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1. 发明申请

US20180208710A1 Preparation and application of dicyclopentadiene-phenol and 2,6-dimethyl phenol copolymer epoxy resin 审中-公开
公开(公告)号：US20180208710A1
公开(公告)日：2018-07-26
申请号：US15414582
申请日：2017-01-24
申请人： NAN YA PLASTICS CORPORATION
发明人： Cheng-Chung LEE , Chen-Hua WU , Jaou-Shain YU
IPC分类号： C08G59/06 , C09D163/08 , C09D5/18 , C09D7/00
CPC分类号： C08G59/063 , C08G59/08 , C09D5/18 , C09D7/20 , C09D163/04 , C09D163/08
摘要： This invention provides a new dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin with excellent heat resistance, low dielectric constant Dk, low dissipation factor Df having the formula 1. Preparation of dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin in two steps: Step 1, reacting (a1) dicyclopentadiene phenol resin represented by formula 2 with (a2) 2,6-dimethyl phenol in the presence of acid catalyst by (a3) aldehyde compounds to synthesize dicyclopentadiene phenol-2,6-dimethyl phenol copolymer, and Step 2, reacting dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer with excess epichlorhydrin under NaOH condition to prepare dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin. When this dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin according to the present invention is substituted into compositions for laminate, they have low dielectric constant, low dissipation factor, and no delamination after longer than 10 minutes 288° C. soldering test and 2 hours pressure cooking test.

2. 发明授权

US09890130B2 Phenolic epoxy compounds 有权
公开(公告)号：US09890130B2
公开(公告)日：2018-02-13
申请号：US14768218
申请日：2013-11-21
申请人： EMPIRE TECHNOLOGY DEVELOPMENT LLC
发明人： Georgius Abidal Adam
IPC分类号： C07D301/28 , C07D303/23 , C07D303/27 , C07C215/50 , C08G59/08 , C07D303/30 , C08G59/32 , C07C39/12 , C07C43/178 , C07D303/36 , C07C37/20 , C07C41/01 , C07C213/02
CPC分类号： C07D303/30 , C07C37/20 , C07C39/12 , C07C41/01 , C07C43/1785 , C07C213/02 , C07C215/50 , C07D301/28 , C07D303/23 , C07D303/27 , C07D303/36 , C08G59/08 , C08G59/3218
摘要： Disclosed herein are compositions and methods of making phenolic compounds, and resins comprising these phenolic compounds. The compounds include multifunctional epoxies, amino glycidyl derivatives, and multi-functional amines prepared from hydroxymethyl derivatives of phenols and bisphenols. In one embodiment, a compound is of formula I wherein R1 is H or Z; each R2, R3, and R4, independently, are —N(Z)2, —N(CH2—O—Z)2, —N(CH2CH2—O—Z)2, —N(CH2OH)2, —N(CH2NH2)2, —O—Z, —CH2—O—Z, —CH2CH2—O—Z, —CH2OH, —CH2NH2, —O—C—(CH3)3, or —O-(alkylene)-CH3; and Z is

3. 发明申请

US20170233357A1 PHENOLIC EPOXY COMPOUNDS 审中-公开
公开(公告)号：US20170233357A1
公开(公告)日：2017-08-17
申请号：US15584363
申请日：2017-05-02
申请人： EMPIRE TECHNOLOGY DEVELOPMENT LLC
发明人： Georgius Abidal Adam
IPC分类号： C07D303/36 , C07C215/50 , C07C37/20 , C07C39/12 , C08G59/32 , C07C43/178 , C07D301/28 , C07D303/30 , C08G59/08 , C07C213/02 , C07C41/01
CPC分类号： C07D303/30 , C07C37/20 , C07C39/12 , C07C41/01 , C07C43/1785 , C07C213/02 , C07C215/50 , C07D301/28 , C07D303/23 , C07D303/27 , C07D303/36 , C08G59/08 , C08G59/3218
摘要： Disclosed herein are compositions and methods of making phenolic compounds, and resins comprising these phenolic compounds. The compounds include multifunctional epoxies, amino glycidyl derivatives, and multi-functional amines prepared from hydroxymethyl derivatives of phenols and bisphenols.

