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1. 发明授权

US09974186B2 Method of manufacturing printed circuit board with embedded electronic components positioned by using solder paste 有权
公开(公告)号：US09974186B2
公开(公告)日：2018-05-15
申请号：US15146418
申请日：2016-05-04
申请人： UNITECH PRINTED CIRCUIT BOARD CORP.
发明人： Ming Yi Yeh , Shun Yueh Hsu , Kun Chi Chen , Hung Min Chen
IPC分类号： H05K3/34 , H05K1/18 , H05K3/46 , H05K1/02
CPC分类号： H05K1/188 , H05K1/0266 , H05K1/186 , H05K3/3442 , H05K3/4679 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2203/0361 , H05K2203/048 , H05K2203/166 , H05K2203/167 , H05K2203/308 , Y10T29/49124 , Y10T29/49144
摘要： A method of manufacturing a printed circuit board with embedded electronic components fixed by a solder paste includes: providing a carrier board with a copper foil layer on the carrier board, an insulating layer on the copper foil layer, and an opening on the insulating layer by laser; putting a solder paste into the opening to form a solder paste layer; performing a high-temperature reflow process of the electronic components on the solder paste layer until the solder paste layer is molten; curing the solder paste layer after cooling to fix the components to the center position of the opening; placing the copper foil layer below the electronic components and removing the solder paste layer; and performing copper plating and electroplating processes in an electroplating space to form a plating copper. The cohesion of the molten solder paste pulls the electronic components towards the center to eliminate position offset produced when the electronic components are installed.

2. 发明授权

US07834276B2 Structure for connecting a USB communication interface in a flash memory card by the height difference of a rigid flexible board 有权
标题翻译：用于通过刚性柔性板的高度差连接闪存卡中的USB通信接口的结构
公开(公告)号：US07834276B2
公开(公告)日：2010-11-16
申请号：US11304665
申请日：2005-12-16
申请人： Cheng Hsien Chou , Yu-Jen Chen , Kai Hsiang Chiang , Chia Hurg Ting
发明人： Cheng Hsien Chou , Yu-Jen Chen , Kai Hsiang Chiang , Chia Hurg Ting
IPC分类号： G06F3/00 , G06F13/12 , G06F1/16 , H05K7/10 , H05K7/20 , H01L21/00 , H01R12/04
CPC分类号： H05K1/117 , H05K1/189 , H05K3/4691 , H05K2201/10159
摘要： The present invention relates to a flash memory card that is a structure using a rigid flexible board (RFB) to connect a flash memory card unit and a universal serial bus (USB) unit. A communication interface in compliance with the specification of the flash memory card is disposed at one end of the flash memory card, and a USB communication interface is disposed at another end, and a rigid flexible board is provided for connecting the electric signals between the two communication interfaces and the bending characteristic is used to maintain the height difference between the planes of the two communication interface, so that the flash memory card can concurrently have the USB communication interface and enhance the applicability of the flash memory card.
摘要翻译：本发明涉及一种闪存卡，其是使用刚性柔性板（RFB）连接闪存卡单元和通用串行总线（USB）单元的结构。符合闪存卡规格的通信接口设置在闪存卡的一端，另一端设置有USB通信接口，并且提供刚性柔性板，用于连接两个之间的电信号通信接口和弯曲特性用于保持两个通信接口的平面之间的高度差，使得闪存卡可以同时具有USB通信接口并增强闪存卡的适用性。

3. 发明授权

US07477066B2 Universal grid composite circuit board testing tool 有权
标题翻译：通用电网复合电路板测试工具
公开(公告)号：US07477066B2
公开(公告)日：2009-01-13
申请号：US11649303
申请日：2007-01-04
申请人： Po-Wen Kuo
发明人： Po-Wen Kuo
IPC分类号： G01R1/073
CPC分类号： G01R1/07371 , G01R1/07378 , G01R31/2808
摘要： The present invention discloses a universal grid composite circuit board testing tool having a probe station, a clamp base and a conducting wire base. The probe station and clamp base separately have a plurality of conducting probes and long needles. Both ends of the long needle are electrically contacted with the testing point and conducting probe of the testing printed circuit board. The conducting wire base includes a conducting wire contact point electrically connected to a plurality of conducting probes in the probe station at the same time, such that when a testing printed circuit board is tested, it is not necessary to prepare a new probe station and a new conducting wire base. The test simply requires users to change the installation positions of the long needles and run a comparison program according to the positions of the testing points of the testing printed circuit board.
摘要翻译：本发明公开了一种具有探针台，夹具基座和导线基座的通用格栅复合电路板测试工具。探针台和夹具底座分别具有多个导电探头和长针头。长针的两端与测试印刷电路板的测试点和导电探针电接触。导线基底包括导电接触点，同时电连接到探针台中的多个导电探针，使得当测试印刷电路板被测试时，不需要准备新的探针台和新的导线基座。该测试只需要用户更改长针的安装位置，并根据测试印刷电路板的测试点的位置运行比较程序。

