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1. 发明授权

US09852868B2 Chip fuse and manufacturing method therefor 有权
公开(公告)号：US09852868B2
公开(公告)日：2017-12-26
申请号：US14432128
申请日：2012-09-28
申请人： KAMAYA ELECTRIC CO., LTD.
发明人： Katsuya Yamagishi , Hideki Seino
IPC分类号： G06F1/16 , H05K5/00 , H05K7/00 , H01H85/00 , H01H85/046 , H01H69/02 , H01H85/48 , H01H85/38 , H01H85/143
CPC分类号： H01H85/0013 , H01H69/02 , H01H69/022 , H01H85/046 , H01H85/143 , H01H85/38 , H01H85/48 , H01H2069/025 , H01H2085/383 , Y10T29/49107
摘要： In a chip fuse, a heat-storing layer is formed on an insulated substrate, a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section. The chip fuse includes surface electrode sections on both ends in the length direction of the chip fuse and a fuse element section between the surface electrode sections. In this chip fuse, a rectangular bank section is formed over the heat-storing layer and the surface electrode sections to surround the fuse element section, and a first protective layer is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed to form the rectangular bank section.

2. 发明申请

US20150270085A1 CHIP FUSE AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：芯片保险丝及其制造方法
公开(公告)号：US20150270085A1
公开(公告)日：2015-09-24
申请号：US14432128
申请日：2012-09-28
申请人： KAMAYA ELECTRIC CO., LTD.
发明人： Katsuya Yamagishi , Hideki Seino
IPC分类号： H01H85/00 , H01H85/143 , H01H69/02 , H01H85/48
CPC分类号： H01H85/0013 , H01H69/02 , H01H69/022 , H01H85/046 , H01H85/143 , H01H85/38 , H01H85/48 , H01H2069/025 , H01H2085/383 , Y10T29/49107
摘要： In a chip fuse, a heat-storing layer is formed on an insulated substrate, a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section. The chip fuse includes surface electrode sections on both ends in the length direction of the chip fuse and a fuse element section between the surface electrode sections. In this chip fuse, a rectangular bank section is formed over the heat-storing layer and the surface electrode sections to surround the fuse element section, and a first protective layer is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed to form the rectangular bank section.
摘要翻译：在芯片保险丝中，在绝缘基板上形成蓄热层，在保温层上形成保险膜，在熔丝元件部分形成保护膜。芯片保险丝包括在芯片保险丝的长度方向两端的表面电极部分和表面电极部分之间的熔丝元件部分。在该芯片保险丝中，在蓄热层和表面电极部分之上形成矩形堤部分，以围绕熔丝元件部分，并且在堤部分的内侧形成第一保护层。此外，在堤形成过程中，在熔丝元件部分，表面电极部分和储热层上层压含片状感光基团的材料，并且使片状感光基材料暴露对紫外线进行发光，形成矩形堤段。

3. 发明授权

US08973253B2 Method and apparatus for manufacturing metal plate chip resistors 有权
标题翻译：制造金属板片式电阻器的方法和装置
公开(公告)号：US08973253B2
公开(公告)日：2015-03-10
申请号：US14074858
申请日：2013-11-08
申请人： Tatsuki Hirano , Kazuo Tanaka
发明人： Tatsuki Hirano , Kazuo Tanaka
IPC分类号： H01C17/00 , H01C17/245
CPC分类号： H01C17/006 , H01C17/245
摘要： The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus for manufacturing metal plate chip resistors including cutting mold for cutting intermediate product strip transversely to obtain worked product chip, ohm meter for measuring the resistance of the worked product chip, control device having a calculating part for performing a calculation using the resistance measured by the ohm meter to work out a width in which the strip is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjustor for making an adjustment so that the strip is to be cut transversely in the width obtained from the calculating part.
摘要翻译：本发明的目的是提供一种通过简单的工艺制造具有相对较低电阻的金属板片式电阻器的方法和装置，其具有高精度和高产率。该目的是通过用于制造金属板片电阻器的装置实现的，包括用于横向切割中间产品带的切割模具，以获得加工产品芯片，用于测量加工产品芯片的电阻的欧姆表，具有用于执行计算的计算部分的控制装置由欧姆计测量的电阻以横向切割条的宽度，以获得期望电阻的加工产品芯片，以及用于进行调整的切割宽度调节器，使得条被切割横向于从计算部分获得的宽度。