4. 发明授权

US09657173B2 Curable resin composition and cured product thereof 有权
公开(公告)号：US09657173B2
公开(公告)日：2017-05-23
申请号：US13978310
申请日：2012-01-31
申请人： Makoto Tsubuku , Taketo Ikeno , Masayuki Katagiri , Tomoo Tsujimoto
发明人： Makoto Tsubuku , Taketo Ikeno , Masayuki Katagiri , Tomoo Tsujimoto
IPC分类号： C08K5/34 , C08K5/00 , C08G59/42 , C08L75/06 , C08G73/06 , C08L79/04 , C09J179/04 , C08G59/08 , C08G59/40 , C08J5/24 , C09K3/10
CPC分类号： C08L75/06 , C08G59/08 , C08G59/4014 , C08G73/0655 , C08J5/24 , C08J2363/00 , C08J2379/04 , C08L79/04 , C09J179/04 , C09K3/1006 , C09K2200/0645 , Y10T428/31678
摘要： A curable resin composition which can achieve a cured product in which the generation of cracks upon curing is suppressed and which has both a low thermal expansion rate and a low water absorbability is provided. The curable resin composition comprises: at least a cyanate ester compound (A) represented by the following formula (I); a metal complex catalyst (B); and an additive (C), wherein the additive (C) contains any one or more selected from the group consisting of a compound represented by the following general formula (II), a compound represented by the following general formula (III), and a tertiary amine.

5. 发明申请

US20160304660A1 DISTILLED EPOXY NOVOLAC RESINS 有权
标题翻译：蒸馏环氧NOVOLAC树脂
公开(公告)号：US20160304660A1
公开(公告)日：2016-10-20
申请号：US15103097
申请日：2014-12-17
申请人： BLUE CUBE IP LLC
发明人： William W. Fan , Dennis W. Jewell , Stephen B. Wallace , Marvin L. Dettloff , Travis H. Larsen
IPC分类号： C08G59/02 , B01D3/32 , B01D5/00
CPC分类号： C08G59/025 , B01D3/32 , B01D5/006 , C08G59/08
摘要： A continuous process comprising a) separating an epoxy novolac resin comprising oligomers having an average functionality of greater than 2.5 and a hydrolyzable chlorine content of less than 450 ppm with a continuous evaporator apparatus to form i) a first distillate vapor fraction comprising epoxy novolac resin having more than 75 weight percent of 2 functional components and wherein the mass of the first distillate vapor fraction is in the range of from 15 to 40 weight percent of the starting epoxy novolac resin; and ii) a first bottom fraction comprising epoxy novolac resin having less than 5 weight percent of 2 functional components and having a glass transition temperature of at least 15 C higher compared to the starting epoxy novolac resin when cured; b) recovering the first bottom fraction product; and c) condensing the first distillate vapor fraction to form a first condensed distillate vapor fraction; d) separating the first condensed distillate vapor fraction with a second continuous evaporator apparatus to form i) a second distillate vapor fraction wherein the mass of the second distillate vapor fraction is in the range of from 40 to 70 weight percent of the first condensed distillate vapor fraction; and ii) a second bottom fraction; e) recovering the second bottom fraction product; and f) condensing the second distillate vapor fraction to form a second condensed distillate vapor fraction product comprising at least 98 weight percent of 2 functional components with a total chlorine content less than 900 ppm, is disclosed.
摘要翻译：一种连续方法，其包括：a）第一蒸馏馏分，其包含环氧酚醛清漆树脂，其包含平均官能度大于2.5且低于450ppm的可水解氯含量小于450ppm的环氧酚醛清漆树脂，大于75重量％的2个功能组分，并且其中第一馏出物蒸气馏分的质量在起始环氧酚醛清漆树脂的15至40重量％的范围内; 和ii）包含环氧酚醛清漆树脂的第一底部馏分，其与固化时的起始环氧酚醛清漆树脂相比，具有小于5重量％的2个功能组分并且玻璃化转变温度至少高15℃; b）回收第一底部馏分产物; 和c）冷凝第一馏出物蒸气馏分以形成第一冷凝馏出物蒸气馏分; d）用第二连续蒸发器装置分离第一浓缩馏出物蒸气馏分以形成i）第二馏出物蒸气馏分，其中第二馏出物蒸气馏分的质量在第一馏分馏出物的40至70重量％的范围内分数; 和ii）第二底部馏分; e）回收第二底部馏分产物; 并且f）冷凝第二馏出物蒸气馏分以形成包含至少98重量％的总氯含量低于900ppm的2个功能组分的第二冷凝馏出物蒸气馏分产物。

