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1. 发明申请

US20190112723A1 APPARATUS AND METHOD OF CONTACT ELECTROPLATING OF ISOLATED STRUCTURES 审中-公开
公开(公告)号：US20190112723A1
公开(公告)日：2019-04-18
申请号：US16190314
申请日：2018-11-14
申请人： ECSI Fibrotools, Inc.
发明人： Igor V. Kadija
IPC分类号： C25D7/12 , C25D5/20 , H01L21/48 , H01L21/768 , C25D5/18 , C25D5/02 , C25D17/00 , C25D17/14 , C25D5/06 , H01L21/288
CPC分类号： C25D7/123 , C25D5/02 , C25D5/06 , C25D5/18 , C25D5/20 , C25D17/001 , C25D17/005 , C25D17/14 , H01L21/2885 , H01L21/4846 , H01L21/76873 , H01L21/76877 , H05K3/188
摘要： The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.

2. 发明申请

US20180274115A1 METHOD OF FORMING NICKEL FILM AND NICKEL SOLUTION USED FOR THE METHOD 审中-公开
公开(公告)号：US20180274115A1
公开(公告)日：2018-09-27
申请号：US15864117
申请日：2018-01-08
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： Yuki SATO
IPC分类号： C25D3/12 , B32B15/01 , B32B15/20 , C25D17/00
CPC分类号： C25D3/12 , B32B15/017 , B32B15/20 , B32B2255/06 , B32B2255/205 , C25D5/06 , C25D17/002
摘要： A nickel film is formed on the surface of a metal substrate with a solid electrolyte membrane in contact with a metal substrate while suppressing the corrosion taking place on the metal substrate by a method of forming a nickel film comprising: disposing an anode, a metal substrate that functions as a cathode, and a solid electrolyte membrane comprising a solution that contains nickel ions and chloride ions, such that the solid electrolyte membrane is disposed between the anode and the metal substrate and in contact with the surface of the metal substrate; and applying a voltage between the anode and the metal substrate, so as to form a nickel film on the surface of the metal substrate that is in contact with the solid electrolyte membrane, wherein the concentration of the chloride ions is 0.002 to 0.1 mol/l.

3. 发明申请

US20160145755A1 LIGHTWEIGHT METAL PARTS PRODUCED BY PLATING POLYMERS 审中-公开
标题翻译：轻质金属部件由聚酯聚合物生产
公开(公告)号：US20160145755A1
公开(公告)日：2016-05-26
申请号：US14903932
申请日：2014-07-09
申请人： UNITED TECHNOLOGIES CORPORATION
发明人： Grant O. Cook
IPC分类号： C25D1/02 , C23C18/22 , C23C28/02 , C23C18/16 , C25D7/04 , C25D1/20
CPC分类号： G06K19/07749 , B29C37/0025 , B29C64/106 , B29C64/124 , B29C64/153 , B29C70/42 , B29C70/54 , B29K2079/08 , B29K2105/0058 , B29K2105/12 , B29K2105/251 , B29K2105/253 , B29K2307/04 , B29K2309/08 , B29L2009/008 , B29L2031/082 , B32B27/08 , B32B27/281 , B32B2250/02 , B32B2255/10 , B32B2255/205 , B32B2262/101 , B32B2262/106 , B32B2603/00 , B33Y10/00 , B33Y70/00 , B33Y80/00 , C23C18/1641 , C23C18/1653 , C23C18/1657 , C23C18/166 , C23C18/22 , C23C18/30 , C23C18/32 , C23C28/021 , C23C28/023 , C25D1/003 , C25D1/02 , C25D1/20 , C25D3/02 , C25D5/06 , C25D5/54 , C25D5/56 , C25D7/00 , C25D7/04 , C25D9/02 , C25D17/12 , G01B7/16 , G01D5/12 , G01N3/08 , G01N2203/026 , G01N2203/0268 , G01N2203/0298
摘要： Methods for fabricating lightweight or hollow metal parts are disclosed. First, a polymer is formed into an article of a desired shape or geometry. The outer surface of the article is prepared to receive a catalyst and then the outer surface is activated with the catalyst. A first metallic layer is then plated onto the outer surface to form a structure. Optional additional metallic layers may be applied. The polymer may be removed from the structure before it is subjected to a final heat treatment for alloying purposes.
摘要翻译：公开了制造轻质或中空金属部件的方法。首先，将聚合物形成为所需形状或几何形状的制品。制品的外表面准备接收催化剂，然后用催化剂活化外表面。然后将第一金属层电镀到外表面上以形成结构。可以选择附加的金属层。在进行用于合金化目的的最终热处理之前，聚合物可以从结构中除去。

