • 制造发光二极管的方法
    • US08785221B2
    • 2014-07-22
    • US13479234
    • 2012-05-23
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • H01L21/00H01L33/00
    • H01L33/0079H01L21/0237H01L21/0242H01L21/02458H01L21/02513H01L21/0254H01L21/0262H01L21/02658H01L33/005H01L33/24
    • A method for making light emitting diode is provided. The method includes following steps. A substrate is provided. A first semiconductor layer is grown on a surface of the substrate. A patterned mask layer is located on a surface of the first semiconductor layer, and the patterned mask layer includes a number of bar-shaped protruding structures, a slot is defined between each two adjacent protruding structures to expose a portion of the first semiconductor layer. The exposed first semiconductor layer is etched to form a protruding pair. A number of three-dimensional nano-structures are formed by removing the patterned mask layer. An active layer and a second semiconductor layers are grown on the number of three-dimensional nano-structures in that order. A first electrode is electrically connected with the first semiconductor layer. A second electrode is electrically connected with the second semiconductor layer.
    • 提供一种制造发光二极管的方法。 该方法包括以下步骤。 提供基板。 在衬底的表面上生长第一半导体层。 图案化的掩模层位于第一半导体层的表面上,并且图案化掩模层包括多个棒状突出结构,在每个两个相邻的突出结构之间限定狭缝以暴露第一半导体层的一部分。 暴露的第一半导体层被蚀刻以形成突出的一对。 通过去除图案化掩模层形成多个三维纳米结构。 在三维纳米结构的数量上依次生长有源层和第二半导体层。 第一电极与第一半导体层电连接。 第二电极与第二半导体层电连接。