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1. 发明授权

US10312002B2 Chip component and production method therefor 有权
公开(公告)号：US10312002B2
公开(公告)日：2019-06-04
申请号：US15408864
申请日：2017-01-18
申请人： ROHM CO., LTD.
发明人： Yasuhiro Kondo , Katsuya Matsuura
IPC分类号： H01C1/012 , H01C1/14 , H01G2/06 , H01G4/228 , H01G5/01 , H01C1/16 , H01G4/012 , H01G4/40 , H05K1/18 , H01G4/30 , H01C7/00 , H01C17/06 , H01G4/008
摘要： A chip part according to the present invention includes a substrate having a front surface and a side surface, an electrode integrally formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, and an insulating film interposed between the electrode and the substrate. A circuit assembly according to the present invention includes the chip part according to the present invention and a mounting substrate having a land, bonded by solder to the electrode, on a mounting surface facing the front surface of the substrate.

2. 发明授权

US10224391B2 Chip resistor and electronic equipment having resistance circuit network 有权
公开(公告)号：US10224391B2
公开(公告)日：2019-03-05
申请号：US15647592
申请日：2017-07-12
申请人： ROHM CO., LTD.
发明人： Hiroshi Tamagawa , Yasuhiro Kondo , Yasuhiro Fuwa , Hiroyuki Okada , Eiji Nukaga , Katsuya Matsuura
IPC分类号： H01L49/02 , H01L27/08 , H01L27/06 , H01L21/308 , H01C1/14 , H01C13/02 , H01L21/3065 , H01C17/242 , H01C17/00 , H05K3/34
摘要： A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

3. 发明授权

US09812412B2 Chip part having passive elements on a common substrate 有权
公开(公告)号：US09812412B2
公开(公告)日：2017-11-07
申请号：US14980404
申请日：2015-12-28
申请人： ROHM CO., LTD.
发明人： Takuma Shimoichi , Yasuhiro Kondo
IPC分类号： H01L23/66 , H01L49/02 , H01L27/01
CPC分类号： H01L23/66 , H01L27/016 , H01L28/10 , H01L28/20 , H01L28/60 , H01L2223/6672 , H01L2924/0002 , H05K1/0289 , H05K1/029 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/107 , H05K3/146 , H05K2201/0317 , H05K2201/0338 , H05K2201/0376 , H05K2201/0391 , H05K2201/09263 , H05K2201/09981 , H05K2201/10181 , H05K2203/0353 , H05K2203/1338 , H01L2924/00
摘要： A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.

4. 发明授权

US09646747B2 Chip component 有权
公开(公告)号：US09646747B2
公开(公告)日：2017-05-09
申请号：US14373900
申请日：2012-12-26
申请人： ROHM CO., LTD.
发明人： Hiroshi Tamagawa , Hiroki Yamamoto , Katsuya Matsuura , Yasuhiro Kondo
IPC分类号： H01C10/50 , H01G5/38 , H01G5/40 , H01F29/00 , H01F27/40 , H01L25/10 , H01G5/011 , H01C1/14 , H01L27/15 , H01L33/62 , H01L25/13 , H01C10/16 , H01F27/28 , H01L27/08 , H01C17/23 , H05K3/34 , H01L23/00 , H01C17/00 , H01F17/00
CPC分类号： H01C1/14 , H01C10/16 , H01C10/50 , H01C17/006 , H01C17/23 , H01F17/0006 , H01F27/2804 , H01F27/40 , H01F29/00 , H01F29/08 , H01F41/041 , H01G2/16 , H01G4/33 , H01G4/38 , H01G4/40 , H01G5/011 , H01G5/38 , H01G5/40 , H01L24/32 , H01L25/105 , H01L25/13 , H01L27/0802 , H01L27/15 , H01L33/62 , H01L2221/68304 , H01L2224/16225 , H01L2924/12041 , H01L2924/12042 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , H01L2933/0066 , H05K1/181 , H05K3/3442 , H05K3/3478 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2201/10212 , H05K2203/0415 , Y02P70/613 , H01L2924/00
摘要： A chip component includes a substrate, an element circuit network including a plurality of element parts formed on the substrate, an external connection electrode provided on a surface of the substrate to provide external connection for the element circuit network, a plurality of fuses formed on the substrate and disconnectably connecting each of the plurality of element parts to the external connection electrode, a solder layer formed on an external connection terminal of the external connection electrode and a resin film which covers the surface of the substrate and other surface which intersects the surface of the substrate.

