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1. 发明申请

US20120242748A1 SCREEN PRINTED FUNCTIONAL MICROSYSTEMS 审中-公开
标题翻译：屏幕打印功能微结构
公开(公告)号：US20120242748A1
公开(公告)日：2012-09-27
申请号：US13498487
申请日：2009-09-28
申请人： Ioannis Katakis , Diego Bejarano , Pablo Lozano Sanchez
发明人： Ioannis Katakis , Diego Bejarano , Pablo Lozano Sanchez
IPC分类号： B41J2/135 , B41M1/12
CPC分类号： B41J2/135 , B01L3/502707 , B01L2300/0645 , B01L2300/0887 , B33Y80/00 , B81C1/00071 , B81C2201/0184 , B81C2201/0185
摘要： Micro fluidic devices comprising three dimensional elements fabricated onto a substrate using thick film printing technology, e.g., screen printing, wherein the three dimensional elements possess both structural and functional properties.
摘要翻译：微流体装置包括使用厚膜印刷技术（例如丝网印刷）制造在基底上的三维元件，其中三维元件具有结构和功能特性。

2. 发明申请

US20180230002A1 MICROELECTROMECHANICAL DEVICE AND METHOD FOR MANUFACTURING IT 审中-公开
公开(公告)号：US20180230002A1
公开(公告)日：2018-08-16
申请号：US15954128
申请日：2018-04-16
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Heikki KUISMA , Matti MANTYSALO
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0006 , B81B2207/07 , B81C1/00095 , B81C1/00373 , B81C2201/0184
摘要： A device and method utilizes interconnecting layers separated by an insulating layer. A layered structure comprises a first and a second layer of electrically conductive material, and a third layer of electrically insulating material between them. A via trench is fabricated that extends from the second layer through the third layer into the first layer, a surface on the first layer of electrically conductive material forming a bottom surface of the via trench. An ink-jetting set-up for a mixture of liquid carrier and nanoparticles of conductive material is formed, and a specific process period is determined. Capillary flow of nanoparticles to peripheral edges of an ink-jetted blob of said mixture is induced. The mixture is ink-jetted into a blob on the via trench; the layered structure is heated to evaporate the liquid carrier. The interconnection element is higher at a certain point than between opposing side walls.

3. 发明授权

US09090456B2 System and method of manufacturing an electromechanical device by printing raised conductive contours 有权
标题翻译：通过印刷凸起的导电轮廓来制造机电装置的系统和方法
公开(公告)号：US09090456B2
公开(公告)日：2015-07-28
申请号：US12619521
申请日：2009-11-16
申请人： Nassim Khonsari
发明人： Nassim Khonsari
IPC分类号： H05K3/02 , B81B7/00
CPC分类号： B81B7/007 , B81B2201/042 , B81B2207/07 , B81B2207/098 , B81C2201/0184 , B81C2203/0109 , Y10T29/49002 , Y10T29/51
摘要： A system and method for manufacturing a display device having an electrically connected front plate and back plate are disclosed. In one embodiment, the method comprises printing conductive raised contours onto a non-conductive back plate, aligning the back plate with a non-conductive front plate such that the raised contours align with conductive routings on the front plate to electrically connect the raised contours and the routings, and sealing the back plate and the front plate.
摘要翻译：公开了一种用于制造具有电连接的前板和背板的显示装置的系统和方法。在一个实施例中，该方法包括将导电凸起轮廓印刷到非导电背板上，将该背板与不导电的前板对准，使得凸起轮廓与前板上的导电路线对准以电连接凸起轮廓和路由，并密封后板和前板。

