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1. 发明申请

US20140284754A1 CHIP DIODE AND DIODE PACKAGE 有权
标题翻译：芯片二极管和二极管封装
公开(公告)号：US20140284754A1
公开(公告)日：2014-09-25
申请号：US14349901
申请日：2012-10-16
申请人： ROHM CO., LTD.
发明人： Hiroki Yamamoto
IPC分类号： H01L29/417 , H01L29/861
CPC分类号： H01L29/872 , H01L23/3114 , H01L23/3192 , H01L23/49551 , H01L23/49562 , H01L23/5223 , H01L23/5228 , H01L23/544 , H01L23/562 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L27/0255 , H01L27/0629 , H01L27/067 , H01L27/0722 , H01L27/1021 , H01L28/10 , H01L28/20 , H01L28/24 , H01L28/40 , H01L29/0615 , H01L29/0619 , H01L29/0692 , H01L29/417 , H01L29/66136 , H01L29/861 , H01L29/8611 , H01L29/866 , H01L2223/54413 , H01L2223/54433 , H01L2223/54473 , H01L2223/54493 , H01L2224/02166 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/05144 , H01L2224/05553 , H01L2224/05567 , H01L2224/05624 , H01L2224/05644 , H01L2224/06181 , H01L2224/11009 , H01L2224/11464 , H01L2224/13022 , H01L2224/131 , H01L2224/16225 , H01L2224/16245 , H01L2224/291 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/73253 , H01L2224/73265 , H01L2224/85205 , H01L2224/94 , H01L2924/00014 , H01L2924/10253 , H01L2924/12032 , H01L2924/12035 , H01L2924/12036 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/30107 , H01L2924/00012 , H01L2924/014 , H01L2224/11 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： [Theme] To provide a chip diode, with which a p-n junction formed on a semiconductor layer can be prevented from being destroyed and fluctuations in characteristics can be suppressed even when a large stress is applied to a pad for electrical connection with the exterior, and a diode package that includes the chip diode.[Solution] A chip diode 15 includes an epitaxial layer 21 with a p-n junction 28, constituting a diode element 29, formed therein, an anode electrode 34 disposed along a top surface 22 of the epitaxial layer 21, electrically connected to a diode impurity region 23, which is the p-side pole of the p-n junction 28, and having a pad 37 for electrical connection with the exterior, and a cathode electrode 41 electrically connected to the epitaxial layer 21, which is the n-side pole of the p-n junction 28, and the pad 37 is provided at a position separated from a position directly above the p-n junction 28.
摘要翻译： [主题]提供一种芯片二极管，可以防止在半导体层上形成的pn结被破坏，并且即使当大的应力施加到与外部电连接的焊盘时也可以抑制特性波动，并且包括芯片二极管的二极管封装。芯片二极管15包括形成有二极管元件29的pn结28的外延层21，沿着外延层21的顶表面22设置的阳极电极34，电极连接到二极管杂质区 23是pn接点28的p侧极，并且具有用于与外部电连接的焊盘37，以及与外延层21电连接的阴极41，该外延层21是pn的n侧极接头28，并且垫37设置在与正好在pn结28上方的位置分离的位置。

2. 发明申请

US20150243412A1 CHIP COMPONENT AND PRODUCTION METHOD THEREFOR 有权
标题翻译：芯片组件及其生产方法
公开(公告)号：US20150243412A1
公开(公告)日：2015-08-27
申请号：US14431771
申请日：2013-08-07
申请人： ROHM CO., LTD.
发明人： Yasuhiro Kondo , Katsuya Matsuura
IPC分类号： H01C1/012 , H01G2/06 , H01C17/06 , H01G4/228 , H01G5/01 , H01C1/14 , H01G4/008
CPC分类号： H01C1/012 , H01C1/14 , H01C1/16 , H01C7/003 , H01C17/06 , H01G2/065 , H01G4/008 , H01G4/012 , H01G4/228 , H01G4/30 , H01G4/40 , H01G5/01 , H05K1/181
摘要： A chip part according to the present invention includes a substrate having a front surface and a side surface, an electrode integrally formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, and an insulating film interposed between the electrode and the substrate. A circuit assembly according to the present invention includes the chip part according to the present invention and a mounting substrate having a land, bonded by solder to the electrode, on a mounting surface facing the front surface of the substrate.
摘要翻译：根据本发明的芯片部件包括具有前表面和侧表面的基板，一体地形成在前表面和侧表面上以覆盖基板的前表面的边缘部分的电极和绝缘体介于电极和基板之间的膜。根据本发明的电路组件包括根据本发明的芯片部件和安装基板，该安装基板具有在与基板的前表面相对的安装表面上的焊料与电极接合的焊盘。