6. 发明申请

US20140336348A1 EPOXY RESIN PRODUCTION 有权
标题翻译：环氧树脂生产
公开(公告)号：US20140336348A1
公开(公告)日：2014-11-13
申请号：US14365753
申请日：2012-12-06
申请人： DOW GLOBAL TECHNOLOGIES LLC
发明人： Jesus A. Atias , Philip J. Carlberg , Ravindra S. Dixit , Robert M. Drake , Dan Tirtowidjojo , David H. West , William G. Worley , Thomas C. Young
IPC分类号： C08G59/06
CPC分类号： C08G59/063 , C08G59/022 , C08G59/08
摘要： A process comprising: a) contacting a polyhydric phenol and an epihalohydrin in the presence of a catalyst under reaction conditions to form an organic feed comprising a bishalohydrin ether; b) contacting the organic feed and an aqueous feed comprising an inorganic hydroxide with a high shear mixer to produce a first mixed feed; c) contacting the first mixed feed with a phase separator to form a first organic product comprising an epoxy resin and a first aqueous product; and d) recovering the first organic product, is disclosed.
摘要翻译：一种方法，包括：a）在催化剂存在下，在反应条件下使多元酚与表卤代醇接触，形成含有双卤代醇醚的有机进料; b）使有机原料和包含无机氢氧化物的水性进料与高剪切混合器接触以产生第一混合进料; c）使所述第一混合进料与相分离器接触以形成包含环氧树脂和第一含水产物的第一有机产物; 和d）回收第一有机产物。

7. 发明申请

US20140099791A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY 审中-公开
标题翻译：用于形成抗蚀层膜的组合物用于EUV LITHOGRAPHY
公开(公告)号：US20140099791A1
公开(公告)日：2014-04-10
申请号：US14099278
申请日：2013-12-06
申请人： NISSAN CHEMICAL INDUSTRIES, LTD.
发明人： Rikimaru SAKAMOTO , Takafumi ENDO , Bangching HO
IPC分类号： H01L21/311 , H01L21/308
CPC分类号： H01L21/31116 , C08G59/08 , C08L63/00 , G03F7/091 , G03F7/094 , G03F7/11 , H01L21/3081 , Y10S430/106
摘要： A method for producing a semiconductor device includes the steps of: applying a composition for forming a resist underlayer film for EUV lithography including a novolac resin containing a halogen atom onto a substrate having a film to be fabricated for forming a transferring pattern and baking the composition so as to form a resist underlayer film for EUV lithography; and applying a resist for EUV lithography onto the resist underlayer film for EUV lithography, irradiating, with EUV through a mask, the resist underlayer film for EUV lithography and a film of the resist for EUV lithography on the resist underlayer film, developing the film of the resist for EUV lithography, and transferring an image formed in the mask onto the substrate by dry etching so as to form an integrated circuit device.
摘要翻译：一种制造半导体器件的方法包括以下步骤：将包含含有卤素原子的酚醛清漆树脂的EUV光刻用抗蚀剂下层膜形成用组合物涂布到具有用于形成转印图案的被制造膜的基材上，以形成用于EUV光刻的抗蚀剂下层膜; 并将用于EUV光刻的抗蚀剂涂覆在用于EUV光刻的抗蚀剂下层膜上，用EUV通过掩模，用于EUV光刻的抗蚀剂下层膜和抗蚀剂下层膜上的EUV光刻用抗蚀剂膜照射，用于EUV光刻的抗蚀剂，并通过干蚀刻将在掩模中形成的图像转印到基底上，从而形成集成电路器件。