4. 发明申请

US20060060377A1 Method of forming a multi-layer printed circuit board and the product thereof 审中-公开
标题翻译：形成多层印刷电路板的方法及其制品
公开(公告)号：US20060060377A1
公开(公告)日：2006-03-23
申请号：US11270490
申请日：2005-11-10
申请人： Cheng-Hsien Chou , Hung-Yi Yeh , Chia-Hung Lin , Jia-Ren Liang
发明人： Cheng-Hsien Chou , Hung-Yi Yeh , Chia-Hung Lin , Jia-Ren Liang
IPC分类号： H05K1/03
CPC分类号： H05K3/4623 , H05K3/429 , H05K3/4602 , H05K3/4652 , H05K3/4688 , H05K2201/09509 , H05K2201/09536 , H05K2203/061
摘要： In manufacturing a multi-layer printed circuit board (PCB), different processes are employed for forming inner and outer circuit layers of the PCB. Particularly, second and third inner circuit layers of the multi-layer PCB are formed with the resin build-up process through liquid epoxy coating or dry film type epoxy laminating to enable refinement of circuits provided thereon, and two outer circuit layers of the multi-layer PCB are formed on copper clad and insulating dielectric with the lamination process to improve the thermal resistance, copper peel strength, structural stiffness, thermal stress reliability, and size stability of the completed PCB. The multi-layer PCB manufactured with two different processes has improved quality and reliability, and may be manufactured at reduced cost.
摘要翻译：在制造多层印刷电路板（PCB）时，采用不同的工艺来形成PCB的内层和外层电路层。特别地，多层PCB的第二和第三内部电路层通过液体环氧树脂涂层或干膜型环氧树脂层压形成树脂层叠工艺，以使得能够精细化设置在其上的电路，以及多层PCB的两个外部电路层，层压PCB通过层压工艺形成在铜包覆绝缘电介质上，以提高完成的PCB的热阻，铜剥离强度，结构刚度，热应力可靠性和尺寸稳定性。用两种不同工艺制造的多层PCB具有改进的质量和可靠性，并且可以以降低的成本制造。

5. 发明申请

US20050016762A1 Method of forming a multi-layer printed circuit board and the product thereof 审中-公开
标题翻译：形成多层印刷电路板的方法及其制品
公开(公告)号：US20050016762A1
公开(公告)日：2005-01-27
申请号：US10623592
申请日：2003-07-22
申请人： Cheng-Hsien Chou , Hung-Yi Yeh , Chia-Hung Lin , Jia-Ren Liang
发明人： Cheng-Hsien Chou , Hung-Yi Yeh , Chia-Hung Lin , Jia-Ren Liang
IPC分类号： H05K3/42 , H05K3/46 , H05K1/03
CPC分类号： H05K3/4623 , H05K3/429 , H05K3/4602 , H05K3/4652 , H05K3/4688 , H05K2201/09509 , H05K2201/09536 , H05K2203/061
摘要： In manufacturing a multi-layer printed circuit board (PCB), different processes are employed for forming inner and outer circuit layers of the PCB. Particularly, second and third inner circuit layers of the multi-layer PCB are formed with the resin build-up process through liquid epoxy coating or dry film type epoxy laminating to enable refinement of circuits provided thereon, and two outer circuit layers of the multi-layer PCB are formed on copper clad and insulating dielectric with the lamination process to improve the thermal resistance, copper peel strength, structural stiffness, thermal stress reliability, and size stability of the completed PCB. The multi-layer PCB manufactured with two different processes has improved quality and reliability, and may be manufactured at reduced cost.
摘要翻译：在制造多层印刷电路板（PCB）时，采用不同的工艺来形成PCB的内层和外层电路层。特别地，多层PCB的第二和第三内部电路层通过液体环氧树脂涂层或干膜型环氧树脂层压形成树脂层叠工艺，以使得能够精细化设置在其上的电路，以及多层PCB的两个外部电路层，层压PCB通过层压工艺形成在铜包覆绝缘电介质上，以提高完成的PCB的热阻，铜剥离强度，结构刚度，热应力可靠性和尺寸稳定性。用两种不同工艺制造的多层PCB具有改进的质量和可靠性，并且可以以降低的成本制造。

