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1. 发明申请

US20170356089A1 Composition for Preparation of Plating Base and Plating Base Thereof 审中-公开
公开(公告)号：US20170356089A1
公开(公告)日：2017-12-14
申请号：US15360694
申请日：2016-11-30
申请人： Colloidal Ink Co., Ltd.
发明人： Masayuki Kanehara , Kei Kashizaki
IPC分类号： C23C18/16 , C23C18/20 , C09D5/24 , C23C28/02 , B22F9/24 , C23C26/00 , C23C18/32 , C09D7/12 , C09D201/00 , C09D7/00 , C23C18/18 , C23C18/40 , B22F1/00
CPC分类号： C23C18/165 , B22F1/0022 , B22F9/24 , B22F2009/245 , B22F2301/255 , B22F2998/10 , B82Y30/00 , C08K3/08 , C08K3/20 , C08K5/3415 , C09D5/24 , C09D7/41 , C09D7/61 , C09D7/63 , C09D7/67 , C09D11/322 , C09D11/52 , C09D201/00 , C23C18/1641 , C23C18/1879 , C23C18/1882 , C23C18/206 , C23C18/2066 , C23C18/30 , C23C18/32 , C23C18/405 , C23C26/00 , C23C28/023
摘要： Provided is a composition for forming a plating base on which plating is applied without a pretreatment, especially any activation process for the plating base, conventionally believed to be necessary, as well as a thus-formed plating base and a method of forming a plating coat over the plating base. The plating base is a coating film formed by applying and drying a metal nanoparticle dispersion liquid or a metal nanoparticle dispersion ink in which metal nanoparticles are protected with a small amount of protecting agent. Thus, a metal film can be formed by plating without operations such as substrate cleaning or catalyst imparting and activating. Since it is not necessary to wash the substrate with acid or base solution or to heat-treat it at a high temperature, many variations of materials become available for the substrate.

2. 发明申请

US20170256472A1 Manufacturing a package using plateable encapsulant 审中-公开
公开(公告)号：US20170256472A1
公开(公告)日：2017-09-07
申请号：US15448018
申请日：2017-03-02
申请人： Infineon Technologies AG
发明人： Sook Woon CHAN , Chau Fatt CHIANG , Kok Yau CHUA , Soon Lock GOH , Swee Kah LEE , Joachim MAHLER , Mei Chin NG , Beng Keh SEE , Guan Choon Matthew Nelson TEE
IPC分类号： H01L23/31 , H01L23/29 , H01L23/552 , H01L21/56 , C23C18/16 , C09D5/00 , C09D201/00 , C23C18/34 , C23C18/18 , H01L23/66 , H01L23/00
CPC分类号： H01L23/3192 , C09D5/002 , C09D5/24 , C09D201/00 , C23C18/1608 , C23C18/1612 , C23C18/1637 , C23C18/166 , C23C18/1689 , C23C18/182 , C23C18/1831 , C23C18/1834 , C23C18/1837 , C23C18/1868 , C23C18/1879 , C23C18/1882 , C23C18/34 , H01L21/56 , H01L21/568 , H01L23/293 , H01L23/295 , H01L23/552 , H01L23/66 , H01L24/16 , H01L2223/6677 , H01L2224/16501 , H01L2224/97 , H01L2924/15313 , H01L2924/1815 , H01L2924/3025 , H01L2224/81
摘要： A package which comprises a first encapsulant configured so that electrically conductive material is plateable thereon, and a second encapsulant configured so that electrically conductive material is not plateable thereon.

3. 发明授权

US09674966B2 Process of depositing a metallic pattern on a medium 有权
公开(公告)号：US09674966B2
公开(公告)日：2017-06-06
申请号：US14647377
申请日：2013-11-27
申请人： DSM IP ASSETS B.V.
发明人： Franciscus Wilhelmus Maria Gelissen , Raul Marcelino Perez Graterol
IPC分类号： H05K1/00 , H05K3/38 , C23C14/04 , C23C14/28 , C23C14/58 , C23C18/16 , C23C18/18 , H05K1/03 , H05K3/00 , H05K3/18
CPC分类号： H05K3/387 , B41M2205/08 , C23C14/048 , C23C14/28 , C23C14/584 , C23C18/1608 , C23C18/1612 , C23C18/1868 , C23C18/1882 , H05K1/0353 , H05K3/0032 , H05K3/182 , H05K3/381 , H05K3/388 , H05K2201/0108 , H05K2203/072 , H05K2203/107
摘要： Process of depositing a metallic pattern on a medium, said process comprising: generating pulsed laser beams from a pulsed laser source, wherein the laser beams have a wavelength for which the medium is substantially transparent, focussing the laser beams onto a target layer comprising inorganic particles, dispersed in a laser light degradable/combustible organic matrix, said target layer producing ejecta in response to an interaction of said laser beams and said target layer, accumulating at least a portion of said ejecta on said medium within the desired pattern, providing the pattern by electroless metal plating. The invention further relates to a transparent medium comprising a metallic pattern wherein the adhesion between the metallic pattern and the medium is at least 5N/cm.

