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1. 发明申请

US20180217200A1 POSITIONING DEVICE FOR A PARALLEL TESTER FOR TESTING PRINTED CIRCUIT BOARDS AND PARALLEL TESTER FOR TESTING PRINTED CIRCUIT BOARDS 审中-公开
公开(公告)号：US20180217200A1
公开(公告)日：2018-08-02
申请号：US15747016
申请日：2016-06-17
申请人： Xcerra Corp.
发明人： Rüdiger Dehmel , Torsten Kaßbaum
IPC分类号： G01R31/28 , G01R35/00 , G01R1/073
CPC分类号： G01R31/2808 , G01R1/07378 , G01R31/2812 , G01R35/005
摘要： The invention relates to a positioning device for a parallel tester, a parallel tester, and a method for testing a circuit board. According to a first aspect of the invention, a positioning device is provided for fine adjustment purposes, in which the test adapter can be fastened to an inner holding piece of a holding device and the inner holding piece is supported so that it is able to move relative to the rest of the positioning device. As a bearing, only one or more swivel joints and/or one or more air bearings and/or one or more magnetic bearings is/are provided.

2. 发明申请

US20180174930A1 METHOD FOR TESTING BRIDGING IN ADJACENT SEMICONDUCTOR DEVICES AND TEST STRUCTURE 审中-公开
公开(公告)号：US20180174930A1
公开(公告)日：2018-06-21
申请号：US15814189
申请日：2017-11-15
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
发明人： Meng-Han LIN , Chia-Lin LIANG , Chih-Ren HSIEH
IPC分类号： H01L21/66 , G01R31/28 , H01L27/11517
CPC分类号： H01L22/14 , G01R31/2812 , H01L21/28273 , H01L22/20 , H01L22/34 , H01L27/11517 , H01L29/42328
摘要： Bridging testing method between adjacent semiconductor devices includes forming patterned diffusion region on semiconductor substrate, and forming first conductive layer over diffusion region. First conductive layer is patterned in same pattern as patterned diffusion region. Second conductive layer formed extending in first direction over first conductive layer. Second conductive layer is patterned to form opening extending in first direction in central region of second conductive layer exposing portion of first conductive layer. First conductive layer exposed portion is removed exposing portion of diffusion region. Source/drain region is formed over exposed portion of diffusion region, and dielectric layer is formed over source/drain region. Third conductive layer is formed over dielectric layer. End portions along first direction of second conductive layer removed to expose first and second end portions of first conductive layer. Electrical resistance across first conductive layer between first and second end portions of first conductive layer is measured.

3. 发明授权

US10002917B2 Circuit and method for repairing signal line disconnection and display panel 有权
公开(公告)号：US10002917B2
公开(公告)日：2018-06-19
申请号：US15532471
申请日：2016-05-24
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Jingbo Xu , Hongbo Feng , Yingzi Wang
IPC分类号： H01L27/32 , G01R31/28 , G09G3/20 , G06F3/041 , H01L27/12
CPC分类号： H01L27/3276 , G01R31/2812 , G02F1/1309 , G02F1/136259 , G02F2001/136263 , G06F3/0412 , G06F3/0416 , G09G3/2092 , G09G2310/0243 , G09G2310/0264 , G09G2330/08 , G09G2370/00 , H01L27/1244 , H01L27/3262
摘要： The present disclosure provides a circuit and method for repairing signal line disconnection and a display panel associated therewith. The circuit comprises a signal analysis module, a first control module and a second control module. The signal analysis module detects signals at a first and second node of a first signal line, and outputs a control signal at its output under control of the signals at the first and second node. Under control of the control signal, the first control module conductively connects the first node of a first signal line with a first node of a second signal line, and the second control module conductively connects the second node of the first signal line with a second node of the second signal line. The present disclosure may be applied to manufacturing of displays, which solves the problem that existing approaches for repairing signal line disconnection are time-consuming and low-efficiency.

4. 发明授权

US09990873B2 Display apparatus and method of testing the same 有权
公开(公告)号：US09990873B2
公开(公告)日：2018-06-05
申请号：US14621283
申请日：2015-02-12
申请人： SAMSUNG DISPLAY CO., LTD.
发明人： Hwan-Soo Jang , Won-Kyu Kwak , Jin-Tae Jeong
IPC分类号： G01R31/02 , G01R27/16 , G09G3/00 , G09G3/3225 , G01R31/28
CPC分类号： G09G3/006 , G01R31/2812 , G09G3/3225
摘要： A display apparatus includes: a display unit including a plurality of pixels connected to a plurality of scan lines and a plurality of data lines; an initialization unit for applying an initialization signal to the plurality of data lines; and a wire test unit for applying a wire test signal to the plurality of data lines through a plurality of fan-out lines respectively connected to one end of each of the plurality of data lines.