4. 发明申请

US20160108534A1 ALUMINUM DEPOSITION DEVICES AND THEIR USE IN SPOT ELECTROPLATING OF ALUMINUM 审中-公开
标题翻译：铝沉积装置及其在铝电镀中的应用
公开(公告)号：US20160108534A1
公开(公告)日：2016-04-21
申请号：US14516608
申请日：2014-10-17
申请人： UT-Battelle, LLC , The University of Mississippi
发明人： Sheng Dai , Xiao-Guang Sun , Charles L. Hussey , Li-Hsien Chou
IPC分类号： C25D5/02 , C25D17/00 , C25D3/44 , C25D5/06 , C25D5/04
CPC分类号： C25D5/02 , C25D3/665 , C25D5/06 , C25D17/14
摘要： A method for spot electroplating aluminum onto a metallic substrate without submersion or dipping of the metallic substrate in an electroplating bath, the method comprising: (i) spot coating said metallic substrate with an aluminum ion-containing electrolyte contained within a protective structure possessing at least one aperture, and releasing said electrolyte from said at least one aperture onto said metallic substrate to form a coating of said electrolyte thereon, wherein said electrolyte is in contact with an anode; and (ii) applying a voltage potential between the anode and metallic substrate polarized as cathode when the aluminum ion-containing electrolyte is released from said aperture and forms a coating on the metallic substrate, to produce a coating of aluminum on the substrate. Devices, such as brush and ball pen plating devices, for achieving the above-described method are also described.
摘要翻译：一种用于将铝电镀到金属基底上而不将金属基底浸没在电镀浴中的方法，所述方法包括：（i）用含有铝离子的电解质点样涂覆所述金属基底，所述电解质包含在至少具有至少一个孔，并将所述电解质从所述至少一个孔释放到所述金属基底上以在其上形成所述电解质的涂层，其中所述电解质与阳极接触; 以及（ii）当所述阳离子和所述金属基板极化时，当所述含铝离子的电解质从所述孔释放并在所述金属基底上形成涂层时，在所述阳极和所述金属基板之间施加电压，以在所述基板上产生铝涂层。还描述了用于实现上述方法的装置，例如刷子和滚珠笔电镀装置。

5. 发明授权

US09249521B2 Flow-through consumable anodes 有权
标题翻译：流通消耗性阳极
公开(公告)号：US09249521B2
公开(公告)日：2016-02-02
申请号：US13289470
申请日：2011-11-04
申请人： Klaus Tomantschger , Diana Facchini , Francisco Gonzalez , Jonathan McCrea , John Kratochwil , Dan Woloshyn , Yusuf Bismilla , Nandakumar Nagarajan , Mioara Neacsu
发明人： Klaus Tomantschger , Diana Facchini , Francisco Gonzalez , Jonathan McCrea , John Kratochwil , Dan Woloshyn , Yusuf Bismilla , Nandakumar Nagarajan , Mioara Neacsu
IPC分类号： C25D5/06 , C25D17/14 , C25D1/00
CPC分类号： C25D5/06 , C25D1/00 , C25D5/08 , C25D5/18 , C25D17/14
摘要： Anode applicators include consumable anodes, that can be operated in a non-stationary mode and are insensitive to orientation, are used in selective plating/brush electrodeposition of coatings or free-standing components. The flow-through dimensionally-stable, consumable anodes employed are perforated/porous to provide relatively unimpeded electrolyte flow and operate at low enough electrochemical potentials to provide for anodic metal/alloy dissolution avoiding undesired anodic reactions. The consumable anodes include consumable anode material(s) in high surface area to reduce the local anodic current density. During electroplating, sufficient electrolyte is pumped through the consumable anodes at sufficient flow rates to minimize concentration gradient and/or avoid the generation of chlorine and/or oxygen gas and/or undesired reaction such as the anodic oxidation of P-bearing ions in the electrolyte. The active consumable anode material(s) can have a microstructure which is fine-grained and/or amorphous to ensure a uniform anodic dissolution.
摘要翻译：阳极施加器包括可以以非固定模式操作且对取向不敏感的消耗性阳极用于涂层或独立部件的选择性电镀/刷电沉积。使用的流通尺寸稳定的消耗性阳极是穿孔/多孔的，以提供相对无阻碍的电解质流动并且在足够低的电化学电势下操作以提供阳极金属/合金溶解以避免不期望的阳极反应。消耗性阳极包括高表面积的消耗性阳极材料，以减少局部阳极电流密度。在电镀过程中，足够的电解液以足够的流速被泵入消耗性阳极以最小化浓度梯度和/或避免产生氯和/或氧气和/或不期望的反应，例如电解质中含P离子的阳极氧化。活性消耗性阳极材料可以具有细晶粒和/或无定形的微结构，以确保均匀的阳极溶解。

