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1. 发明公开

US20240131633A1 NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE 审中-公开
公开(公告)号：US20240131633A1
公开(公告)日：2024-04-25
申请号：US18271531
申请日：2022-01-20
申请人： SEKISUI CHEMICAL CO., LTD.
发明人： Hidefumi YASUI , Kiyoto MATSUSHITA
IPC分类号： B23K35/36 , B23K35/02 , C08G59/24 , C08G59/42 , C08G59/68 , H01L23/00 , H05K3/34 , H05K3/36
CPC分类号： B23K35/3613 , B23K35/025 , C08G59/245 , C08G59/4238 , C08G59/688 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H05K3/3436 , H05K3/3489 , H05K3/368 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/0568 , H01L2224/05684 , H01L2224/1369 , H01L2224/27422 , H01L2224/29078 , H01L2224/2919 , H01L2224/32013 , H01L2224/73103 , H01L2224/73204 , H01L2224/81024 , H01L2224/81815 , H01L2224/83862 , H01L2224/9211 , H01L2924/0665 , H05K2203/0485
摘要： Provided is a non-electroconductive flux capable of enhancing productivity and impact resistance of a connected structure to be obtained and suppressing occurrence of solder flash. The non-electroconductive flux according to the present invention contains an epoxy compound, an acid anhydride curing agent, and an organophosphorus compound.

2. 发明授权

US11945905B2 Vegetable oil-derived epoxy compositions having improved performance 有权
公开(公告)号：US11945905B2
公开(公告)日：2024-04-02
申请号：US17291143
申请日：2019-11-07
申请人： Washington State University
发明人： Jinwen Zhang , Tuan Liu
IPC分类号： B32B41/00 , C08G59/06 , C08G59/12 , C08G59/42 , C08G59/50 , C08J5/24 , C09D163/08 , C09J5/00 , C09J163/08
CPC分类号： C08G59/12 , C08G59/06 , C08G59/4238 , C08G59/502 , C08J5/243 , C09D163/08 , C09J5/00 , C09J163/08 , C08J2363/08 , C09J2463/00
摘要： Embodiments of this invention are directed to bio-based epoxy compositions, and method of their preparation and use. Other embodiments are directed to cured bio-based epoxies, and manufactured articles having bio-based epoxy coatings, adhesives, or composites.

3. 发明授权

US11718629B2 Process to produce blended (meth)acrylate/vinyl ester resin cross-linkers 有权
公开(公告)号：US11718629B2
公开(公告)日：2023-08-08
申请号：US17530089
申请日：2021-11-18
申请人： DREXEL UNIVERSITY , The Government of the United States of America as Represented by the Secretary of the Army
发明人： Joshua Matthew Sadler , John Joseph La Scala , Giuseppe R. Palmese
IPC分类号： C07D493/04 , C08G59/42 , C08L63/00 , C08G59/17 , C07C67/08 , C07C67/60 , C08L33/08 , C08L33/10
CPC分类号： C07D493/04 , C07C67/08 , C07C67/60 , C08G59/1466 , C08G59/42 , C08G59/4238 , C08L63/00 , C08L33/08 , C08L33/10 , C08L2312/00
摘要： This invention outlines a method for synthesizing a blended resin system in a one pot reaction that may utilize, for example, bio-based anhydrosugars such as isosorbide as a principle component to produce isosorbide dimethacrylate and other monomeric materials for thermosetting applications. This invention establishes a one-pot procedure for reacting a hydroxy group containing compound with methacrylic anhydride in the first step and using the by-product methacrylic acid to react with glycidyl ethers to form additional methacrylate compounds in the second step. This methodology can be formulated to produce a wide array of resin systems that have controlled ratios of hydroxy group containing compound/cross-linker/reactive diluent. Additionally, the novel resin systems may be partially to fully bio-based, promoting global sustainability and reducing costs, and when free radically polymerized have properties that meet or exceed their petroleum derived counterparts.

4. 发明授权

US09972507B2 Method for encapsulating large-area semiconductor element-mounted base material 有权
公开(公告)号：US09972507B2
公开(公告)日：2018-05-15
申请号：US15483262
申请日：2017-04-10
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Naoyuki Kushihara , Kazuaki Sumita
IPC分类号： H01L21/00 , H01L21/56 , B29C70/72 , B29C70/88 , C08G59/42 , C08G59/62 , C08L63/00 , H01L23/29 , B29K63/00 , B29K105/20 , B29L9/00 , B29L31/34
CPC分类号： H01L21/56 , B29C70/72 , B29C70/882 , B29K2063/00 , B29K2105/20 , B29K2995/0005 , B29L2009/00 , B29L2031/3481 , C08G59/4238 , C08G59/621 , C08L63/00 , C08L2203/206 , H01L23/29 , H01L23/293 , H01L2924/186
摘要： Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175° C., (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.