4. 发明授权

US08590141B2 Method and apparatus for manufacturing metal plate chip resistors 有权
标题翻译：制造金属板片式电阻器的方法和装置
公开(公告)号：US08590141B2
公开(公告)日：2013-11-26
申请号：US13196078
申请日：2011-08-02
申请人： Tatsuki Hirano , Kazuo Tanaka
发明人： Tatsuki Hirano , Kazuo Tanaka
IPC分类号： H01C17/00
CPC分类号： H01C17/006 , H01C17/245
摘要： The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus 10 for manufacturing metal plate chip resistors including cutting mold 21 for cutting intermediate product strip 14 transversely to obtain worked product chip 16a, ohm meter 22 for measuring the resistance of the worked product chip 16a, control device 23 having a calculating part for performing a calculation using the resistance measured by the ohm meter 22 to work out a width in which the strip 14 is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjusting means 26, 27 for making an adjustment so that the strip 14 is to be cut transversely in the width obtained from the calculating part.
摘要翻译：本发明的目的是提供一种通过简单的工艺制造具有相对较低电阻的金属板片式电阻器的方法和装置，其具有高精度和高产率。该目的是通过用于制造金属板片式电阻器的装置10实现的，包括用于横向切割中间产品条带14的切割模具21，以获得加工产品芯片16a，用于测量加工产品芯片16a的电阻的欧姆计22，具有使用由欧姆计22测量的电阻进行计算的计算部分，以计算要横向切割条带14的宽度，以获得期望电阻的加工产品芯片;以及切割宽度调节装置26， 27，用于进行调整，使得条带14在从计算部分获得的宽度上横向切割。

5. 发明授权

US10553385B2 Chip fuse and method for producing same 有权
公开(公告)号：US10553385B2
公开(公告)日：2020-02-04
申请号：US15311238
申请日：2015-04-28
申请人： KAMAYA ELECTRIC CO., LTD.
发明人： Koji Nakanishi , Satoshi Nishimura
IPC分类号： H01H85/17 , H01H85/041 , H01H85/08 , H01H69/02 , H01H85/157
摘要： Provided is a chip fuse and a method for producing the same, which is improved to facilitate balanced release of impact and vapor generated upon fusion. The chip fuse includes a fuse body having a pair of facing upper and lower ceramic substrates, a fuse wire support having a vertical through hole in its center and held between the ceramic substrates, and a fuse wire mounted between the two ends of the fuse wire support across the through hole, and a pair of metal caps fitted on the two ends of the fuse body, wherein the upper ceramic substrate and the fuse wire support, and the lower ceramic substrate and the fuse wire support, are respectively adhered together on their mutually facing surfaces to hermetically close the through hole, partially leaving a non-adhered region on the adhered surfaces.

6. 发明授权

US10242776B2 Rectangular chip resistor and manufacturing method for same 有权
公开(公告)号：US10242776B2
公开(公告)日：2019-03-26
申请号：US15568865
申请日：2016-04-22
申请人： KAMAYA ELECTRIC CO., LTD.
发明人： Tomiharu Morita , Yuusuke Nojiri
IPC分类号： H01C13/02 , H01C1/142 , H01C17/065 , H01C17/242 , H01C17/00 , H01C17/06 , H01C7/00
摘要： The chip resistor includes insulating substrate 10, first and second top electrodes (11x, 11b) on the top surface of the insulating substrate each on either longitudinal end thereof, and resistive element 12 electrically in contact with the top electrodes, wherein each of the top electrodes has, on its inner side facing to the other, cutout part 11a and protruding part 11b, with the cutout part in the first top electrode extending from at least one longitudinal side of the insulating substrate, transversely inwards thereof, and with the cutout part in the second top electrode arranged substantially point-symmetrically to the cutout part in the first top electrode with respect to the center of the insulating substrate, wherein the resistive element has contacting regions 12b, and non-contacting regions 12c, and trimming slot (53a, 53b) including a linear part.

7. 发明授权

US08058968B2 Method for manufacturing rectangular plate type chip resistor and rectangular plate type chip resistor 有权
标题翻译：矩形板式片式电阻器和矩形片式片式电阻器的制造方法
公开(公告)号：US08058968B2
公开(公告)日：2011-11-15
申请号：US12376878
申请日：2007-05-18
申请人： Tatsuki Hirano , Osamu Matsukawa
发明人： Tatsuki Hirano , Osamu Matsukawa
IPC分类号： H01C1/012
CPC分类号： H01C17/006 , H01C17/245
摘要： A method for manufacturing rectangular plate type chip resistors and a rectangular plate type chip resistor obtained by this method. The method includes the steps of (A) providing a resistive alloy plate strip of predetermined width and thickness, (B) forming an insulating protective film of a predetermined width longitudinally along the middle of upper and lower faces of the alloy plate strip, (C) forming an electrode layer composed of integrated surface, back, and end electrodes, along both sides of the protective film by electroplating, and (D) cutting the alloy plate strip coated with the protective films and the electrode layers in step (C) transversely in predetermined lengths, wherein resistance is controlled to be within a predetermined range by adjusting the thickness of the alloy plate strip in step (A), the width of the protective film formed in step (B), and the cutting length in step (D).
摘要翻译：通过该方法获得的矩形板状片状电阻器和矩形板状片状电阻器的制造方法。该方法包括以下步骤：（A）提供预定宽度和厚度的电阻合金板条，（B）沿合金板条的上下表面纵向形成预定宽度的绝缘保护膜，（C ）通过电镀沿着保护膜的两面形成由一体的表面，背面和端部电极构成的电极层，（D）在步骤（C）中横向切割涂覆有保护膜和电极层的合金板条通过调整步骤（A）中的合金板条的厚度，步骤（B）中形成的保护膜的宽度和步骤（D）中的切割长度，将预定长度的电阻控制在预定范围内）。