8. 发明授权

US08642714B2 Phenol resin and resin composition 有权
标题翻译：苯酚树脂和树脂组合物
公开(公告)号：US08642714B2
公开(公告)日：2014-02-04
申请号：US12162277
申请日：2007-01-24
申请人： Haruaki Sue , Kuniaki Satou , Osamu Matsuzaka
发明人： Haruaki Sue , Kuniaki Satou , Osamu Matsuzaka
IPC分类号： C08G8/04
CPC分类号： C08G8/28 , C08G59/08
摘要： The present invention provides a phenol resin having, as a unit in its main-chain skeleton, a structure represented by the following general formula (I), as well as a resin composition using the same. According to the phenol resin of the invention, epoxylation thereof, chemical modification thereof, reaction thereof with an epoxy resin, and the like are facilitated. Phenol resins ranging from low-molecular-weight resins rich in fluidity to high-melting resins can be synthesized, and these phenol resins are industrially useful. When the phenol resin of the present invention is used as a hardening agent for epoxy resin etc., its resin composition can give a cured product of high Tg without deteriorating adhesiveness.
摘要翻译：本发明提供一种在其主链骨架中作为单元具有由以下通式（I）表示的结构的酚醛树脂以及使用其的树脂组合物。根据本发明的酚醛树脂，其环氧化，化学改性，与环氧树脂的反应等有利。可以合成苯酚树脂，从低流动性的低分子量树脂到高熔点树脂，这些酚醛树脂在工业上是有用的。当本发明的酚醛树脂用作环氧树脂等的硬化剂时，其树脂组合物可以得到Tg高的固化产物，而不会降低粘附性。

9. 发明申请

US20130245200A1 MODIFIED HYDROCARBYLPHENOL-ALDEHYDE RESINS FOR USE AS TACKIFIERS AND RUBBER COMPOSITIONS CONTAINING THEM 有权
标题翻译：用作包装剂和含有它们的橡胶组合物的改性的烃基苯酚 - 醛树脂
公开(公告)号：US20130245200A1
公开(公告)日：2013-09-19
申请号：US13604208
申请日：2012-09-05
申请人： Timothy E. BANACH , L. Scott HOWARD , Todd Scott MAKENZIE , Ronald K. SMITH
发明人： Timothy E. BANACH , L. Scott HOWARD , Todd Scott MAKENZIE , Ronald K. SMITH
IPC分类号： C08L71/12
CPC分类号： C08L71/126 , C08G8/10 , C08G59/08 , C08L21/00 , C08L59/00 , C08L61/00 , C08L61/14 , C08L63/00 , C08L2666/16 , C08L2666/04
摘要： The invention relates to a modified hydrocarbylphenol-aldehyde resin prepared by reacting a hydrocarbylphenol-aldehyde resin with a primary or secondary amine and further with an epoxide. The invention also provides a process for preparing a modified, hydrocarbylphenol-aldehyde resin and a rubber composition containing such resin.
摘要翻译：本发明涉及通过烃基苯酚 - 醛树脂与伯胺或仲胺反应制得的改性烃基酚醛树脂，并进一步与环氧化物反应。本发明还提供了制备改性的烃基酚醛树脂和含有这种树脂的橡胶组合物的方法。

10. 发明授权

US08410619B2 Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device 失效
标题翻译：用于封装半导体的颗粒状环氧树脂组合物，使用该粒状环氧树脂组合物的半导体器件以及用于制造半导体器件的方法
公开(公告)号：US08410619B2
公开(公告)日：2013-04-02
申请号：US13133800
申请日：2009-12-02
申请人： Yasuhiro Mizuno , Kazuya Shigeno
发明人： Yasuhiro Mizuno , Kazuya Shigeno
IPC分类号： H01L23/29
CPC分类号： H01L23/3128 , C08G59/08 , C08G59/621 , C08L63/00 , H01L21/565 , H01L23/293 , H01L23/295 , H01L23/3107 , H01L23/49548 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/01087 , H01L2924/1301 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/85 , H01L2924/00011
摘要： Disclosed is a granular epoxy resin composition for encapsulating a semiconductor used for a semiconductor device obtained by encapsulating a semiconductor element by compression molding, wherein, in the particle size distribution as determined by sieving the whole epoxy resin composition for encapsulating a semiconductor using JIS standard sieves, the ratio of particles having a size of 2 mm or greater is not more than 3% by mass, the ratio of particles having a size of 1 mm or greater, but less than 2 mm is from 0.5% by mass or more to 60% by mass or less, and the ratio of microfine particles having a size of less than 106 μm is not more than 5% by mass.
摘要翻译：公开了一种颗粒状环氧树脂组合物，用于封装通过压缩成型封装半导体元件而获得的半导体器件的半导体，其中，通过使用JIS标准筛筛分整个用于封装半导体的全部环氧树脂组合物测定的粒度分布尺寸为2mm以上的颗粒的比例不超过3质量％，尺寸为1mm以上但小于2mm的颗粒的比例为0.5质量％以上至60质量％质量％以下，尺寸小于106μm的微细粒子的比例不超过5质量％。

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