5. 发明授权

US09957349B2 Resin composition, prepreg, and film 有权
公开(公告)号：US09957349B2
公开(公告)日：2018-05-01
申请号：US14652553
申请日：2013-12-13
申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
发明人： Toyoji Oshima , Shu Yoshida , Takeru Horino , Rintaro Takahashi
IPC分类号： B32B27/38 , B32B27/26 , B32B27/04 , C08G59/20 , C08G59/42 , C08L63/00 , C09D163/00 , C08J5/18 , H01L51/00 , C08J5/24
CPC分类号： C08G59/4238 , C08G59/42 , C08G59/4215 , C08J5/18 , C08J5/24 , C08J2363/00 , C08L2205/025 , H01L51/0035 , H01L51/0096
摘要： A resin composition for transparent substrates comprises an epoxy resin (A) and a curing agent (B), wherein the curing agent (B) comprises a cyclohexane tricarboxylic anhydride.

6. 发明申请

US20170275415A1 FATTY ACID POLYESTER DERIVATIVES OF POLYGLYCOSIDES 审中-公开
公开(公告)号：US20170275415A1
公开(公告)日：2017-09-28
申请号：US15504872
申请日：2015-07-21
申请人： UNIVERSITE DE MONTPELLIER , CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
发明人： Stéphane PATRY , Jean-Pierre HABAS
IPC分类号： C08G59/32 , C08G59/42 , C08G59/50 , C07H15/203 , C07H13/06
CPC分类号： C08G59/3236 , C07H13/02 , C07H13/06 , C07H15/203 , C08G59/027 , C08G59/34 , C08G59/4238 , C08G59/5026
摘要： Fatty acid polyester derivatives of polyglycosides formed from a polyol having between 2 and 10 hydroxy functions, the 2 hydroxy functions or at least 2 of these hydroxy functions being bound to the anomeric carbon of a reducing carbohydrate that is identical or different for each hydroxy group and selected from the monosaccharides and disaccharides, in which at least one of the other hydroxy groups of the monosaccharide or the disaccharide is esterified by a lipid derivative bearing at least one double bond optionally originating from a vegetable or animal oil, from a mixture of vegetable or animal oils, the double bond or the at least one of the double bonds of the lipid derivative being functionalized by a group selected from the epoxy, amine, alcohol and acid groups, and use thereof in particular in reaction formulations for the production of polymer materials.

7. 发明授权

US09169386B2 Organic vegetable oil based resin and preparation method thereof 有权
标题翻译：有机植物油基树脂及其制备方法
公开(公告)号：US09169386B2
公开(公告)日：2015-10-27
申请号：US12606980
申请日：2009-10-27
申请人： Arthur Katzakian , Craig Katzakian
发明人： Arthur Katzakian , Craig Katzakian
IPC分类号： C08K5/15 , C08L63/00 , C08G59/02 , C08G59/42 , C08K5/101 , C08K3/32 , C08K5/092 , C08K5/1515
CPC分类号： C08G59/4238 , C08G59/027 , C08G59/24 , C08G59/42 , C08G59/4215 , C08G59/685 , C08K3/32 , C08K5/092 , C08K5/101 , C08K5/1515 , C08L63/00
摘要： Disclosed are organic, UV resistant epoxy resins derived largely from vegetable oil. More specifically, the present invention provides a virtually non-toxic, hypoallergenic UV resistant resin that gives off substantially no VOCs or disagreeable odors. The composition comprises a vegetable oil-based polyfunctional carboxylic acid, a cycloaliphatic anhydride, and an epoxy compound either of bicyclic difunctional epoxy resin, epoxidized vegetable oil or epoxidized polymer chains. The composition further comprises a catalyst and a wetting agent. In its cured state the material is leather like and exhibits high tensile strength as well as unusually high, totally reversible elongation. In an alternative embodiment, the resin comprises a cyclic anhydride. With increased amounts of cyclic anhydride, increased heat distortion temperature is exhibited while maintaining a high reversible elongation and high tensile strength In an additional alternative, an increased amount of Chromium III Octoate is used and in another alternative Phosphoric Acid.
摘要翻译：公开了主要来自植物油的有机抗紫外线环氧树脂。更具体地说，本发明提供几乎无毒，低过敏性的抗紫外线树脂，其基本上不释放VOC或不愉快的气味。该组合物包含植物油基多官能羧酸，脂环族酸酐和双环双官能环氧树脂，环氧化植物油或环氧化聚合物链的环氧化合物。组合物还包含催化剂和润湿剂。在其固化状态下，材料是皮革样的并且表现出高拉伸强度以及异常高的完全可逆的伸长率。在替代实施方案中，树脂包含环状酸酐。随着环酐的增加，显示出增加的热变形温度，同时保持高的可逆伸长率和高的拉伸强度。另外一种替代方案是使用增加量的铬酸铬III和另一种替代的磷酸。