4. 发明申请

US20160372228A1 COMPOSITES AND METHODS OF MAKING COMPOSITE MATERIALS 审中-公开
标题翻译：复合材料和复合材料的制备方法
公开(公告)号：US20160372228A1
公开(公告)日：2016-12-22
申请号：US14745004
申请日：2015-06-19
申请人： Hamilton Sundstrand Corporation
发明人： Ying She , Sameh Dardona , Wayde R. Schmidt
IPC分类号： H01B1/04 , C23C18/38 , C23C18/42 , C23C18/18
CPC分类号： H01B1/04 , C23C18/1635 , C23C18/1879 , C23C18/1882 , C23C18/1889 , C23C18/1893 , C23C18/38 , C23C18/42
摘要： A method of making a composite material includes disposing a carbon-based particulate material, such as graphene or carbon nanotubes, in an activation solution and activating surfaces of the carbon-based particulate material using the activation solution. Once the surfaces of the carbon-based particulate material have been activated a metallic coating is applied to the activated surfaces to form a composite material. The composite material is then recovered as a particulate material formed having carbon-based particulate material with a metallic coating that is suitable for fusing together for forming electrical conductors, such as with an additive manufacturing technique.
摘要翻译：制造复合材料的方法包括在活化溶液中设置碳基颗粒材料，例如石墨烯或碳纳米管，并使用活化溶液活化碳基颗粒材料的表面。一旦已经激活了碳基颗粒材料的表面，就将金属涂层施加到活化表面上以形成复合材料。然后将复合材料作为形成的具有碳基颗粒材料的颗粒材料回收，所述颗粒材料具有适合于熔合在一起以形成电导体的金属涂层，例如用添加剂制造技术。

5. 发明申请

US20160281239A1 METHOD TO PRODUCE NOBLE METAL NANOCOMPOSITES 审中-公开
标题翻译：生产金属纳米复合材料的方法
公开(公告)号：US20160281239A1
公开(公告)日：2016-09-29
申请号：US14666307
申请日：2015-03-24
申请人： KING SAUD UNIVERSITY
发明人： ALI A. ALSHATWI , JEGAN ATHINARAYANAN , VAIYAPURI SUBBARAYAN PERIASAMY
IPC分类号： C23C18/44 , C23C18/16
CPC分类号： C23C18/44 , C23C18/1635 , C23C18/1658 , C23C18/1882 , C23C18/31
摘要： The method for producing noble metal nanocomposites involves reducing noble metal ions (Ag, Au and Pt) on graphene oxide (GO) or carbon nanotubes (CNT) by using Artocarpus integrifolia leaves extract as a reducing agent. As synthesized MNPs/GO and MNPs/CNT composites have been characterized using X-ray diffraction (XRD), transmission electron microscope (TEM) imaging, and energy dispersive X-ray spectroscopy (EDX). The TEM images of prepared materials showed that the nanocomposites were 1-30 nm in size with spherical nanoparticles embedded on the surface of GO and CNT. This synthetic route is easy and rapid for preparing a variety of nanocomposites. The method avoids use of toxic chemicals, and the prepared nanocomposites can be used for biosensor, fuel cell, and biomedical applications.
摘要翻译：制备贵金属纳米复合材料的方法包括通过使用Artocarpus integrifolia叶提取物作为还原剂来还原氧化石墨烯（GO）或碳纳米管（CNT）上的贵金属离子（Ag，Au和Pt）。使用X射线衍射（XRD），透射电子显微镜（TEM）成像和能量色散X射线光谱（EDX），对合成的MNPs / GO和MNPs / CNT复合材料进行了表征。制备材料的TEM图像显示纳米复合材料的尺寸为1-30nm，球形纳米颗粒嵌入在GO和CNT的表面上。这种合成路线对于制备各种纳米复合材料是容易和快速的。该方法避免使用有毒化学物质，制备的纳米复合材料可用于生物传感器，燃料电池和生物医学应用。

