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1. 发明授权

US10557209B2 Method for optically inscribing and/or marking round stock 有权
公开(公告)号：US10557209B2
公开(公告)日：2020-02-11
申请号：US15536409
申请日：2015-12-21
申请人： Weber-Hydraulik GmbH
发明人： Vincenzo Trivigno , Christian Schwab , Thorsten Brecht
IPC分类号： C25D5/40 , C25D5/02 , C25D5/06 , C25D7/00 , C25D5/36 , C25F3/06 , C25F3/08 , F15B15/28 , G06K19/06
摘要： A method for producing round stock (10) which is provided with at least one inscription and/or marking (16), at least the surface (12) of the round stock (10) consisting of a metallic material, in particular of chromium or steel, for example of hardened steel, chromium-plated steel or stainless steel. In order to improve this method such that disadvantages and shortcomings are avoided, the method includes the following steps: placing on the surface (12) at least one cover (20) which is adapted to the shape of the surface (12) and in particular has the inscription and/or marking (16), such that the region to be provided with the inscription and/or marking (16) is not covered by the cover (20),—exposing the round stock (10) to a first electrolyte (30) together with the cover (20), material being removed from the surface (12) by said electrolyte in the region to be provided with the inscription and/or the marking (16) while producing depressions (14), and—exposing the round stock (10) together with the cover (20) and the depressions (14) not covered by the cover (20) to a second electrolyte (32) by which the depressions (14) are filled to produce the inscription and/or marking (16) which differs from the surface (12) optically, in particular with respect to color. The present invention also relates to round stock (10) which is manufactured from a metallic material, with the round stock being provided with a correspondingly produced inscription and/or marking (16).

2. 发明申请

US20190112723A1 APPARATUS AND METHOD OF CONTACT ELECTROPLATING OF ISOLATED STRUCTURES 审中-公开
公开(公告)号：US20190112723A1
公开(公告)日：2019-04-18
申请号：US16190314
申请日：2018-11-14
申请人： ECSI Fibrotools, Inc.
发明人： Igor V. Kadija
IPC分类号： C25D7/12 , C25D5/20 , H01L21/48 , H01L21/768 , C25D5/18 , C25D5/02 , C25D17/00 , C25D17/14 , C25D5/06 , H01L21/288
CPC分类号： C25D7/123 , C25D5/02 , C25D5/06 , C25D5/18 , C25D5/20 , C25D17/001 , C25D17/005 , C25D17/14 , H01L21/2885 , H01L21/4846 , H01L21/76873 , H01L21/76877 , H05K3/188
摘要： The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.

3. 发明申请

US20160108534A1 ALUMINUM DEPOSITION DEVICES AND THEIR USE IN SPOT ELECTROPLATING OF ALUMINUM 审中-公开
标题翻译：铝沉积装置及其在铝电镀中的应用
公开(公告)号：US20160108534A1
公开(公告)日：2016-04-21
申请号：US14516608
申请日：2014-10-17
申请人： UT-Battelle, LLC , The University of Mississippi
发明人： Sheng Dai , Xiao-Guang Sun , Charles L. Hussey , Li-Hsien Chou
IPC分类号： C25D5/02 , C25D17/00 , C25D3/44 , C25D5/06 , C25D5/04
CPC分类号： C25D5/02 , C25D3/665 , C25D5/06 , C25D17/14
摘要： A method for spot electroplating aluminum onto a metallic substrate without submersion or dipping of the metallic substrate in an electroplating bath, the method comprising: (i) spot coating said metallic substrate with an aluminum ion-containing electrolyte contained within a protective structure possessing at least one aperture, and releasing said electrolyte from said at least one aperture onto said metallic substrate to form a coating of said electrolyte thereon, wherein said electrolyte is in contact with an anode; and (ii) applying a voltage potential between the anode and metallic substrate polarized as cathode when the aluminum ion-containing electrolyte is released from said aperture and forms a coating on the metallic substrate, to produce a coating of aluminum on the substrate. Devices, such as brush and ball pen plating devices, for achieving the above-described method are also described.
摘要翻译：一种用于将铝电镀到金属基底上而不将金属基底浸没在电镀浴中的方法，所述方法包括：（i）用含有铝离子的电解质点样涂覆所述金属基底，所述电解质包含在至少具有至少一个孔，并将所述电解质从所述至少一个孔释放到所述金属基底上以在其上形成所述电解质的涂层，其中所述电解质与阳极接触; 以及（ii）当所述阳离子和所述金属基板极化时，当所述含铝离子的电解质从所述孔释放并在所述金属基底上形成涂层时，在所述阳极和所述金属基板之间施加电压，以在所述基板上产生铝涂层。还描述了用于实现上述方法的装置，例如刷子和滚珠笔电镀装置。