3. 发明申请

US20230140231A1 THERMAL PRINT HEAD, THERMAL PRINTER, AND METHOD FOR MANUFACTURING THERMAL PRINT HEAD 有权
公开(公告)号：US20230140231A1
公开(公告)日：2023-05-04
申请号：US17915274
申请日：2021-03-26
申请人： ROHM CO., LTD.
发明人： Satoshi KIMOTO
IPC分类号： B41J2/335 , B41J2/34
摘要： A thermal print head includes a substrate, a resistor layer and a wiring layer. The substrate is made of a single crystal semiconductor and includes an obverse surface facing in one sense of a thickness direction. The resistive layer is supported by the substrate and includes a plurality of heat generating parts arranged side by side in a main scanning direction. The wiring layer is supported by the substrate and forms a conductive path to the plurality of heat generating parts. The wiring layer includes a conductive part and a heat generating sub-part for each of the plurality of heat generating parts, where the conductive part has a lower resistance value per unit length in a sub-scanning direction than the heat generating part, and where the heat generating sub-part has a resistance value per unit length in the sub-scanning direction that falls between the respective resistance values of the heat generating part and the conductive part. The substrate includes a ridge raised from the obverse surface and extending in the main scanning direction. The heat generating part, the heat generating sub-part and the conductive part are disposed on the ridge. The heat generating sub-part is located between the heat generating part and the conductive part in the sub-scanning direction.

4. 发明申请

US20230137190A1 POWER CONTROL DEVICE 有权
公开(公告)号：US20230137190A1
公开(公告)日：2023-05-04
申请号：US18091507
申请日：2022-12-30
申请人： Rohm Co., Ltd.
发明人： Kenichi OKAJIMA
IPC分类号： H02H7/12 , H02H1/00 , G05F1/595 , H02M1/088 , G05F1/575 , G05F1/571 , H02M3/158 , H02H3/20 , H02M1/36
摘要： A power control device includes: an output voltage controller configured to control an output voltage based on a feedback voltage corresponding to the output voltage; and an overvoltage protector configured to continue or stop the operation of the output voltage controller based on a first detection result of whether the output voltage has exceeded an output voltage threshold value and a second detection result of whether the feedback voltage has fallen to or below a feedback voltage threshold value.

5. 发明申请

US20230137055A1 ELECTRIC DRIVE UNIT 有权
公开(公告)号：US20230137055A1
公开(公告)日：2023-05-04
申请号：US17971385
申请日：2022-10-21
申请人： Mazda Motor Corporation , Rohm Co., Ltd.
发明人： Takayuki Sato , Akihiro Noda , Hiroaki Kashihara , Hideki Yamada , Hideki Hosoya , Masashi Hayashiguchi
IPC分类号： H02M7/537 , H02M7/00 , B60L50/51 , H02K19/02
摘要： An inverter is disposed adjacent to a motor. The inverter includes a plurality of power modules, a smoothing capacitor, and busbars connecting the power modules and the smoothing capacitor. The plurality of power modules are disposed to be arranged along the periphery of the smoothing capacitor. The smoothing capacitor is disposed at a central portion of the inverter and also disposed in the inner portion of the inverter such that the smoothing capacitor and each of the power modules are arranged on the same plane.

6. 发明申请

US20230136947A1 INVERTER STRUCTURE 有权
公开(公告)号：US20230136947A1
公开(公告)日：2023-05-04
申请号：US17970331
申请日：2022-10-20
申请人： Mazda Motor Corporation , Rohm Co., Ltd.
发明人： Takayuki Sato , Masashi Hayashiguchi
IPC分类号： H02M7/537 , H02M7/00 , H02P27/06
摘要： In an inverter that includes a smoothing capacitor and a plurality of power modules, the smoothing capacitor includes a plurality of columnar unit capacitors each having electrodes at both ends thereof, a one-end-side bus plate connected to the electrode at one end of each unit capacitor, and an other-end-side bus plate connected to the electrode at the other end of the unit capacitor. The unit capacitors are arranged, with axes thereof parallel to each other, side by side in a direction perpendicular to the axes. The plurality of power modules is arranged, with respect to the smoothing capacitor, side by side in a direction perpendicular to the axes of the unit capacitors.

