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    • 9. 发明申请
    • Brittle Material Substrate Chamfering Method
    • 脆性材料基板倒角法
    • US20110107894A1
    • 2011-05-12
    • US12995011
    • 2009-04-27
    • Kazuya MaekawaRyota SakaguchiTomoki Nakagaki
    • Kazuya MaekawaRyota SakaguchiTomoki Nakagaki
    • B26D3/02
    • B28D1/225B24B9/10C03B33/023C03B33/033C03B33/09C03B33/091C03B33/105C03B33/107Y10T83/0259
    • [Issue] A chamfering method is provided that can be conducted even in small worksite space without using grinding members and without requiring a cleaning process after a chamfering process.[Resolution Means] A brittle material substrate chamfering method according to the present invention includes steps of drawing a scribing line, and heating and/or cooling a part in proximity to the scribing line. The scribing line is drawn on a part of a surface of a brittle material substrate that extends along the edge of the brittle material substrate and has a width not more than 50% of the thickness of the brittle material substrate starting from the edge of the brittle material substrate whereby forming a crack inclined from the surface of the substrate toward a side end surface of the substrate. A part in proximity to the scribing line is heated and/or cooled so that a corner part of the edge of said brittle material substrate is cut out whereby chamfering said brittle material substrate. In the step of drawing a scribing line on the part of a surface of a brittle material substrate, a cutter wheel is preferably used that has a plurality of inclined grooves along the circumferential edge line as cutting edge. The inclined grooves are inclined at a predetermined angle relative to the axial direction of the cutter wheel.
    • [问题]提供了一种即使在小型工地空间中也可以进行倒角的方法,而不使用研磨构件,并且在倒角加工之后不需要清洁处理。 [分辨率方法]根据本发明的脆性材料基板倒角方法包括绘制划线,并且对靠近划线的部件进行加热和/或冷却的步骤。 划痕线被描绘在脆性材料基材的沿着脆性材料基材的边缘延伸的表面的一部分上,其宽度不大于脆性材料基材厚度的50%,从脆性材料的边缘开始 从而形成从基板的表面朝向基板的侧端面倾斜的裂纹。 加热和/或冷却与划刻线相邻的部分,从而切割所述脆性材料基材的边缘的角部,由此对所述脆性材料基板进行倒角。 在脆性材料基板的表面部分划线的步骤中,优选使用具有沿周缘边缘线的多个倾斜槽作为切削刃的切割轮。 倾斜槽相对于切割轮的轴向以预定的角度倾斜。
    • 10. 发明授权
    • Scribing method
    • 划线方法
    • US06478206B2
    • 2002-11-12
    • US09544299
    • 2000-04-06
    • Gyo ShimotoyodomeHirokazu IshikawaTakeki Shirai
    • Gyo ShimotoyodomeHirokazu IshikawaTakeki Shirai
    • B65H3510
    • C03B33/105C03B33/10Y02P40/57Y10T83/0333Y10T83/0341Y10T225/12Y10T225/321
    • A method of forming a scribe line on a work surface is carried out by a scribing apparatus comprising a scribe body including an abutment member, such as cutter provided with an penetrator, having at least first and second ridgelines and a sharp tip end portion and a vibration generating member for periodically applying vibrations to the abutment member. A vibration is applied to the abutment member with the tip end portion thereof abutting against the work surface, and the scribe body is relatively moved along the work surface to thereby form a scribe line on the work surface. In this scribing method, a first angle constituted by the first ridgeline of the abutment member and the work surface and a second angle constituted by the second ridgeline thereof and the work surface are made different from each other and the first and second ridgelines are opposed in the moving direction of the scribe body.
    • 在工作表面上形成划线的方法是通过包括具有至少具有第一和第二脊线和尖端部的诸如具有穿透器的切割器的抵接构件的划线体的划线装置来进行的, 用于周期性地向抵接构件施加振动的振动产生构件。 振动施加到邻接构件,其顶端部抵靠工件表面,并且划线体沿着工作表面相对移动,从而在工作表面上形成划线。 在这种划线方法中,由抵接构件的第一脊线和工作面构成的第一角度和由其第二脊线与工作面构成的第二角度彼此不同,并且第一和第二脊线相对于 抄写员身体的移动方向。