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1. 发明申请

US20180230284A1 POROUS PARTICLE MADE OF ORGANIC POLYMER, METHOD FOR PRODUCING POROUS PARTICLE MADE OF ORGANIC POLYMER, AND BLOCK COPOLYMER 审中-公开
公开(公告)号：US20180230284A1
公开(公告)日：2018-08-16
申请号：US15751743
申请日：2016-08-05
申请人： KYOTO UNIVERSITY , EMAUS KYOTO, INC. , KOSEN NATIONAL INSTITUTE OF TECHNOLOGY
发明人： Norio ISHIZUKA , Kyoko KONISHI , Toshikazu ODA , Yoshinobu TSUJII , Keita SAKAKIBARA , Takaya SATO
IPC分类号： C08J9/28 , C08G59/32 , C08G59/50 , C08F22/10 , C08F293/00
CPC分类号： C08J9/286 , A61K8/81 , A61K8/84 , B01J20/264 , B01J20/28016 , B01J20/285 , B01J20/3064 , C08F22/105 , C08F293/00 , C08F293/005 , C08G59/3218 , C08G59/3245 , C08G59/5026 , C08J9/0061 , C08J2201/0543 , C08J2205/05 , C08J2335/02 , C08J2363/00 , C08J2453/00
摘要： The present invention provides porous particles made of an organic polymer, uniform in shape, and having through holes that are not closed. The porous particles according to the present invention are porous particles having a substantially spherical shape. The porous particles are made of an organic polymer. Each of the porous particles has an interconnected pore structure in which through holes provided inside the porous particle communicate with each other, and ends of the through holes are open toward an outside of the porous particle.

2. 发明申请

US20180134839A1 MONOMERIC AND OLIGOMERIC RESINS FOR ONE DROP FILL SEALANT APPLICATION 审中-公开
公开(公告)号：US20180134839A1
公开(公告)日：2018-05-17
申请号：US15871051
申请日：2018-01-14
申请人： Henkel IP & Holding GmbH , Henkel AG & Co. KGaA
发明人： Laxmisha M. Sridhar , Baoshan Gao , Jing Zhou , Qin Li , Wenhua Zhang , Shengian Kong , John G. Woods , Anthony F. Jacobine
IPC分类号： C08G59/40 , C08G59/02 , C09J171/12 , C08K5/3415
CPC分类号： C08G59/4014 , C08G59/02 , C08G59/3218 , C08K5/3415 , C08L33/02 , C09J163/00 , C09J163/10 , C09J171/02 , C09J171/12 , G02F1/13
摘要： The present invention relates to curable novel resins and prepolymers, methods of manufacture and compositions made therefrom. Particularly useful applications include one drop fill sealant used in liquid crystal assembly. In particular, the inventive resins and prepolymers and compositions are useful in the assembly of LCD panels.

3. 发明授权

US09963541B2 Photosensitive resin composition for optical waveguide, photocurable film for formation of optical waveguide core layer, optical waveguide produced by using the resin composition or the photocurable film, and hybrid flexible printed wiring board for optical/electrical transmission 有权
公开(公告)号：US09963541B2
公开(公告)日：2018-05-08
申请号：US15108804
申请日：2015-01-27
申请人： NITTO DENKO CORPORATION
发明人： Tomoyuki Hirayama , Naoya Sugimoto
IPC分类号： G02B6/12 , G02B6/138 , C08G59/32 , C08G59/38 , C09D163/00 , C09D171/00 , G02B6/10 , C08L63/00 , C08G59/40 , C08G65/22 , G02B6/122 , C08G59/24 , C08G59/68 , C08G65/18
CPC分类号： C08G59/3218 , C08G59/24 , C08G59/38 , C08G59/4007 , C08G59/687 , C08G65/18 , C08G65/22 , C08L63/00 , C09D163/00 , C09D171/00 , G02B6/10 , G02B6/12 , G02B6/1221 , G02B6/138 , G02B2006/1219
摘要： According to the present invention, a photosensitive resin composition for an optical waveguide contains a resin component and a photopolymerization initiator. The resin component has an absorbance of less than 0.03 as measured at 2960 cm−1 by an attenuated total reflection measurement (ATR) method by means of a Fourier transform infrared spectrophotometer (FT-IR), and includes a polymerizable substituent-containing resin as a main component. Where the inventive optical waveguide photosensitive resin composition is used as a material for the optical waveguide, particularly as a core layer formation material for the optical waveguide, it is possible to reduce a loss, for example, by avoiding vibrational absorption occurring at an optical waveguide transmission light wavelength of 850 nm due to a resin skeleton.

