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    • 9. 发明申请
    • TRANSPARENT RESIN SUBSTRATE
    • 透明树脂基材
    • US20140248478A1
    • 2014-09-04
    • US14352850
    • 2011-10-26
    • Masahiro SaitoTeppei Itamoto
    • Masahiro SaitoTeppei Itamoto
    • B29C45/14
    • B29C45/14811B29K2995/0026B29K2995/0031B29K2995/007C08J7/042C08J7/045C08J2475/16C08J2483/02Y10T428/24967Y10T428/249974
    • The transparent resin substrate has a light-transmitting thermoplastic resin underlying sheet 1 and a hard coating formed on one surface of the underlying sheet, wherein the hard coating includes a resin component obtained by curing an urethane acrylate that contains a tri-functional or less functional urethane acrylate and a tetra-functional or more functional urethane acrylate; a silane coupling agent or a hydrolyzed product thereof, a silica sol having a grain size of 5 to 500 nm and a refractive index in a range of 1.44 to 1.5; and a metal chelate compound. A low refractive index layer is formed on the hard coating, the low refractive index layer includes a low refractive index hollow silica sol having a grain size of 10 to 150 nm and a refractive index of not more than 1.44, the silane coupling agent or the hydrolyzed product thereof, and a metal chelate compound.
    • 所述透明树脂基板具有在所述基板1的下方的透光性热塑性树脂和形成在所述下层片材的一个表面上的硬涂层,其中,所述硬质被膜包含通过固化含有三官能以上官能团的氨基甲酸酯丙烯酸酯而得到的树脂成分 氨基甲酸酯丙烯酸酯和四官能或更多官能的聚氨酯丙烯酸酯; 硅烷偶联剂或其水解产物,粒径为5〜500nm,折射率在1.44〜1.5的硅溶胶; 和金属螯合物。 在硬涂层上形成低折射率层,低折射率层包括粒径为10〜150nm,折射率不大于1.44的低折射率中空硅溶胶,硅烷偶联剂或 水解产物和金属螯合物。