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    • 10. 发明授权
    • Thermosetting resin composition and uses thereof
    • 热固性树脂组合物及其用途
    • US07935752B2
    • 2011-05-03
    • US12281274
    • 2007-03-08
    • Hiroshi UchidaTomokazu Umezawa
    • Hiroshi UchidaTomokazu Umezawa
    • C08K5/5313
    • C08G18/758C08G18/0823C08G18/44C08G18/6576C08G18/6659C08G59/4269C08K3/016C08K5/5313C08L63/00C08L75/04H05K3/285H05K2201/012H05K2201/0212C08L2666/14C08L2666/22
    • The thermosetting resin composition and the solder resist ink according to the present invention are characterized by comprising: a thermosetting resin (A) comprising (A1) a compound containing an acid anhydride group and/or a carboxyl group and (A2) a compound having a functional group which reacts with (A1) described above and an organic filler (B) containing a phosphorus atom, wherein the organic filler (B) containing a phosphorus atom has an average particle diameter of 50 Êm or less. According to the present invention, capable of being provided at a low cost and a good productivity are an excellent thermosetting resin composition and solder resist ink capable of forming a cured material which achieves an adhesion to a substrate, a low warping property, a flexibility, a plating resistance, a solder heat resistance and a long term reliability as well as a flame retardancy, and a cured material and a protective film which are excellent in the above characteristics. Further, electronic parts having a protective film which is excellent in a flame retardancy and which has a high reliability can be provided.
    • 根据本发明的热固性树脂组合物和阻焊油墨的特征在于包括:包含(A1)含有酸酐基和/或羧基的化合物的热固性树脂(A)和(A2)具有 与上述(A1)反应的官能团和含有磷原子的有机填料(B),其中,含有磷原子的有机填料(B)的平均粒径为50μm以下。 根据本发明,能够以低成本和高生产率提供的是具有能够形成固化材料的优异的热固性树脂组合物和阻焊油墨,其能够实现与基材的粘合性,低翘曲性,柔软性, 电镀电阻,焊料耐热性和长期可靠性以及阻燃性,以及上述特性优异的固化材料和保护膜。 此外,可以提供具有阻燃性优异且可靠性高的保护膜的电子部件。