8. 发明申请

US20130263446A1 FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED VIA THERMAL COMPRESSION BONDING PROCESS 有权
标题翻译：用于通过热压接合工艺组装的微电子封装的焊剂 - 包封材料
公开(公告)号：US20130263446A1
公开(公告)日：2013-10-10
申请号：US13994674
申请日：2011-09-30
申请人： Sivakumar Nagarajan , Sandeep Razdan , Nisha Ananthakrishnan , Craig J. Weinman , Kabirkumar J. Mirpuri
发明人： Sivakumar Nagarajan , Sandeep Razdan , Nisha Ananthakrishnan , Craig J. Weinman , Kabirkumar J. Mirpuri
IPC分类号： H05K3/34 , H01L21/56
CPC分类号： H05K3/4611 , C08G59/245 , C08G59/38 , C08G59/42 , C08G59/4238 , C08G2190/00 , C08K9/06 , C08K2201/005 , C08L63/00 , C09J5/06 , C09J2203/326 , C09J2463/00 , H01L21/56 , H01L21/563 , H01L23/293 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/81191 , H01L2224/81192 , H01L2224/81203 , H01L2224/81204 , H01L2224/81424 , H01L2224/81447 , H01L2224/81801 , H01L2224/83192 , H01L2224/83203 , H01L2224/83801 , H01L2224/83862 , H01L2224/92143 , H01L2224/94 , H01L2225/06513 , H01L2924/01029 , H01L2924/01327 , H01L2924/0665 , H05K3/3436 , H05K3/3489 , H05K3/3494 , Y10T29/49144 , Y10T29/49146 , H01L2924/00 , H01L2224/81 , H01L2924/00012 , H01L2924/0105 , H01L2924/01028 , H01L2224/83
摘要： A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.
摘要翻译：描述了在热压接（TCB）工艺中使用的助熔剂材料及其使用方法。在一个实施方案中，TCB方法包括以50℃/秒至100℃/秒的斜坡速率将键头斜坡升至250℃-300℃。在一个实施方案中，包含一种或多种环氧当量（EEW）为150-1,000的环氧树脂，固化剂和具有单羧酸或二羧酸和pKa的助熔剂的助熔剂材料的4-5。

9. 发明授权

US07094845B2 Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same 有权
标题翻译：碱性硅烷偶联剂有机羧酸酯组合物，其制备方法和含有它们的环氧树脂组合物
公开(公告)号：US07094845B2
公开(公告)日：2006-08-22
申请号：US10450421
申请日：2002-08-27
申请人： Masashi Kumagai , Takashi Ouchi , Katsuyuki Tsuchida
发明人： Masashi Kumagai , Takashi Ouchi , Katsuyuki Tsuchida
IPC分类号： C08L61/06 , C08L63/02
CPC分类号： C08G59/4238 , C07F7/1804
摘要： There is provided a composition for functioning as an effective additive for an epoxy resin that is a solid at room temperature and has a high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carboxylate composition obtained by first synthesizing an organic carboxylate of a basic silane coupling agent by reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the organic carboxylate of the basic silane coupling agent with a compound exhibiting a good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.
摘要翻译：提供了用作环氧树脂在室温下为固体并具有高储存稳定性的有效添加剂的组合物及其方法。本发明的组合物是通过使碱性硅烷偶联剂与有机羧酸反应，首先合成碱性硅烷偶联剂的有机羧酸酯，然后将碱性硅烷偶联剂与对碱性硅烷偶联剂或有机羧酸具有良好亲和性且软化点或熔点为40℃以上的化合物。

10. 发明授权

US06358568B1 Powder varnish dispersion 失效
标题翻译：粉末分散体
公开(公告)号：US06358568B1
公开(公告)日：2002-03-19
申请号：US09508927
申请日：2000-05-08
申请人： Stephan Schwarte , Joachim Woltering , Hubert Baumgart
发明人： Stephan Schwarte , Joachim Woltering , Hubert Baumgart
IPC分类号： B05B504
CPC分类号： C08G59/4238 , C08G59/42 , C08L61/32 , C09D133/068 , C08L2666/14
摘要： The present invention relates to a transparent powder coating dispersion comprising a solid, pulverulent component A and an aqueous component B, component A being a powder coating material comprising a) at least one epoxy-containing binder having a content of from 30 to 45%, preferably from 30 to 35%, by weight of glycidyl-containing monomers, with or without a content of vinylaromatic compounds, preferably styrene, b) tris(alkoxycarbonylamino)triazine and polycarboxylic acids, preferably straight-chain aliphatic dicarboxylic acids and/or carboxy-functional polyesters, as crosslinking agents, component B being an aqueous dispersion comprising a) at least one nonionic thickener.
摘要翻译：本发明涉及一种透明粉末涂料分散体，其包含固体，粉状组分A和水性组分B，组分A是粉末涂料，其包含：a）至少一种含有30至45％含量的含环氧基的粘合剂，优选 30重量％至35重量％的含缩水甘油基单体，含或不含乙烯基芳族化合物，优选苯乙烯，b）三（烷氧基羰基氨基）三嗪和多元羧酸，优选直链脂族二羧酸和/或羧基官能团作为交联剂的聚酯，组分B是包含a）至少一种非离子增稠剂的水分散体。

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