5. 发明授权

US10706993B2 Chip parts 有权
公开(公告)号：US10706993B2
公开(公告)日：2020-07-07
申请号：US15703954
申请日：2017-09-13
申请人： ROHM CO., LTD.
发明人： Takuma Shimoichi , Yasuhiro Kondo , Keishi Watanabe , Takamichi Torii , Katsuya Matsuura
IPC分类号： H01F27/28 , H01C1/01 , H01F27/29 , H01G4/30 , H01G4/228 , H01F17/00 , H01C1/02 , H05K1/02 , H01C17/26 , H05K1/16 , H01C1/142 , H01C7/00 , H01L23/522 , H01C13/02 , H01L49/02 , H01G4/33 , H01C1/14
摘要： A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.

6. 发明授权

US10446302B2 Chip resistor and methods of producing the same 有权
公开(公告)号：US10446302B2
公开(公告)日：2019-10-15
申请号：US15352263
申请日：2016-11-15
申请人： ROHM CO., LTD.
发明人： Eiji Nukaga , Hiroshi Tamagawa , Yasuhiro Kondo , Katsuya Matsuura
IPC分类号： H01C17/00 , H01C17/242 , H01C7/00 , H01C13/02 , H01C17/06 , H01G2/06 , H01C17/08 , H01F27/40 , H01G4/38 , H01G4/40 , H01L21/3065 , H01L21/78 , H01L23/525 , H01L23/528 , H01L29/66 , H01L29/861
摘要： A chip resistor includes: a board having a device formation surface, a back surface opposite from the device formation surface and side surfaces connecting the device formation surface to the back surface, a resistor portion provided on the device formation surface, a first connection electrode and a second connection electrode provided on the device formation surface and electrically connected to the resistor portion, and a resin film covering the device formation surface with the first connection electrode and the second connection electrode being exposed therefrom. Intersection portions of the board along which the back surface intersects the side surfaces each have a rounded shape.

7. 发明授权

US10403420B2 Chip resistor 有权
公开(公告)号：US10403420B2
公开(公告)日：2019-09-03
申请号：US15485640
申请日：2017-04-12
申请人： ROHM CO., LTD.
发明人： Hiroyuki Okada , Yasuhiro Kondo
IPC分类号： H01C1/16 , H01C1/01 , H01C1/14 , H01C17/00
摘要： A chip resistor including, a substrate having a main surface, a first resistance circuit formed at the main surface of the substrate, a second resistance circuit formed at the main surface of the substrate apart from the first resistance circuit, a common internal electrode formed at the main surface of the substrate and electrically connected to the first resistance circuit and the second resistance circuit, a first internal electrode formed at the main surface of the substrate and electrically connected to the first resistance circuit, a second internal electrode formed at the main surface of the substrate and electrically connected to the second resistance circuit, and a dummy resistance circuit formed in a region between the first resistance circuit and the second resistance circuit at the main surface of the substrate so as to be in an electrically floating state.