4. 发明申请

US20140205761A1 METHOD FOR NANO-DRIPPING 1D, 2D OR 3D STRUCTURES ON A SUBSTRATE 审中-公开
标题翻译：用于在基板上划分1D，2D或3D结构的方法
公开(公告)号：US20140205761A1
公开(公告)日：2014-07-24
申请号：US14129480
申请日：2012-06-25
申请人： Patrick Galliker , Julian Schneider , Dimos Poulikakos , Vahid Sandoghdar , Mohammad Hadi Eghlidi
发明人： Patrick Galliker , Julian Schneider , Dimos Poulikakos , Vahid Sandoghdar , Mohammad Hadi Eghlidi
IPC分类号： B81C99/00
CPC分类号： B81C99/00 , B81C99/0095 , B81C2201/0184
摘要： A method for the production of nano- or microscaled ID, 2D and/or 3D depositions from an solution (6), by means of a liquid reservoir (2) for holding the ink with an outer diameter (3,D) of at least 50 nm, is proposed, wherein there is provided an electrode (7,8 or 9) in contact with said ink (6) in said capillary (2), and wherein there is a counter electrode in and/or on and/or below and/or above a substrate (15) onto which the depositions are to be produced, including the steps of: i) keeping the electrode (7, 8, 9) and the counter electrode (15, 18) on an essentially equal potential; ii) establishing a potential difference between the electrode (7, 8, 9) and the counter electrode (15, 18) leading to the growth of an ink meniscus (1) at the nozzle (3) and to the ejection of droplets (13) at this meniscus with a homogeneous size smaller than the meniscus size (11) at a homogenous ejection frequency; keeping the voltage applied while the continuously dried droplets leave behind the dispersed material which leads a structure to emerge with essentially the same diameter as a single droplet, wherein the distance between the substrate (1) and the nozzle (3) is smaller than or equal to 20 times the meniscus diameter at least at the moment of nano-droplet ejection (12); wherein the conductivity of the ink (6) is high enough to stabilize the liquid meniscus during droplet ejection;
摘要翻译：一种用于通过液体储存器（2）从溶液（6）生产纳米或微观ID，2D和/或3D沉积物的方法，用于将油墨保持至少至少具有外径（3，D） 50nm，其中提供了与所述毛细管（2）中的所述油墨（6）接触的电极（7,8或9），并且其中在和/或之上和/或下方存在对电极和/或在其上要生成沉积物的衬底（15）上方，包括以下步骤：i）保持电极（7,8,9）和对电极（15,18）的电位基本相等; ii）建立电极（7,8,9）和相对电极（15,18）之间的电位差，导致在喷嘴（3）处生成墨水弯液面（1）和喷射液滴（13））在均匀喷射频率下具有小于弯月面尺寸（11）的均匀尺寸的弯月面; 保持施加的电压，而连续干燥的液滴留下分散的材料，导致结构以与单个液滴基本相同的直径出现，其中基板（1）和喷嘴（3）之间的距离小于或等于至少在纳米液滴喷射时（12）的弯液面直径的20倍; 其中所述油墨（6）的电导率足够高以在液滴喷射期间稳定所述液体弯液面;

5. 发明授权

US07658831B2 Three dimensional microstructures and methods for making three dimensional microstructures 有权
标题翻译：制作三维微结构的三维微结构和方法
公开(公告)号：US07658831B2
公开(公告)日：2010-02-09
申请号：US11306291
申请日：2005-12-21
申请人： Gaetan L. Mathieu , Treliant Fang , Eric D. Hobbs
发明人： Gaetan L. Mathieu , Treliant Fang , Eric D. Hobbs
IPC分类号： C25D5/02
CPC分类号： B81C1/0046 , B33Y10/00 , B81B2201/014 , B81B2203/0118 , B81C2201/0184 , B81C2201/0197 , C23C18/1608 , C23C18/1844 , C25D1/003 , C25D1/12 , C25D5/02 , G01R1/06755 , G01R3/00 , H01L21/288 , H01L21/76873 , H01L2924/0001 , H01L2924/0002 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/1461 , H05K3/1275 , H01L2224/13099 , H01L2924/00
摘要： Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.
摘要翻译：公开了用于在三维阵列中沉积多个液滴的系统和方法。阵列可以包括设置成形成支撑结构的第一类型的液滴和在支撑结构上形成导电种子层的第二类型的液滴。可以将结构材料电沉积到种子层上以产生三维结构。