6. 发明申请

US20150189762A1 COATING COMPOSITION, COMPOSITE PREPARED BY USING THE COATING COMPOSITION AND METHOD FOR PREPARING THE SAME 审中-公开
标题翻译：涂料组合物，使用涂料组合物制备的复合材料及其制备方法
公开(公告)号：US20150189762A1
公开(公告)日：2015-07-02
申请号：US14657823
申请日：2015-03-13
申请人： BYD COMPANY LIMITED
发明人： Qing GONG , Wei ZHOU , Xinping LIN , Weifeng MIAO , Xiaofang CHEN
IPC分类号： H05K3/18 , H05K1/03
CPC分类号： H05K3/185 , C23C18/1608 , C23C18/1612 , C23C18/1651 , C23C18/1653 , C23C18/1868 , C23C18/1882 , C23C18/204 , C23C18/2066 , H05K1/0373 , H05K3/188 , Y10T428/24917
摘要： A coating composition, a composite prepared by using the coating composition, and a method for preparing the composite are provided. The coating composition includes a solvent, an adhesive, and a catalyst precursor including at least one chosen from SnO2, ZnSnO3 and ZnTiO3.
摘要翻译：提供涂料组合物，通过使用该涂料组合物制备的复合材料，以及制备该复合材料的方法。涂料组合物包括溶剂，粘合剂和包含选自SnO 2，ZnSnO 3和ZnTiO 3中的至少一种的催化剂前体。

7. 发明申请

US20150034589A1 SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTROLESS COPPER PLATING 审中-公开
标题翻译：通过电镀铜镀层形成图案铜线的系统和方法
公开(公告)号：US20150034589A1
公开(公告)日：2015-02-05
申请号：US14517675
申请日：2014-10-17
申请人： Lam Research Corporation
发明人： Alan Lee , Yunsang Kim , Andrew Bailey, III , Yezdi Dordi , William Thie
IPC分类号： H05K3/18 , H05K3/06
CPC分类号： H05K3/184 , C23C18/1605 , C23C18/1642 , C23C18/1669 , C23C18/1879 , C23C18/1882 , C23C18/38 , C23C18/40 , H05K3/064 , H05K2203/0571 , H05K2203/072 , H05K2203/087
摘要： A method for forming copper on a substrate including inputting a copper source solution into a mixer, inputting a reducing solution into the mixer, mixing copper source solution and the reducing solution to form a plating solution having a pH of greater than about 6.5 and applying the plating solution to a substrate, the substrate including a catalytic layer wherein applying the plating solution to the substrate includes forming a catalytic layer, maintaining the catalytic layer in a controlled environment and forming copper on the catalytic layer. A system for forming copper structures is also disclosed.
摘要翻译：一种在基板上形成铜的方法，包括将铜源溶液输入到混合器中，将还原溶液输入到混合器中，将铜源溶液和还原溶液混合以形成pH大于约6.5的电镀溶液，电镀溶液到基板上，所述基板包括催化层，其中将所述电镀液施加到所述基板上包括形成催化剂层，将所述催化剂层保持在受控环境中并在所述催化层上形成铜。还公开了一种用于形成铜结构的系统。

8. 发明授权

US08895651B2 Composition for printing a seed layer and process for producing conductor tracks 有权
标题翻译：用于印刷种子层的组合物和用于制造导体轨迹的方法
公开(公告)号：US08895651B2
公开(公告)日：2014-11-25
申请号：US13027706
申请日：2011-02-15
申请人： Stephan Hermes , Sorin Ivanovici
发明人： Stephan Hermes , Sorin Ivanovici
IPC分类号： C08K5/07 , C23C18/20 , C25D5/54 , C25D5/02 , C23C18/18 , H01L21/768
CPC分类号： C25D5/02 , C23C18/1882 , C23C18/2066 , C25D5/54 , H01L21/76873 , H01L21/76874
摘要： The invention relates to a composition for printing a seed layer for electrodeposition or electroless deposition of a metal for the production of full-area or structured metallic surfaces on a substrate, comprising 0.1 to 6% by weight of electrolessly and/or electrolytically coatable particles, 40 to 98.8% by weight of at least one solvent, 0 to 15% by weight of a crosslinker, 0.1 to 6% by weight of at least one dispersing additive, 0 to 5% by weight of at least one further additive and 1 to 20% by weight of at least one polymer, said at least one polymer being in the form of a dispersion. The invention further relates to a process for producing full-area or structured metallic surfaces on a substrate, and to a use of the process.
摘要翻译：本发明涉及一种用于印刷种子层的组合物，用于在基底上生产全面或结构化金属表面的金属进行电沉积或无电沉积，其包含0.1至6重量％的无电解和/或电解可涂覆的颗粒， 40至98.8重量％的至少一种溶剂，0至15重量％的交联剂，0.1至6重量％的至少一种分散添加剂，0至5重量％的至少一种其它添加剂和1至 20重量％的至少一种聚合物，所述至少一种聚合物是分散体的形式。本发明还涉及一种用于在基底上生产全面或结构化金属表面的方法，以及该方法的用途。