7. 发明申请

US20230136386A1 ELECTRIC DRIVE UNIT 有权
公开(公告)号：US20230136386A1
公开(公告)日：2023-05-04
申请号：US17971395
申请日：2022-10-21
申请人： Mazda Motor Corporation , Rohm Co., Ltd.
发明人： Takayuki Sato , Masashi Hayashiguchi
IPC分类号： H02M7/537 , H02M7/00 , B60L50/51
摘要： An inverter is disposed adjacent to one end of a motor in a rotational axis direction. The inverter includes a plurality of power modules each including a switching element, a smoothing capacitor, busbars that connect the power modules to the smoothing capacitor, and a thin case that accommodates these components. The plurality of power modules are disposed at the periphery of the smoothing capacitor and arranged in the circumferential direction. The busbars are formed to extend in the circumferential direction. An inner edge portion of each of the busbars connected to a terminal of the smoothing capacitor has an arc shape or a circular shape.

8. 发明申请

US20230131845A1 MOUNTING COMPONENT, TRANSDUCER, AND ELECTRONIC DEVICE 有权
公开(公告)号：US20230131845A1
公开(公告)日：2023-04-27
申请号：US18048906
申请日：2022-10-24
申请人： ROHM Co., LTD.
发明人： Takashi Naiki , Kenji Goda
IPC分类号： H04R1/02 , H04R7/10 , H04R17/00 , H04R7/18
摘要： Provided is a mounting component held so as to be capable of attachment and detachment by a mounting machine. The mounting component includes a membrane support, a vibrating membrane connected to the membrane support and displaceable in a membrane thickness direction, and a contact member that is located on the membrane support and is subjected to an upward attractive force by the mounting machine without generating stress leading to shape deformation or breakage of the vibrating membrane during the attachment and detachment.

9. 发明申请

US20230131034A1 SEMICONDUCTOR DEVICE 有权
公开(公告)号：US20230131034A1
公开(公告)日：2023-04-27
申请号：US17912013
申请日：2021-03-24
申请人： ROHM CO., LTD.
发明人： Tadao YUKI
IPC分类号： H01L27/02
摘要： A semiconductor device includes a semiconductor layer, a first region of a first conductivity type formed in the semiconductor layer and connected to a ground potential, a second region of a second conductivity type formed in the semiconductor layer, an insulating film formed on the semiconductor layer and covering the first region and the second region, an internal circuit, signal terminal for driving the internal circuit or to be driven by the internal circuit, a first wiring connecting the internal circuit and the signal terminal, a resistance element formed on the insulating film and interposed halfway through the first wiring, the resistance element including a first resistor facing the second region across the insulating film, and a second wiring connected to the first wiring on a side closer to the signal terminal than the resistance element and connecting the first wiring and the second region.

10. 发明申请

US20230129526A1 SWITCHING CIRCUIT, DC/DC CONVERTER, AND CONTROL CIRCUIT THEREOF 有权
公开(公告)号：US20230129526A1
公开(公告)日：2023-04-27
申请号：US18047730
申请日：2022-10-19
申请人： ROHM Co., LTD.
发明人： Shun FUKUSHIMA
IPC分类号： H02M3/158 , H03K17/687 , H03K19/003
摘要： Disclosed is a switching circuit including an input terminal, a switching terminal, a grounding terminal, a bootstrap terminal, a high-side transistor connected between the input terminal and the switching terminal, a low-side transistor connected between the switching terminal and the grounding terminal, a bootstrap capacitor connected between the switching terminal and the bootstrap terminal, a bootstrap switch connected between a constant voltage line and the bootstrap terminal, and a driver circuit configured to turn on the bootstrap switch in a period of time in which the low-side transistor is on and to turn off the bootstrap switch in a period of time in which the low-side transistor is off. The bootstrap switch includes two P-channel metal oxide semiconductor transistors connected in anti-series with each other between the constant voltage line and the bootstrap terminal.

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