5. 发明申请

US20180059170A1 INSPECTION METHOD OF LAMINATED BOARD, INSPECTION MODULE, AND PALLET 审中-公开
公开(公告)号：US20180059170A1
公开(公告)日：2018-03-01
申请号：US15623413
申请日：2017-06-15
申请人： FUJITSU LIMITED
发明人： Mitsunori ABE , Takahiro Kitagawa , Shigeo Iriguchi , Kiyoyuki Hatanaka , Shigeru Sugino , Ryo Kanai
IPC分类号： G01R31/28
CPC分类号： G01R31/2818 , G01R31/2812 , G01R31/2817
摘要： A method for inspecting a laminated board, includes: performing a reflow process to solder an electronic component to a surface of a laminated board in which at least one of a plurality of wiring layers which are laminated with each other is coupled to another adjacent wiring layer via a via; and inspecting, in the reflow process, a conduction state of the via after a temperature of the laminated board reaches a melting point of a solder, and when the temperature of the laminated board is at a temperature range lower than the melting point and higher than room temperature.

6. 发明授权

US09874599B2 DC-DC device soldering detecting apparatus and method using the same 有权
公开(公告)号：US09874599B2
公开(公告)日：2018-01-23
申请号：US14444472
申请日：2014-07-28
申请人： BOE TECHNOLOGY GROUP CO., LTD. , BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY CO., LTD.
发明人： Wenkai Zhai , Litao Fan , Tianxiao Zhao , Ruifeng Yang
IPC分类号： G01R31/08 , G01R31/28 , G01R31/10 , G01R31/00 , G01R31/11 , G01R31/04 , G01R19/165 , G01R31/40
CPC分类号： G01R31/2812 , G01R19/16571 , G01R31/00 , G01R31/048 , G01R31/08 , G01R31/10 , G01R31/11 , G01R31/40
摘要： Embodiments of present invention provide a DC-DC device soldering detecting apparatus. The apparatus may include a power module adapted to input a preset voltage into the DC-DC device on a circuit board, a frequency generating module adapted to input a preset clock frequency signal into the DC-DC device, and a voltage detecting and determining module adapted to detect soldering quality of the DC-DC device on the circuit board based on an output voltage of the DC-DC device.

7. 发明申请

US20170245366A1 DUAL PRINTED CIRCUIT BOARD ASSEMBLY, PRINTED CIRCUIT BOARD AND MODULAR PRINTED CIRCUIT BOARD 审中-公开
公开(公告)号：US20170245366A1
公开(公告)日：2017-08-24
申请号：US15222969
申请日：2016-07-29
申请人： Wistron NeWeb Corp.
发明人： Cheng-Hsien Hsu , Chih-Yuan Chiang , Cheng-Huang Chen
IPC分类号： H05K1/14 , H05K1/11 , G01R31/28 , H05K1/02
CPC分类号： H05K1/144 , G01R31/2812 , G01R31/2818 , H05K1/0268 , H05K1/11 , H05K2201/042 , H05K2201/0776
摘要： A dual printed circuit board assembly, a printed circuit board, and a modular printed circuit board are provided. The printed circuit board includes a plurality of first connection points. The modular printed circuit board includes a plurality of second connection points. The modular printed circuit board is adapted to be mounted on the printed circuit board and includes a sensing unit, a first detecting unit, and a first notifying unit. The sensing unit outputs a detecting voltage according to a contact state between the first connection points and the second connection points. The first detecting unit determines whether the first connection points are respectively connected to the corresponding second connection points according to the detecting voltage. When one of the first connection points is not connected to the corresponding one of the second connection points, the first detecting unit controls the first notifying unit to issue a notification.