6. 发明申请

US20030064325A1 Method of manufacturing printed circuit board having wiring layers electrically connected via solid cylindrical copper interconnecting bodies 审中-公开
标题翻译：具有通过实心圆柱形铜互连体电连接的布线层的印刷电路板的制造方法
公开(公告)号：US20030064325A1
公开(公告)日：2003-04-03
申请号：US09969043
申请日：2001-10-03
申请人： Unitech Printed Circuit Board Corp.
发明人： Cheng-Hsien Chou , Chien-Jung Huang , Lin-Chuan Lee
IPC分类号： G03F007/00
CPC分类号： H05K3/4647 , H05K3/243 , H05K2203/0542 , H05K2203/0733
摘要： A method of manufacturing a printed circuit board (PCB) having wiring layers electrically connected via solid cylindrical copper interconnecting bodies includes the following steps: locally providing on a base or an insulated layer with a first copper foil wiring layer; fully coating the first wiring layer with a conductive layer; coating areas on the first wiring layer that are not used for interconnection purpose with a layer of dry-film resist to expose other areas on the first wiring layer to be used for interconnection purpose; removing the conductive layer by micro etching; forming solid cylindrical copper interconnecting bodies of a desired height on the interconnecting areas through electric plating; removing the dry-film resist, so that the solid cylindrical copper interconnecting bodies consisting of pure copper project from the interconnecting areas; and providing a second wiring layer over the first wiring layer.
摘要翻译：一种制造具有通过实心圆柱形铜互连体电连接的布线层的印刷电路板（PCB）的方法包括以下步骤：在基底或绝缘层上局部提供第一铜箔布线层; 用导电层完全涂覆第一布线层; 在第一布线层上涂覆不用于互连目的的一层干膜抗蚀剂，以露出用于互连目的的第一布线层上的其它区域; 通过微蚀刻去除导电层; 通过电镀在互连区域上形成所需高度的实心圆柱形铜互连体; 去除干膜抗蚀剂，使得由纯铜构成的实心圆柱形铜互连体从互连区域突出; 以及在所述第一布线层上设置第二布线层。

7. 发明授权

US08302299B2 Method of manufacturing a multilayer printed circuit board with a built-in electronic device 有权
标题翻译：制造具有内置电子设备的多层印刷电路板的方法
公开(公告)号：US08302299B2
公开(公告)日：2012-11-06
申请号：US13013491
申请日：2011-01-25
申请人： Cheng-Hsien Chou , Shun-Yueh Hsu , Kun-Chi Chen , Hung-Min Chen
发明人： Cheng-Hsien Chou , Shun-Yueh Hsu , Kun-Chi Chen , Hung-Min Chen
IPC分类号： H01K3/10
CPC分类号： H05K1/186 , H01L2224/04105 , H01L2224/2518 , H01L2224/92144 , H05K1/185 , H05K1/188 , H05K3/3442 , H05K2201/09063 , H05K2201/10106 , H05K2203/063 , H05K2203/1469 , H05K2203/167 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A method of manufacturing a multilayer printed circuit board of a built-in electronic device provides a substrate having a copper clad laminate and a first dielectric layer. The first dielectric layer is laminated onto the copper clad laminate and has a cavity for accommodating the electronic device. A second dielectric layer is laminated onto the substrate and electronic device to produce a base circuit board with an embedded electronic device. A build-up circuit layer is formed on the base circuit board. The first and second dielectric layers are made of a plastic material.
摘要翻译：制造内置电子器件的多层印刷电路板的方法提供了具有覆铜层压板和第一介电层的基板。将第一介电层层压到覆铜层压板上，并具有用于容纳电子器件的空腔。将第二电介质层层压到基板和电子器件上以产生具有嵌入式电子器件的基极电路板。在基板上形成积层电路层。第一和第二电介质层由塑料材料制成。

8. 发明申请

US20100055995A1 Precision printed circuit board testing tool 有权
公开(公告)号：US20100055995A1
公开(公告)日：2010-03-04
申请号：US12230341
申请日：2008-08-28
申请人： Po-Wen Kuo , Shun-Chi Yang
发明人： Po-Wen Kuo , Shun-Chi Yang
IPC分类号： H01R12/00
CPC分类号： G01R31/2812 , G01R1/06722 , H01R13/2421
摘要： A precision printed circuit board testing tool includes a testing tube, having a hollow chamber for installing a second resilient element, and the testing tube being electrically connected to a second testing line; a second testing element, installed in the hollow chamber, and having a second chamber and an opening, and the second testing element being pressed against by the second resilient element; a first testing element, having an internal bushing, a first resilient element and a probe, and including a first chamber for installing the first resilient element, and the probe being installed in the first chamber and pressed against by the first resilient element, and the first testing element being electrically connected to a first testing line. The testing tool is used for testing a PCB circuit with micro resistance to prevent defectives and damages of electronic components.