9. 发明授权

US08814997B2 Electroless plating pretreatment agent, electroless plating method using same, and electroless plated object 有权
标题翻译：无电镀预处理剂，使用其的化学镀方法和无电镀物
公开(公告)号：US08814997B2
公开(公告)日：2014-08-26
申请号：US13501139
申请日：2011-03-14
申请人： Toru Imori , Jun Suzuki , Ryu Murakami , Akihiro Aiba , Junichi Ito
发明人： Toru Imori , Jun Suzuki , Ryu Murakami , Akihiro Aiba , Junichi Ito
IPC分类号： C23C18/30 , B05D1/18 , B05D3/10 , C23C18/18 , C23C18/16 , C23C18/20
CPC分类号： C23C18/1608 , C23C18/1635 , C23C18/1879 , C23C18/1882 , C23C18/2066 , C23C18/30
摘要： An electroless plating pretreatment agent that can retain stably Pd(II) over a long period of time in an organic solvent, an electroless plating method using the same that is capable of forming an electroless plated film having excellent adhesion, and an electroless plated object. The electroless plating pretreatment agent contains an organic palladium compound and a coordination compound having a functional group with a metal-capturing capability dissolved in an organic solvent, the coordination compound being selected from the group consisting of the imidazole analogs, polyethyleneamines, ethyleneimines and polyethyleneimines.
摘要翻译：一种能够在有机溶剂中长时间稳定地保持Pd（II）的化学镀预处理剂，使用该化学镀方法能够形成具有优异粘接性的无电解电镀膜的化学镀方法，以及无电电镀对象。化学镀预处理剂含有有机钯化合物和具有溶解在有机溶剂中的具有金属捕获能力的官能团的配位化合物，配位化合物选自咪唑类似物，聚乙烯胺，乙烯亚胺和聚乙烯亚胺。

10. 发明授权

US08784928B2 Deposition of a silver layer on a nonconducting substrate 有权
标题翻译：在不导电的基底上沉积银层
公开(公告)号：US08784928B2
公开(公告)日：2014-07-22
申请号：US13383535
申请日：2011-11-23
申请人： Richard N. Terry , Fung Bor Chen , Zhihui Yin
发明人： Richard N. Terry , Fung Bor Chen , Zhihui Yin
IPC分类号： A61L33/00
CPC分类号： A61L31/088 , A61L27/34 , A61L27/54 , A61L29/085 , A61L29/106 , A61L29/16 , A61L31/10 , A61L31/16 , A61L2300/104 , A61L2300/404 , A61M25/0017 , B05D5/067 , B05D7/02 , C23C18/1882 , C23C18/1893 , C23C18/2066 , C23C18/2086 , C23C18/42 , Y10T428/31692 , Y10T428/31707
摘要： Methods for the deposition of silver-comprising films on nonconducting substrates, and, more particularly, to deposition of such films that are very thin, are provided. The surface of nonconducting substrates is modified with a superabsorbent polymer to increase silver deposition when compared to a non-modified surface. Also provided are films produced using a swelling agent, whereby porosity of the surface of the nonconducting substrate is increased, thereby permitting increased silver deposition when compared to an unmodified surface.
摘要翻译：提供了用于在非导电基底上沉积含银膜的方法，更具体地说，涉及非常薄的这种薄膜的沉积。当与非改性表面相比时，用超吸收聚合物改性非导电衬底的表面以增加银沉积。还提供了使用溶胀剂制备的膜，由此使非导电基材的表面的孔隙率增加，从而与未改性表面相比允许增加的银沉积。

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