4. 发明授权

US09249521B2 Flow-through consumable anodes 有权
标题翻译：流通消耗性阳极
公开(公告)号：US09249521B2
公开(公告)日：2016-02-02
申请号：US13289470
申请日：2011-11-04
申请人： Klaus Tomantschger , Diana Facchini , Francisco Gonzalez , Jonathan McCrea , John Kratochwil , Dan Woloshyn , Yusuf Bismilla , Nandakumar Nagarajan , Mioara Neacsu
发明人： Klaus Tomantschger , Diana Facchini , Francisco Gonzalez , Jonathan McCrea , John Kratochwil , Dan Woloshyn , Yusuf Bismilla , Nandakumar Nagarajan , Mioara Neacsu
IPC分类号： C25D5/06 , C25D17/14 , C25D1/00
CPC分类号： C25D5/06 , C25D1/00 , C25D5/08 , C25D5/18 , C25D17/14
摘要： Anode applicators include consumable anodes, that can be operated in a non-stationary mode and are insensitive to orientation, are used in selective plating/brush electrodeposition of coatings or free-standing components. The flow-through dimensionally-stable, consumable anodes employed are perforated/porous to provide relatively unimpeded electrolyte flow and operate at low enough electrochemical potentials to provide for anodic metal/alloy dissolution avoiding undesired anodic reactions. The consumable anodes include consumable anode material(s) in high surface area to reduce the local anodic current density. During electroplating, sufficient electrolyte is pumped through the consumable anodes at sufficient flow rates to minimize concentration gradient and/or avoid the generation of chlorine and/or oxygen gas and/or undesired reaction such as the anodic oxidation of P-bearing ions in the electrolyte. The active consumable anode material(s) can have a microstructure which is fine-grained and/or amorphous to ensure a uniform anodic dissolution.
摘要翻译：阳极施加器包括可以以非固定模式操作且对取向不敏感的消耗性阳极用于涂层或独立部件的选择性电镀/刷电沉积。使用的流通尺寸稳定的消耗性阳极是穿孔/多孔的，以提供相对无阻碍的电解质流动并且在足够低的电化学电势下操作以提供阳极金属/合金溶解以避免不期望的阳极反应。消耗性阳极包括高表面积的消耗性阳极材料，以减少局部阳极电流密度。在电镀过程中，足够的电解液以足够的流速被泵入消耗性阳极以最小化浓度梯度和/或避免产生氯和/或氧气和/或不期望的反应，例如电解质中含P离子的阳极氧化。活性消耗性阳极材料可以具有细晶粒和/或无定形的微结构，以确保均匀的阳极溶解。

5. 发明授权

US08529747B2 Methods for repairing steel components 有权
标题翻译：修复钢构件的方法
公开(公告)号：US08529747B2
公开(公告)日：2013-09-10
申请号：US13180973
申请日：2011-07-12
申请人： Stephen P. Gaydos , Mary Ann Gilman
发明人： Stephen P. Gaydos , Mary Ann Gilman
IPC分类号： C25D5/02 , C25D5/06 , C25D5/14 , C25D5/36 , C25D7/00
CPC分类号： C25D5/14 , C25D5/06 , C25D5/48
摘要： An exposed surface on a steel component is prepared for an application of a nickel high speed solution. The nickel high speed solution is applied to the exposed surface to create an intermediate surface on the component. The intermediate surface is prepared for an application of a nickel sulfamate solution. The nickel sulfamate solution is applied to the intermediate surface to create a duplex brush plating.
摘要翻译：制备钢组件上的暴露表面以应用镍高速溶液。将镍高速溶液施加到暴露的表面以在部件上形成中间表面。制备中间表面以应用氨基磺酸镍溶液。将氨基磺酸镍溶液施加到中间表面以产生双面电刷。