4. 发明申请

US20170327629A1 POLYPHENOLIC CONDENSATES AND EPOXY RESINS THEREOF 审中-公开
公开(公告)号：US20170327629A1
公开(公告)日：2017-11-16
申请号：US15581171
申请日：2017-04-28
申请人： Chang Chun Plastics Co., Ltd.
发明人： Yu-Jen CHEN , Sung-Kuang CHUNG , Chang-Lin HUNG , An-Pang TU , Kuen-Yuan HWANG
IPC分类号： C08G59/08 , C08L61/14 , C08G59/32 , C08G8/04 , C08G59/18 , C08G14/12 , C08L63/00 , C08G59/62
CPC分类号： C08G59/08 , C08G8/04 , C08G8/36 , C08G14/12 , C08G59/186 , C08G59/3218 , C08G59/625 , C08L61/14 , C08L63/00
摘要： Polyphenolic condensates and epoxidized products prepared from said condensates are prepared by a reaction utilizing multi catalysts to control the weight average molecular weight (Mw) and the number average molecular weight (Mn). Improved color and ultraviolet absorbance are possessed by the condensates described herein.

5. 发明申请

US20170313043A1 CURABLE EPOXY COMPOSITION AND FILM, LAMINATED FILM, PREPREG, LAMINATE, CURED ARTICLE, AND COMPOSITE ARTICLE OBTAINED USING SAME 审中-公开
公开(公告)号：US20170313043A1
公开(公告)日：2017-11-02
申请号：US15520513
申请日：2014-10-27
申请人： ZEON CORPORATION
发明人： Makoto Fujimura , Takeshi Sakano
IPC分类号： B32B27/38 , C08G59/32 , C08J5/18 , C08G59/62 , C08G59/38 , C08G59/24
CPC分类号： B32B27/38 , B32B15/092 , B32B15/14 , B32B15/20 , B32B2250/03 , B32B2250/40 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/202 , B32B2307/206 , B32B2307/732 , B32B2457/00 , C08G59/245 , C08G59/32 , C08G59/3218 , C08G59/38 , C08G59/62 , C08G59/623 , C08J5/18 , C08J7/047 , C08J2363/02 , C08J2367/02 , C08J2463/02 , C08L63/00 , H05K1/0346 , H05K3/4676 , C08L61/04 , C08L63/04
摘要： A curable epoxy composition comprising a polyvalent epoxy compound (A) having a biphenyl structure and/or condensed polycyclic structure, a trivalent or higher polyvalent phenol type epoxy compound (B), and a triazine structure-containing phenol resin (C) and a film, laminated film, prepreg, laminate, cured article, and composite article obtained using the same are provided.

6. 发明授权

US09711378B2 Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device 有权
公开(公告)号：US09711378B2
公开(公告)日：2017-07-18
申请号：US15103371
申请日：2014-11-28
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Kazuaki Sumita , Tatsuya Uehara , Naoyuki Kushihara
IPC分类号： H01L21/00 , H01L21/56 , C08G59/42 , C08K9/06 , H01L23/29 , C09D7/12 , C09D163/00 , H01L21/78 , C08G59/24 , C08G59/32 , C08G59/68 , C08K5/09
CPC分类号： H01L21/561 , C08G59/245 , C08G59/3218 , C08G59/3227 , C08G59/3281 , C08G59/42 , C08G59/686 , C08K3/36 , C08K5/09 , C08K9/06 , C08K2201/003 , C08L63/00 , C09D7/62 , C09D7/63 , C09D163/00 , H01L21/78 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a liquid epoxy resin composition for semiconductor sealing, which contains: (A) a liquid epoxy resin that does not contain a siloxane bond in each molecule; (B) an acid anhydride-based curing agent; (C) a surface-treated spherical inorganic filler which is a spherical inorganic filler having an average particle diameter of 0.1-10 μm as determined by a laser diffraction method and serving as an inorganic filler, and wherein the surface of the spherical inorganic filler is surface-treated with 0.5-2.0 parts by weight of a (meth)acrylic functional silane coupling agent per 100 parts by weight of the spherical inorganic filler of the component (C); and (D) a curing accelerator. The present invention is able to provide a semiconductor device which has excellent heat resistance and moisture resistance.