6. 发明授权

US09969607B2 Microelectromechanical device and method for manufacturing it 有权
公开(公告)号：US09969607B2
公开(公告)日：2018-05-15
申请号：US15372660
申请日：2016-12-08
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Heikki Kuisma , Matti Mäntysalo
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0006 , B81B2207/07 , B81C1/00095 , B81C1/00373 , B81C2201/0184
摘要： A device and method utilizes interconnecting layers separated by an insulating layer. A layered structure comprises a first and a second layer of electrically conductive material, and a third layer of electrically insulating material between them. A via trench is fabricated that extends from the second layer through the third layer into the first layer, a surface on the first layer of electrically conductive material forming a bottom surface of the via trench. An ink-jetting set-up for a mixture of liquid carrier and nanoparticles of conductive material is formed, and a specific process period is determined. Capillary flow of nanoparticles to peripheral edges of an ink-jetted blob of said mixture is induced. The mixture is ink-jetted into a blob on the via trench; the layered structure is heated to evaporate the liquid carrier. The interconnection element is higher at a certain point than between opposing side walls.

7. 发明申请

US20170166440A1 MICROELECTROMECHANICAL DEVICE AND METHOD FOR MANUFACTURING IT 有权
公开(公告)号：US20170166440A1
公开(公告)日：2017-06-15
申请号：US15372660
申请日：2016-12-08
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Heikki KUISMA , Matti MÄNTYSALO
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0006 , B81B2207/07 , B81C1/00095 , B81C1/00373 , B81C2201/0184
摘要： A device and method utilizes interconnecting layers separated by an insulating layer. A layered structure comprises a first and a second layer of electrically conductive material, and a third layer of electrically insulating material between them. A via trench is fabricated that extends from the second layer through the third layer into the first layer, a surface on the first layer of electrically conductive material forming a bottom surface of the via trench. An ink-jetting set-up for a mixture of liquid carrier and nanoparticles of conductive material is formed, and a specific process period is determined. Capillary flow of nanoparticles to peripheral edges of an ink-jetted blob of said mixture is induced. The mixture is ink-jetted into a blob on the via trench; the layered structure is heated to evaporate the liquid carrier. The interconnection element is higher at a certain point than between opposing side walls.

8. 发明申请

US20150110689A1 METHOD FOR MANUFACTURING MODULAR MICROFLUIDIC PAPER CHIPS USING INKJET PRINTING 审中-公开
标题翻译：使用喷墨打印制造模块化微流纸的方法
公开(公告)号：US20150110689A1
公开(公告)日：2015-04-23
申请号：US14398455
申请日：2013-05-02
申请人： INDUSTRY-UNIVERSITY COOPERATION FOUNDATION SOGANG UNIVERSITY
发明人： Kwan Woo Shin , Hyo Jin Ko , Oh-Sun Kwon , Han-Su Kim , Jae Hak Choi , Byeong No Lee , Ju Mi Lee
IPC分类号： B01L3/00
CPC分类号： B01L3/502707 , B01L2300/0645 , B01L2300/0887 , B01L2300/126 , B01L2400/0406 , B01L2400/0427 , B81B2201/058 , B81B2203/04 , B81C1/00373 , B81C2201/0184 , Y10T29/49117
摘要： The present invention relates to a method for manufacturing a module type microfluidic chip comprising: (a) printing electrode patterns on a substrate using a conductive ink and inkjet printing; (b) cutting the printed electrode patterns; and (c) assembling the cut electrode patterns to manufacture the module type microfluidic paper chip. Unlike the traditional method for manufacturing printed circuit substrate using a patterning agent or device, the method of the present invention only incorporates a simple printing process using an inkjet printer, and thus patterning can be simplified and various types of chips can be manufactured depending on the assembly type of electrode patterns. Accordingly, inexpensive, economical, and highly utilizable microfluidic chips can be provided using the method of the present invention.
摘要翻译：本发明涉及一种用于制造模块型微流控芯片的方法，包括：（a）使用导电油墨和喷墨印刷在基板上印刷电极图案; （b）切割印刷的电极图案; 和（c）组装切割的电极图案以制造模块型微流体纸芯片。与使用图案化剂或装置制造印刷电路基板的传统方法不同，本发明的方法仅采用使用喷墨打印机的简单印刷方法，因此可以简化图形化，并且可以根据组装类型的电极图案。因此，可以使用本发明的方法提供廉价，经济且高度可利用的微流控芯片。