6. 发明申请

US20110031125A1 Method for the electrochemical coating of a substrate by brush plating and device for carrying out said method 有权
标题翻译：用于电镀电镀基板的方法和用于实施所述方法的装置
公开(公告)号：US20110031125A1
公开(公告)日：2011-02-10
申请号：US12736547
申请日：2009-04-01
申请人： Frank Heinrichsdorff , Jens Dahl Jensen , Hans-Richard Kretschmer , Daniel Reznik , Arno Steckenborn
发明人： Frank Heinrichsdorff , Jens Dahl Jensen , Hans-Richard Kretschmer , Daniel Reznik , Arno Steckenborn
IPC分类号： C25D5/06 , C25D15/00 , C25D17/00 , B82Y30/00
CPC分类号： C25D5/06 , C25D5/20 , C25D13/22 , C25D15/00 , C25D21/10
摘要： A method for the electrochemical coating of a substrate uses brush plating. This is to take place with an electrolyte in that particles are dispersed, which are embedded into the developing layer. It is proposed to add the particles to the carrier for the electrolyte by way of a separate conduit system. The electrolyte is added by way of a conduit system. In this way it is achieved that an agglomeration of the particles in the electrolyte can be prevented because only a short time passes between when the particles are fed and the layer is formed. A device for electrochemical coating has two conduit systems provided for this purpose.
摘要翻译：基板的电化学涂覆方法使用刷镀。这是通过电解质发生的，因为它们分散在嵌入显影层中的颗粒中。建议通过单独的管道系统将颗粒添加到电解质的载体中。电解质通过导管系统加入。以这种方式，可以防止颗粒在电解质中的聚集，因为在颗粒进料和形成层之间只有很短的时间。用于电化学涂层的装置具有为此目的提供的两个导管系统。

7. 发明授权

US07754061B2 Method for controlling conductor deposition on predetermined portions of a wafer 有权
标题翻译：在晶片的预定部分上控制导体沉积的方法
公开(公告)号：US07754061B2
公开(公告)日：2010-07-13
申请号：US11221060
申请日：2005-09-06
申请人： Bulent M. Basol
发明人： Bulent M. Basol
IPC分类号： C25D5/06
CPC分类号： C25D17/001 , C25D5/022 , C25D5/06 , C25D7/123
摘要： A plating apparatus and method for deposition of a conductive material on a semiconductor wafer having surface portions and cavity portions. A differential in an adsorbed concentration of an additive, including accelerators or suppressors, between a surface portion and a cavity portion of a wafer surface is established in a chamber. A mask or sweeper may be used to establish the differential. After establishing the differential in the chamber, the conductive material is electrodeposited to form a conductive layer on the surface in another chamber.
摘要翻译：一种用于在具有表面部分和空腔部分的半导体晶片上沉积导电材料的电镀装置和方法。在室中建立了表面部分和晶片表面的空腔部分之间的添加剂的吸附浓度的差异，包括加速器或抑制器。可以使用面罩或清扫器来建立差速器。在室中建立差分器之后，导电材料被电沉积以在另一个室中的表面上形成导电层。

8. 发明授权

US07288179B2 Method for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing 有权
标题翻译：用于在电化学处理期间向旋转的微电子工件提供电和流体连通的方法
公开(公告)号：US07288179B2
公开(公告)日：2007-10-30
申请号：US10745030
申请日：2003-12-23
申请人： John M. Pedersen , James J. Erickson
发明人： John M. Pedersen , James J. Erickson
IPC分类号： C25D5/04 , C25D5/06
CPC分类号： C25D7/123 , C25D17/001 , H01L21/2885
摘要： A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft rotatable about a shaft axis and having a first end with a first electrical contact portion toward the first end, a second end opposite the first end, and an internal channel along the shaft axis between the first and second ends. The shaft can further have at least one first hole toward the first end with the first hole extending radially from the channel to an external surface of the shaft. The shaft can still further have at least one second hole toward the second end with the second hole extending from the channel to the external surface. A housing rotatably receives the shaft and has an aperture coupleable to a fluid source and/or fluid sink. The housing further has a fluid passage positioned adjacent to at least one of the first holes of the shaft and in fluid communication with the aperture when the shaft rotates relative to the housing. The housing also has a second electrical contact portion engaged with the first electrical contact portion to transmit electrical signals between the first and second electrical contact portions while the shaft rotates relative to the housing.
摘要翻译：一种用于将电信号和流体传送到微电子工件和/或从微电子工件传输的方法和装置。根据本发明的一个实施例的装置包括可绕轴线旋转的轴，具有朝向第一端的第一电接触部分的第一端，与第一端相对的第二端，以及沿轴线的内部通道在第一和第二端之间。轴可以进一步具有朝向第一端的至少一个第一孔，第一孔从通道径向延伸到轴的外表面。轴可以还具有朝向第二端的至少一个第二孔，第二孔从通道延伸到外表面。壳体可旋转地接收轴并且具有可耦合到流体源和/或流体槽的孔。壳体还具有一个流体通道，该流体通道邻近轴的第一孔中的至少一个定位，并且当轴相对于壳体旋转时与该孔流体连通。壳体还具有与第一电接触部分接合的第二电接触部分，以在轴相对于壳体旋转时在第一和第二电接触部分之间传输电信号。