7. 发明申请

US20170156992A1 DENTAL COMPOSITION 审中-公开
公开(公告)号：US20170156992A1
公开(公告)日：2017-06-08
申请号：US15323161
申请日：2015-07-02
申请人： DENTSPLY DETREY GMBH
发明人： Joachim KLEE
IPC分类号： A61K6/087 , A61K6/00
CPC分类号： A61K6/087 , A61K6/0038 , A61K6/0047 , A61K6/0073 , C07D301/16 , C07D303/23 , C08G59/063 , C08G59/245 , C08G59/3218 , C08G59/50 , C08L63/00
摘要： Dental composition comprising(a) at least two di- or polyepoxides having 2 to 5 epoxide groups and having a molecular weight of from 200 to 700 Da, or a macromonomeric reaction product obtainable by reacting the diepoxide with a dicarboxylic acid in a molar ratio [diepoxide]/[dicarboxylic acid] of at least 2; (b) one or more primary monoamines and/or disecondary diamines; (c) optionally one or more aliphatic polyamines; (d) a particulate filler, wherein the molar ratio of epoxide groups in component (a) to the N—H bonds in component (b) and (c) [epoxide(a)]/[N—H(b),(c)] is in the range of from 0.9 to 1.1; wherein the di- or polyepoxide having 2 to 5 epoxide groups is a compound of the following formula (I): A(BZm)n (I) wherein A represents an n-valent organic moiety optionally having 1 to 10 heteroatoms selected from oxygen atoms and sulfur atoms; and B represents an m+1-valent organic moiety, Z is an epoxide group which may have a substituent, m which are independent from each other represent an integer of at least 1; and n is an integer of from 1 to 5; wherein the m are selected so that 2 to 5 epoxide groups are present; wherein the composition does not contain any 2,2-bis-(4-hydroxyphenyl)-propane, or 2,2-bis-(4-hydroxyphenyl)-methane.

8. 发明申请

US20170037223A1 EPOXY RESINS FOR USE IN SHAPED BODIES 审中-公开
标题翻译：环氧树脂用于成型体
公开(公告)号：US20170037223A1
公开(公告)日：2017-02-09
申请号：US15304581
申请日：2015-04-15
申请人： BASF SE
发明人： Monika CHARRAK , Hans-Josef THOMAS , Miran YU , Markus SCHWIND
IPC分类号： C08K9/08 , F25B21/00 , C08K5/315 , C08K3/34 , C08J5/00 , C08J3/24 , H01F1/01 , C08K3/32
CPC分类号： C08K9/08 , C08G59/245 , C08G59/3218 , C08G59/5026 , C08G59/686 , C08J3/24 , C08J5/00 , C08J2363/00 , C08K3/08 , C08K3/32 , C08K3/34 , C08K5/315 , C08L63/00 , F25B21/00 , F25B2321/002 , H01F1/012
摘要： A shaped body comprising at least one solid material and a cured epoxy resin wherein the cured epoxy resin is prepared from an epoxy resin composition containing at least one epoxy resin having at least one epoxy group per molecule; at least one curing agent selected from cyanoalkylated polyamines of formula (A) A(NH—X—CN), wherein A is a group selected from aryl, arylalkyl, alkyl, and cycloalkyl, wherein A does not contain a primary amino group, X is alkylene having 1 to 10 C-atoms, and n≧2; and at least one accelerator selected from tertiary amines, imidazoles, guanidines, urea compounds, and Lewis acids.
摘要翻译：一种成形体，其包含至少一种固体材料和固化的环氧树脂，其中所述固化的环氧树脂由包含至少一种每分子具有至少一个环氧基的环氧树脂的环氧树脂组合物制备; 至少一种选自式（A）A（NH-X-CN）的氰烷基化多胺的固化剂，其中A是选自芳基，芳基烷基，烷基和环烷基的基团，其中A不含伯氨基，X 是具有1〜10个碳原子的亚烷基，n≥2; 和选自叔胺，咪唑，胍胺，脲化合物和路易斯酸的至少一种促进剂。