9. 发明申请

US20090056117A1 Method of partially attaching an material for various types of printed circuit boards 有权
标题翻译：部分连接各种印刷电路板的材料的方法
公开(公告)号：US20090056117A1
公开(公告)日：2009-03-05
申请号：US11892838
申请日：2007-08-28
申请人： Yu-Jen Chen , Kai-Hsiang Chiang
发明人： Yu-Jen Chen , Kai-Hsiang Chiang
IPC分类号： H05K3/00 , H05K1/11
CPC分类号： H05K1/189 , H05K1/0218 , H05K3/0061 , H05K3/0097 , H05K3/20 , H05K3/281 , H05K2201/09063 , H05K2203/0156 , H05K2203/0338 , H05K2203/0537 , H05K2203/166 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49144 , Y10T29/49155
摘要： In a method of partially attaching an additional attaching material for various types of printed circuit boards, the method attaches an additional attaching material partially onto circuit blocks after circuits of the circuit blocks are made on a flexible, rigid or mixed printed circuit board or an insulating layer is coated. The method sets an attaching material on a shaping material that covers the circuit blocks, uses a depth control tool to cut away areas not corresponding to those requiring to be attached onto the necessary circuit blocks, aligns the corresponding positions of the circuit blocks to perform pseudo attachment and pressing, and tears away the shaping material from the attaching material, so as to attach additional attaching materials properly onto the predetermined positions of the circuit blocks without requiring to attach the circuit blocks one by one, and achieve the effect of saving manufacturing time and avoiding misalignment.
摘要翻译：在部分地附接用于各种类型的印刷电路板的附加附着材料的方法中，该方法将电路块的电路在柔性，刚性或混合的印刷电路板或绝缘涂层。该方法在覆盖电路块的成形材料上设置附着材料，使用深度控制工具将不需要附着的区域切除到必要的电路块上的区域，对准电路块的对应位置以执行伪附着和压制，并从安装材料撕下成形材料，以便将附加的附着材料适当地附接到电路块的预定位置上，而不需要一个接一个地附接电路块，并且实现节省制造时间的效果并避免不对准。

10. 发明申请

US20070162698A1 Structure for connecting a USB communication interface in a flash memory card by the height difference of a rigid flexible board 有权
标题翻译：用于通过刚性柔性板的高度差连接闪存卡中的USB通信接口的结构
公开(公告)号：US20070162698A1
公开(公告)日：2007-07-12
申请号：US11304665
申请日：2005-12-16
申请人： Chou Hsien , Yu-Jen Chen , Chiang Hsiang , Ting Hung
发明人： Chou Hsien , Yu-Jen Chen , Chiang Hsiang , Ting Hung
IPC分类号： G06F12/00
CPC分类号： H05K1/117 , H05K1/189 , H05K3/4691 , H05K2201/10159
摘要： The present invention relates to a flash memory card that is a structure using a rigid flexible board (RFB) to connect a flash memory card unit and a universal serial bus (USB) unit. A communication interface in compliance with the specification of the flash memory card is disposed at one end of the flash memory card, and a USB communication interface is disposed at another end, and a rigid flexible board is provided for connecting the electric signals between the two communication interfaces and the bending characteristic is used to maintain the height difference between the planes of the two communication interface, so that the flash memory card can concurrently have the USB communication interface and enhance the applicability of the flash memory card.
摘要翻译：本发明涉及一种使用刚性柔性板（RFB）连接闪存卡单元和通用串行总线（USB）单元的结构的闪存卡。符合闪存卡规格的通信接口设置在闪存卡的一端，另一端设置有USB通信接口，并且提供刚性柔性板，用于连接两个之间的电信号通信接口和弯曲特性用于保持两个通信接口的平面之间的高度差，使得闪存卡可以同时具有USB通信接口并增强闪存卡的适用性。

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