9. 发明授权

US08021593B2 Method of producing a three-dimensional structure and fine three-dimensional structure 有权
标题翻译：制造三维结构和精细三维结构的方法
公开(公告)号：US08021593B2
公开(公告)日：2011-09-20
申请号：US10566476
申请日：2004-07-29
申请人： Kazuhiro Murata , Hiroshi Yokoyama
发明人： Kazuhiro Murata , Hiroshi Yokoyama
IPC分类号： B05D3/00 , B29C35/00 , B05D5/00
CPC分类号： B81C1/00111 , B81C99/0095 , B81C2201/0184
摘要： A method of producing a three-dimensional structure contains the steps of: arranging a substrate close to a tip of a needle-shaped fluid-ejection body having a fine diameter supplied with a solution, ejecting a fluid droplet having an ultra-fine diameter toward a surface of the substrate by applying a voltage having a prescribed waveform to the needle-shaped fluid-ejection body, making the droplet fly and land on the substrate, and solidifying the droplet after the fluid droplet is landed on the substrate; further a three-dimensional structure has a fine diameter comprises droplets having an ultra-fine particle diameter, wherein the structure is grown by solidifying the droplets and stacking the solidified droplets.
摘要翻译：一种制造三维结构的方法包括以下步骤：将具有细小直径的针状流体喷射体的尖端附近的基板配置在与溶液一体的状态下，将具有超细直径的液滴喷射向通过向针状流体喷射体施加具有规定波形的电压的基板的表面，使得液滴飞溅并落在基板上，并且在液滴落在基板上之后使液滴固化; 此外，具有细小直径的三维结构包括具有超细粒径的液滴，其中通过使液滴凝固并堆积固化的液滴来生长该结构。

10. 发明申请

US20110209970A1 SWITCH AND METHOD FOR MANUFACTURING THE SAME, AND RELAY 审中-公开
标题翻译：开关及其制造方法和继电器
公开(公告)号：US20110209970A1
公开(公告)日：2011-09-01
申请号：US13029898
申请日：2011-02-17
申请人： Takahiro Masuda , Naoki Yoshitake , Kenichi Hinuma , Junya Yamamoto , Takashi Fujisawa , Takeshi Fujiwara
发明人： Takahiro Masuda , Naoki Yoshitake , Kenichi Hinuma , Junya Yamamoto , Takashi Fujisawa , Takeshi Fujiwara
IPC分类号： H01H59/00 , H01H11/00
CPC分类号： H01H1/06 , B81B2201/014 , B81C1/00166 , B81C2201/0177 , B81C2201/0181 , B81C2201/0184 , H01H1/0036 , H01H2001/0052 , Y10T29/49105
摘要： A switch and a relay include a contact with a smooth contacting surface. A side surface of a fixed contact faces a side surface of a movable contact. The fixed contact has an insulating layer and a base layer stacked on a fixed contact substrate, and a first conductive layer formed thereon through electrolytic plating. The side surface of the first conductive layer that faces the movable contact becomes the fixed contact (contacting surface). The movable contact has an insulating layer and a base layer stacked on the movable contact substrate, and a movable contact formed thereon through electrolytic plating. A side surface of a second conductive layer that faces the fixed contact becomes the movable contact (contacting surface). The fixed contact and the movable contact have surfaces that contact the side surfaces of the mold portion when growing the first and second conductive layers through electrolytic plating.
摘要翻译：开关和继电器包括具有光滑接触表面的触点。固定触点的侧表面面对活动触点的侧表面。固定触点具有层叠在固定接触基板上的绝缘层和基层，以及通过电解电镀形成在其上的第一导电层。第一导电层的面对可动触点的侧表面成为固定触点（接触面）。可动触头具有堆叠在可动触点基板上的绝缘层和基极层，以及通过电解电镀形成的可动触点。面对固定触点的第二导电层的侧表面成为可动触头（接触面）。固定触点和可动触点具有通过电解电镀生长第一和第二导电层时与模具部分的侧表面接触的表面。

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