9. 发明申请

US20160326298A1 PHOTOSENSITIVE RESIN COMPOSITION FOR OPTICAL WAVEGUIDE, PHOTOCURABLE FILM FOR FORMATION OF OPTICAL WAVEGUIDE CORE LAYER, OPTICAL WAVEGUIDE PRODUCED BY USING THE RESIN COMPOSITION OR THE PHOTOCURABLE FILM, AND HYBRID FLEXIBLE PRINTED WIRING BOARD FOR OPTICAL/ELECTRICAL TRANSMISSION 有权
标题翻译：用于光波导的光敏树脂组合物，用于形成光波导核心层的光致抗蚀膜，使用树脂组合物或光致抗蚀膜制成的光波导，以及用于光电传输的混合柔性印刷线路板
公开(公告)号：US20160326298A1
公开(公告)日：2016-11-10
申请号：US15108804
申请日：2015-01-27
申请人： NITTO DENKO CORPORATION
发明人： Tomoyuki Hirayama , Naoya Sugimoto
IPC分类号： C08G59/32 , C08G59/40 , G02B6/122 , C09D163/00 , C09D171/00 , G02B6/138 , C08G59/38 , C08G65/22
CPC分类号： C08G59/3218 , C08G59/24 , C08G59/38 , C08G59/4007 , C08G59/687 , C08G65/18 , C08G65/22 , C08L63/00 , C09D163/00 , C09D171/00 , G02B6/10 , G02B6/12 , G02B6/1221 , G02B6/138 , G02B2006/1219
摘要： According to the present invention, a photosensitive resin composition for an optical waveguide contains a resin component and a photopolymerization initiator. The resin component has an absorbance of less than 0.03 as measured at 2960 cm−1 by an attenuated total reflection measurement (ATR) method by means of a Fourier transform infrared spectrophotometer (FT-IR), and includes a polymerizable substituent-containing resin as a main component. Where the inventive optical waveguide photosensitive resin composition is used as a material for the optical waveguide, particularly as a core layer formation material for the optical waveguide, it is possible to reduce a loss, for example, by avoiding vibrational absorption occurring at an optical waveguide transmission light wavelength of 850 nm due to a resin skeleton.
摘要翻译：根据本发明，光波导的感光性树脂组合物含有树脂成分和光聚合引发剂。树脂组分通过傅立叶变换红外分光光度计（FT-IR）通过衰减全反射测量（ATR）法在2960cm -1测量的吸光度小于0.03，并且包括含可聚合取代基的树脂作为一个主要组成部分。当本发明的光波导光敏树脂组合物用作光波导的材料时，特别是作为光波导的芯层形成材料，可以减少损耗，例如通过避免在光波导处产生振动吸收由于树脂骨架的透射光波长为850nm。

10. 发明授权

US09448479B2 Photosensitive resin composition, resist laminate, and articles obtained by curing same (7) 有权
标题翻译：感光树脂组合物，抗蚀剂层压体和通过固化获得的制品（7）
公开(公告)号：US09448479B2
公开(公告)日：2016-09-20
申请号：US14443679
申请日：2013-11-21
申请人： Nippon Kayaku Kabushiki Kaisha
发明人： Naoko Imaizumi , Shinya Inagaki , Nao Honda
IPC分类号： G03F7/075 , C08G59/24 , C08G59/32 , C08G59/62 , G03F7/038
CPC分类号： G03F7/0755 , C08G59/063 , C08G59/24 , C08G59/245 , C08G59/32 , C08G59/3218 , C08G59/38 , C08G59/62 , C08G59/621 , C08K5/109 , C08K5/13 , C08K5/5419 , C08L33/068 , C08L63/00 , G03F7/038 , G03F7/0751
摘要： The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyhydric phenol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2). The reactive epoxy monomer (E) is a bisphenol epoxy resin.
摘要翻译：本发明的目的是提供以下：通过光刻法可以形成具有垂直侧壁并抵抗水分和热量的高分辨率，低应力图像的光敏环氧树脂组合物和/或抗蚀剂层压体使用所述感光性环氧树脂组合物; 以及通过固化所述感光性环氧树脂组合物和/或抗蚀剂层压体而获得的制品或制品。本发明是含有以下的感光性树脂组合物：环氧树脂（A），具有特定结构的多元酚化合物（B），阳离子聚合光引发剂（C），含有环氧基的硅烷化合物（D），和具有特定结构的反应性环氧单体（E）。环氧树脂（A）含有由式（1）表示的苯酚衍生物，通过与表卤代醇反应获得的环氧树脂（a）和可由式（2）表示的环氧树脂（b）。反应性环氧单体（E）是双酚环氧树脂。

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