6. 发明授权

US09209343B2 Electrodeposition of thin-film cells containing non-toxic elements 有权
公开(公告)号：US09209343B2
公开(公告)日：2015-12-08
申请号：US14699396
申请日：2015-04-29
申请人： International Business Machines Corporation
发明人： Hariklia Deligianni , Lian Guo , Raman Vaidyanathan
IPC分类号： H01L31/18
CPC分类号： C25D5/006 , C25D3/58 , C25D5/06 , C25D5/10 , C25D5/48 , C25D5/50 , C25D7/12 , H01L31/032 , H01L31/0326 , H01L31/18 , H01L31/1864 , Y02E10/50
摘要： A structure and method of making a thin-film solar cell is provided. A thin-film solar cell includes a substrate, absorber layer and a buffer layer. The absorber layer is deposited by a single-step bulk electrochemical process, or a multi-layer electrochemical process. The buffer layer is deposited by an electrochemical deposition process such as a multi-layer deposition or an atomic layer deposition. The absorber and buffer layers are non-toxic materials which can include sulfur incorporated during the deposition process or incorporated after deposition by an anneal step.

7. 发明申请

US20150345044A1 METHOD OF ELECTROPLATING COBALT ALLOY TO WIRING SURFACE 审中-公开
标题翻译：将钴钴合金电镀到电线表面的方法
公开(公告)号：US20150345044A1
公开(公告)日：2015-12-03
申请号：US14289828
申请日：2014-05-29
申请人： NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
发明人： Chi-Haw CHIANG , Chih WANG , Yu-Ping WANG , Chun-Yu LEE , Ren-Ruey FANG , Yang-Kuo KUO
IPC分类号： C25D5/16 , C25D5/10 , B23K1/00 , B23K31/02 , B23K1/20 , C25D7/06 , C25D5/18
CPC分类号： C25D5/16 , C25D3/48 , C25D3/562 , C25D3/62 , C25D5/06 , C25D5/10 , C25D5/18 , C25D7/0607 , H01L21/2885 , H01L21/76849 , H01L23/49866 , H01L2224/13111 , H01L2224/81444 , H05K3/244 , H05K2203/0723 , H01L2924/014
摘要： A method of electroplating a cobalt alloy to a wiring surface includes providing a substrate having a metal wiring; electroplating a cobalt-based alloy to the metal wiring at a deposition rate of 15-30 μm/hr to form thereon a cobalt-based alloy electroplated layer 0.5 μm-5 μm thick, wherein the main constituent element of the cobalt-based alloy is cobalt; plating gold to the cobalt-based alloy electroplated layer to form thereon a gold plated layer 0.03 μm-0.3 μm thick. The surface of the cobalt-based alloy electroplated layer features a crystalline-phase structure full of micro-protuberances, and the thickness of the gold plated layer is reduced to 0.03 μm.
摘要翻译：将钴合金电镀到布线表面的方法包括提供具有金属布线的基板; 以15-30μm/小时的沉积速率将钴基合金电镀到金属布线上，以形成0.5μm-5μm厚的钴基合金电镀层，其中钴基合金的主要构成元素为钴; 在钴基合金电镀层上镀金，在其上形成0.03μm〜0.3μm厚的镀金层。钴基合金电镀层的表面具有充满微突起的结晶相结构，镀金层的厚度减小到0.03μm。