9. 发明申请

US20050230264A1 Electroplating solution and method for electroplating 失效
标题翻译：电镀液及电镀方法
公开(公告)号：US20050230264A1
公开(公告)日：2005-10-20
申请号：US11045414
申请日：2005-01-27
申请人： Richard Lacey
发明人： Richard Lacey
IPC分类号： C25D3/02 , C25D3/22 , C25D3/58 , C25D5/06
CPC分类号： C25D5/06 , C25D3/02
摘要： An electroplating solution may be formulated as an aqueous solution of oxalic acid, trisodium phosphate and ammonium sulfate. Such solutions may be used for both brush plating and bath plating, and are suitable for use with a variety of plating metals and substrate metals without the need to add plating metal ions to the solution in the form of metal salts, chelates or complexes.
摘要翻译：电镀溶液可以配制成草酸，磷酸三钠和硫酸铵的水溶液。这种溶液可以用于刷镀和镀浴，并且适用于各种电镀金属和基底金属，而不需要以金属盐，螯合物或络合物的形式向溶液中加入电镀金属离子。

10. 发明授权

US06949171B2 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method 失效
标题翻译：在印刷电路上设置导电轨道的方法和用于执行该方法的装置
公开(公告)号：US06949171B2
公开(公告)日：2005-09-27
申请号：US10254269
申请日：2002-09-25
申请人： John Michael Lowe
发明人： John Michael Lowe
IPC分类号： C25D7/00 , C25D5/02 , C25D5/06 , H05K3/18 , H05K3/24 , C25D17/00
CPC分类号： H05K3/246 , C25D5/02 , C25D5/06 , H05K3/241 , H05K3/245
摘要： This invention is a method of providing conductive tracks on a printed circuit including coating a substrate carrying printed tracks with an electro-plating solution with a tool which provides a first electrode of an electro-plating circuit and a second electrode provided by the tracks which are to be electroplated, and a tool suitable for use in electro-plating electrically conductive regions of a substrate, the tool including an absorptive member in which plating solution can be carried; a first electrode of an electro-plating circuit adapted to make electrical contact with plating solution carried by the absorptive member; and at least one tool second electrode electrically insulated from the first electrode and spaced from the absorptive member, the tool second electrode being so positioned that as the absorptive member is wiped across a surface of a substrate, the second electrode contactor can be wiped across the surface of the substrate to contact electrically conductive regions of the substrate to form a second electrode of the electro-plating circuit therewith.
摘要翻译：本发明是一种在印刷电路上提供导电迹线的方法，包括用电镀溶液涂覆带有印刷轨迹的基板，该工具提供电镀电路的第一电极和轨道提供的第二电极，电镀的工具，以及适用于电镀电镀基板的导电区域的工具，该工具包括能够承载电镀液的吸收构件; 电镀电路的第一电极，其适于与由吸收构件携带的电镀溶液进行电接触; 以及与所述第一电极电绝缘并与所述吸收构件间隔开的至少一个工具第二电极，所述工具第二电极被定位成使得当所述吸收构件被擦拭穿过衬底的表面时，所述第二电极接触器可被擦过所述第二电极接触器基板的表面接触基板的导电区域，以形成电镀电路的第二电极。

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