8. 发明申请

US20100236054A1 METHOD AND APPARATUS FOR MANUFACTURING METAL PLATE CHIP RESISTORS 审中-公开
标题翻译：用于制造金属板片电阻的方法和装置
公开(公告)号：US20100236054A1
公开(公告)日：2010-09-23
申请号：US12294563
申请日：2008-01-10
申请人： Tatsuki Hirano , Kazuo Tanaka
发明人： Tatsuki Hirano , Kazuo Tanaka
IPC分类号： H01C17/00
CPC分类号： H01C17/006 , H01C17/245
摘要： The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus 10 for manufacturing metal plate chip resistors including cutting mold 21 for cutting intermediate product strip 14 transversely to obtain worked product chip 16a, ohm meter 22 for measuring the resistance of the worked product chip 16a, control device 23 having a calculating part for performing a calculation using the resistance measured by the ohm meter 22 to work out a width in which the strip 14 is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjusting means 26, 27 for making an adjustment so that the strip 14 is to be cut transversely in the width obtained from the calculating part.
摘要翻译：本发明的目的是提供一种通过简单的工艺制造具有相对较低电阻的金属板片式电阻器的方法和装置，其具有高精度和高产率。该目的是通过用于制造金属板片式电阻器的装置10实现的，包括用于横向切割中间产品条带14的切割模具21，以获得加工产品芯片16a，用于测量加工产品芯片16a的电阻的欧姆计22，具有使用由欧姆计22测量的电阻进行计算的计算部分，以计算要横向切割条带14的宽度，以获得期望电阻的加工产品芯片;以及切割宽度调节装置26， 27，用于进行调整，使得条带14在从计算部分获得的宽度上横向切割。

9. 发明申请

US20140059838A1 METHOD AND APPARATUS FOR MANUFACTURING METAL PLATE CHIP RESISTORS 有权
标题翻译：用于制造金属板片电阻的方法和装置
公开(公告)号：US20140059838A1
公开(公告)日：2014-03-06
申请号：US14074858
申请日：2013-11-08
申请人： Tatsuki Hirano , Kazuo Tanaka
发明人： Tatsuki Hirano , Kazuo Tanaka
IPC分类号： H01C17/00
CPC分类号： H01C17/006 , H01C17/245
摘要： The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus for manufacturing metal plate chip resistors including cutting mold for cutting intermediate product strip transversely to obtain worked product chip, ohm meter for measuring the resistance of the worked product chip, control device having a calculating part for performing a calculation using the resistance measured by the ohm meter to work out a width in which the strip is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjustor for making an adjustment so that the strip is to be cut transversely in the width obtained from the calculating part.
摘要翻译：本发明的目的是提供一种通过简单的工艺制造具有相对较低电阻的金属板片式电阻器的方法和装置，其具有高精度和高产率。该目的是通过用于制造金属板片电阻器的装置实现的，包括用于横向切割中间产品带的切割模具，以获得加工产品芯片，用于测量加工产品芯片的电阻的欧姆表，具有用于执行计算的计算部分的控制装置由欧姆计测量的电阻以横向切割条的宽度，以获得期望电阻的加工产品芯片，以及用于进行调整的切割宽度调节器，使得条被切割横向于从计算部分获得的宽度。

10. 发明授权

US5828123A Chip resistor and method for producing same 失效
标题翻译：贴片电阻及其制造方法
公开(公告)号：US5828123A
公开(公告)日：1998-10-27
申请号：US769155
申请日：1996-12-18
申请人： Tatsuki Hirano
发明人： Tatsuki Hirano
IPC分类号： H01C1/148 , H01C7/00 , H01C17/00 , H01C17/06 , H01C17/065 , H01L29/00 , H01L49/02
CPC分类号： H01C17/06506 , H01C17/006
摘要： A chip resistor comprising an insulated substrate, a pair of top electrodes disposed on top of said insulated substrate, a resistor film bridging said pair of top electrodes, a protective film coating said resistor film, and an end electrode and a plated electrode film which are formed on each of said pair of top electrodes, wherein each of said top electrodes includes:a first electrode section connected to said resistor film; and a second electrode section not in direct contact with said resistor film and arranged in connection to and along said first electrode section so as to extend in parallel with a portion of said first electrode section between said resistor film and said end electrode, said second electrode section having a sheet resistivity lower than that of said first electrode section.
摘要翻译：一种片状电阻器，包括绝缘衬底，设置在所述绝缘衬底顶部的一对顶电极，桥接所述一对顶电极的电阻膜，涂覆所述电阻膜的保护膜，以及端电极和电镀电极膜，形成在所述一对顶电极中的每一个上，其中每个所述顶电极包括：连接到所述电阻膜的第一电极部分; 以及第二电极部分，其不与所述电阻膜直接接触并且与所述第一电极部分连接并且沿着所述第一电极部分布置成与所述电阻器膜和所述端电极之间的所述第一电极部分的一部分平行延伸，所述第二电极片材的电阻率低于所述第一电极部分的电阻率。

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