8. 发明授权

US09193012B1 Nickel repair of titanium surfaces 有权
标题翻译：钛表面的镍修复
公开(公告)号：US09193012B1
公开(公告)日：2015-11-24
申请号：US14480243
申请日：2014-09-08
申请人： Goodrich Corporation
发明人： Edward Evans , Glenn Forbes , Mirko Zdero
IPC分类号： C25D5/34 , C25D17/14 , B23P6/00 , B05D1/28 , B05D1/36 , B05D3/12 , B05D3/00 , B05D5/00 , B05D7/14 , C23C18/16 , C23C18/32 , C25D5/14 , C25D5/38 , C25D9/04 , C25D5/42
CPC分类号： C25D5/06 , B05D1/28 , B05D1/36 , B05D3/007 , B05D3/12 , B05D5/005 , B05D7/14 , B23P6/00 , B23P2700/01 , B64F5/40 , C23C18/1637 , C23C18/1653 , C23C18/1689 , C23C18/32 , C23C18/34 , C23C18/36 , C25D3/12 , C25D5/12 , C25D5/14 , C25D5/42 , C25D5/48 , C25D9/04
摘要： The present disclosure includes methods for coating and/or repairing a surface of a titanium metal part. Uncoated or damaged portions of the surface of titanium parts are prepared for coating, followed by applying a first coating. A second coating may then be applied to form a coated or repaired surface. The coated or repaired surface may be machined to produce a finished surface having a predetermined thickness.
摘要翻译：本公开内容包括用于涂覆和/或修复钛金属部件的表面的方法。制备钛部件表面的未涂覆或损坏的部分用于涂覆，然后施加第一涂层。然后可以施加第二涂层以形成涂覆或修复的表面。涂覆或修复的表面可以被加工以产生具有预定厚度的成品表面。

9. 发明授权

US08771499B2 Electrohydraulic and shear cavitation radial counterflow liquid processor 有权
标题翻译：电液剪切空化径向逆流液处理器
公开(公告)号：US08771499B2
公开(公告)日：2014-07-08
申请号：US13589917
申请日：2012-08-20
申请人： Wilmot H. McCutchen , David J. McCutchen
发明人： Wilmot H. McCutchen , David J. McCutchen
IPC分类号： C02F1/461
CPC分类号： B01J19/088 , B01D9/0022 , B01F7/00875 , B01J19/008 , B01J19/1806 , B01J2219/0818 , B01J2219/0875 , B01J2219/0877 , B01J2219/0879 , B01J2219/0896 , C02F1/34 , C02F1/4608 , C02F1/4672 , C02F2001/46123 , C25D5/003 , C25D5/006 , C25D5/06 , C25D21/04
摘要： Axially fed fluid is sheared during long residence time in a radial workspace between counter-rotating coaxial disk-shaped centrifugal impellers. Gases evolve in the fractal turbulence of a shear layer, which is forced between laminar boundary layers, and an axial suction pump axially extracts evolved noncondensables and volatiles through cores of radial vortices in the shear layer. Cavitation due to shear between the impellers kills pathogens by shock waves, microjets, OH radicals, and nearby UV light pulses. Oppositely charged electrodes bounding the workspace cause electroporesis and electrohydraulic cavitation. The electrodes are counter-rotating ridged armatures of disk dynamos, forming a dynamic capacitor having audio frequency pulsed electric fields. Electrode erosion by arcing is prevented by shear between the electrodes.
摘要翻译：轴向馈送的流体在反向旋转同轴圆盘形离心式叶轮之间的径向工作空间中长时间停留时剪切。气体在剪切层的分形湍流中演化，其被迫在层流边界层之间，而轴向抽吸泵通过剪切层中的径向涡流的核心轴向提取演化的不可冷凝物和挥发物。由于叶轮之间的剪切引起的气蚀会通过冲击波，微喷射，OH自由基和附近的紫外光脉冲杀死病原体。与工作空间相邻的带电荷的电极引起电生理和电液空化。电极是盘式发电机的反向旋转的脊状电枢，形成具有音频脉冲电场的动态电容器。通过电极之间的剪切来防止电弧腐蚀。

10. 发明授权

US08529747B2 Methods for repairing steel components 有权
标题翻译：修复钢构件的方法
公开(公告)号：US08529747B2
公开(公告)日：2013-09-10
申请号：US13180973
申请日：2011-07-12
申请人： Stephen P. Gaydos , Mary Ann Gilman
发明人： Stephen P. Gaydos , Mary Ann Gilman
IPC分类号： C25D5/02 , C25D5/06 , C25D5/14 , C25D5/36 , C25D7/00
CPC分类号： C25D5/14 , C25D5/06 , C25D5/48
摘要： An exposed surface on a steel component is prepared for an application of a nickel high speed solution. The nickel high speed solution is applied to the exposed surface to create an intermediate surface on the component. The intermediate surface is prepared for an application of a nickel sulfamate solution. The nickel sulfamate solution is applied to the intermediate surface to create a duplex brush plating.
摘要翻译：制备钢组件上的暴露表面以应用镍高速溶液。将镍高速溶液施加到暴露的表面以在部件上形成中间表面。制备中间表面以应用氨基磺酸镍溶液。将氨基磺酸镍溶液施加到中间表面以产生双面电刷。

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