8. 发明授权

US10210971B2 Chip component 有权
公开(公告)号：US10210971B2
公开(公告)日：2019-02-19
申请号：US15490333
申请日：2017-04-18
申请人： ROHM CO., LTD.
发明人： Hiroshi Tamagawa , Hiroki Yamamoto , Katsuya Matsuura , Yasuhiro Kondo
IPC分类号： H01C1/14 , H01C10/16 , H01C17/00 , H01G5/40 , H01L33/62 , H05K1/18 , H05K3/34 , H01F29/08 , H01F41/04 , H01L27/15 , H01G5/011 , H01G5/38 , H01L27/08 , H01C17/23 , H01C10/50 , H01F27/28 , H01F27/40 , H01F29/00 , H01L25/10 , H01L25/13 , H01L23/00 , H01G4/33 , H01G4/38 , H01G4/40 , H01G2/16 , H01F17/00
摘要： A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

9. 发明申请

US20140368965A1 CHIP COMPONENT AND METHOD OF PRODUCING THE SAME 有权
标题翻译：芯片组件及其制造方法
公开(公告)号：US20140368965A1
公开(公告)日：2014-12-18
申请号：US14376417
申请日：2013-01-08
申请人： ROHM CO., LTD.
发明人： Yasuhiro Kondo , Hiroshi Tamagawa , Hiroki Yamamoto
IPC分类号： H01C10/50 , H01C17/00 , H01L27/02 , H01L27/08 , H01F27/40 , H01G5/38
CPC分类号： H01C13/02 , H01C1/14 , H01C10/50 , H01C17/006 , H01C17/06 , H01F27/402 , H01F29/00 , H01G2/16 , H01G4/40 , H01G5/019 , H01G5/38 , H01L23/5256 , H01L27/0207 , H01L27/0814 , H01L28/20 , H01L2224/16225 , Y10T29/49099
摘要： [Subject] To provide a highly-reliable and small-size chip component, e.g., a chip resistor having an accurate resistance value.[Solution] The chip resistor (10) includes: a substrate (11); a plurality of resistor elements each having a resistive film portion (20) provided on the substrate (11) and an aluminum-containing interconnection film portion (21) provided in contact with the resistive film portion (20); electrodes (12, 13) provided on the substrate (11); and a plurality of fuses (F) each having an aluminum-containing interconnection film portion integral with the aluminum-containing interconnection film portion of the resistor element and disconnectably connecting the resistor element to the electrodes (12, 13).[Effect] The resistance of the chip resistor can be adjusted at a desired resistance value by selectively disconnecting desired ones of the fuses. Since the fuses are formed in a minute layout pattern from an aluminum-containing interconnection film, the processing accuracy is improved in the disconnecting step.
摘要翻译：提供高度可靠和小尺寸的芯片组件，例如具有精确电阻值的片式电阻器。芯片电阻器（10）包括：衬底（11）; 多个电阻元件，每个电阻元件具有设置在所述基板上的电阻膜部分和设置成与所述电阻膜部分接触的含铝互连膜部分; 设置在基板（11）上的电极（12,13）; 和多个保险丝（F），每个保险丝具有与电阻器元件的含铝互连膜部分成一体的含铝互连膜部分，并且可拆卸地将电阻器元件连接到电极（12,13）。 [效果]通过选择性地断开所需的保险丝，可以将片式电阻器的电阻调节到期望的电阻值。由于保险丝以含有铝的互连膜的分布图形式形成，所以在断开步骤中提高了加工精度。

10. 发明授权

US10607779B2 Chip capacitor having capacitor region directly below external electrode 有权
公开(公告)号：US10607779B2
公开(公告)日：2020-03-31
申请号：US15492109
申请日：2017-04-20
申请人： ROHM CO., LTD.
发明人： Keishi Watanabe , Yasuhiro Kondo
IPC分类号： H01G4/30 , H01G4/33 , H01G2/06 , H01G4/012 , H01G4/232
摘要： A chip capacitor includes a substrate having a main surface, a first conductive film including a first connecting region and a first capacitor forming region and formed on the main surface of the substrate, a dielectric film covering the first capacitor forming region of the first conductive film, a second conductive film including a second connecting region facing to the first capacitor forming region of the first conductive film across the dielectric film, and a second capacitor forming region facing to the first capacitor forming region of the first conductive film across the dielectric film, a first external electrode electrically connected to the first connecting region of the first conductive film, and a second external electrode electrically connected to the second connecting region of the second conductive film.

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