8. 发明申请

US20170064812A1 PRINTED CIRCUIT BOARD FOR ALLOWING DETECTION OF A FALLEN OFF PART AND CIRCUIT FOR DETECTING A FALLEN OFF PART 审中-公开
标题翻译：印刷电路板，用于检测未分类的部件和电路，用于检测未分类的部件
公开(公告)号：US20170064812A1
公开(公告)日：2017-03-02
申请号：US15244457
申请日：2016-08-23
申请人： FANUC CORPORATION
发明人： Takahiro Baba , Kazuki Sakamoto
IPC分类号： H05K1/02 , H05K1/18
CPC分类号： H05K1/0213 , G01R31/2812 , G01R31/2813 , H05K1/0209 , H05K1/0268 , H05K1/18 , H05K3/4015 , H05K2201/066
摘要： A printed circuit board allows detection of whether or not a part that is mounted on the printed circuit board and that is not electrically connected to the printed circuit board for conventional use has fallen off from the printed circuit board, and is provided with a number of conductive members that make contact with a number of connection portions, respectively, provided on the above-described mounted part and that are used for determining whether or not the above-described mounted part has fallen off from the above-described printed circuit board.
摘要翻译：印刷电路板允许检测安装在印刷电路板上并且不电连接到常规用途的印刷电路板的部件是否已经从印刷电路板掉下来，并且设置有多个分别设置在上述安装部件上并用于确定上述安装部件是否已经脱离上述印刷电路板的导电部件与多个连接部分接触。

9. 发明授权

US09400300B2 Electric circuit evaluation method 有权
标题翻译：电路评估方法
公开(公告)号：US09400300B2
公开(公告)日：2016-07-26
申请号：US14296554
申请日：2014-06-05
申请人： ROHM CO., LTD.
发明人： Noriaki Hiraga
IPC分类号： G01R31/02 , G01R23/02 , G01R31/00 , G01R19/00 , G01R31/28
CPC分类号： G01R31/002 , G01R19/0084 , G01R19/0092 , G01R23/02 , G01R31/021 , G01R31/024 , G01R31/2805 , G01R31/2812
摘要： The electric circuit evaluation method according to the present invention comprises: a step for finding a malfunction power frequency property, in which the magnitude of a critical noise signal at which a designated electric circuit causes a malfunction is represented by the power injected into the designated electric circuit; and a step for finding a malfunction current frequency property, in which the magnitude of the critical noise signal at which the designated electric circuit causes a malfunction is represented by a current (I_LSI) flowing to a predetermined portion of the designated electric circuit, and a malfunction voltage frequency property, in which the magnitude of the critical noise signal at which the designated electric circuit causes a malfunction is represented by a voltage (V_LSI) occurring between predetermined points of the designated electric circuit, both of which properties found from the malfunction power frequency property.
摘要翻译：根据本发明的电路评估方法包括：用于找到故障功率频率特性的步骤，其中指定电路导致故障的临界噪声信号的大小由注入指定电力的功率表示电路以及用于发现指定电路导致故障的临界噪声信号的大小由流向指定电路的预定部分的电流（I_LSI）表示的故障电流频率特性的步骤，以及指定电路导致故障的临界噪声信号的大小由指示电路的预定点之间出现的电压（V_LSI）表示的故障电压频率特性，从故障功率频率属性。

10. 发明申请

US20150355257A1 CIRCUIT TESTING METHOD AND CIRCUIT TESTING SYSTEM 有权
标题翻译：电路测试方法和电路测试系统
公开(公告)号：US20150355257A1
公开(公告)日：2015-12-10
申请号：US14416530
申请日：2014-07-02
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Chunwei WU , Woobong LEE
IPC分类号： G01R31/02 , G06F3/044 , G09G3/00
CPC分类号： G01R31/025 , G01R27/26 , G01R31/2812 , G01R31/2829 , G06F3/0418 , G06F3/044 , G09G3/006
摘要： The present disclosure provides a circuit testing method and a circuit testing system for testing the circuit of a transmissive capacitive touch panel, wherein, the method comprises: when testing a certain induction line in a first electrode matrix or a second electrode matrix, configuring all induction lines in the first electrode matrix and the second electrode matrix except for the induction line to be tested as ground wires, applying a first voltage to the induction line to be tested, and detecting current on the induction line to be tested, and determining that the induction line to be tested is in a short-circuit state when the current is generated on the induction line to be tested; repeating the above step, and testing other induction lines in turn.
摘要翻译：本公开内容提供了一种用于测试透射电容式触摸屏的电路的电路测试方法和电路测试系统，其中，该方法包括：当在第一电极矩阵或第二电极矩阵中测试某一感应线时，配置所有感应第一电极矩阵和第二电极矩阵之间的线，除了待测试的感应线作为接地线，对待测试的感应线施加第一电压，以及检测待测试的感应线上的电流，并且确定当要在被测试的感应线上产生电流时，要测试的感应线处于短路状态; 重复上述步骤，并依次测试其他感应线。

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