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1. 发明申请

US20190003854A1 INTEGRATED SENSOR AND HOMOLOGOUS CALIBRATION STRUCTURE FOR RESONANT DEVICES 审中-公开
公开(公告)号：US20190003854A1
公开(公告)日：2019-01-03
申请号：US15636599
申请日：2017-06-28
申请人： Sasha Oster , Feras Eid , Thomas L. Sounart , Georgios C. Dogiamis
发明人： Sasha Oster , Feras Eid , Thomas L. Sounart , Georgios C. Dogiamis
IPC分类号： G01C25/00 , G01C19/5656
CPC分类号： G01C25/005 , G01C19/5656 , G01P1/00 , G01P1/023 , G01P15/0802 , G01P15/097 , G01P15/18 , G01P21/00 , G01P2015/084
摘要： An apparatus is provided which comprises: a substrate; a sensor including a sensing element, wherein the sensor is integrated within the substrate; and a calibration structure integrated within the substrate, wherein the calibration structure is to exhibit one or more physical or chemical properties same as the sensor but without the sensing element.

2. 发明申请

US20180087491A1 COUPLED ACCORDION SPRINGS IN MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES 审中-公开
公开(公告)号：US20180087491A1
公开(公告)日：2018-03-29
申请号：US15277511
申请日：2016-09-27
申请人： Analog Devices, Inc.
发明人： Qian Zhang , Kuang L. Yang , Lei Gu
IPC分类号： F03G7/08 , G01P15/08
CPC分类号： F03G7/08 , B81B3/0037 , B81B2203/0163 , G01P15/125 , G01P15/18 , G01P2015/084
摘要： Microelectromechanical systems (MEMS) devices are described that include a proof mass movably connected to a substrate by accordion springs disposed on opposite sides of the proof mass, with a coupler coupling two of the accordion springs together. The coupler is a bar in some implementations, and may be rigid. The coupler therefore restricts the motion of the accordion springs relative to each other. In this manner, the motion of the proof mass may be restricted to preferred types and frequencies.

3. 发明授权

US09921238B2 Sensor and its manufacturing method 有权
公开(公告)号：US09921238B2
公开(公告)日：2018-03-20
申请号：US14836558
申请日：2015-08-26
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Tamio Ikehashi
IPC分类号： G01P15/125 , B81B3/00 , B81C1/00 , G01P15/18 , G01P15/08
CPC分类号： G01P15/125 , B81B3/0086 , B81B2201/0235 , B81B2201/0264 , B81B2203/0136 , B81C1/00166 , G01L9/0048 , G01L9/0073 , G01L19/0618 , G01L19/146 , G01P15/18 , G01P2015/084 , G01P2015/0865
摘要： According to one embodiment, a sensor is disclosed. The sensor includes a substrate, a first fixed electrode arranged on the substrate, a movable electrode arranged above the first fixed electrode and being movable non-parallely, a second fixed electrode arranged above the movable electrode. The sensor further includes a detector to detect a difference between a first capacitance between the first fixed electrode and the movable electrode and a second capacitance between the movable electrode and the second fixed electrode.

4. 发明授权

US09696338B2 Capacitance detection circuit 有权
公开(公告)号：US09696338B2
公开(公告)日：2017-07-04
申请号：US14350807
申请日：2012-11-12
申请人： FUJI ELECTRIC CO., LTD.
发明人： Masami Kishiro
IPC分类号： G01P15/18 , G01P15/125 , G01L9/12 , G01R27/26 , G01P15/08
CPC分类号： G01P15/125 , G01L9/12 , G01P15/18 , G01P2015/084 , G01R27/2605
摘要： A capacitance detection circuit inhibits noise. The capacitance detection circuit detects a change in capacitance between a pair of electrodes of a physical quantity sensor, with these electrodes generating the change in capacitance in response to a change in physical quantity. The capacitance detection circuit has a carrier signal generating circuit that supplies a carrier signal to one of the electrodes, an operational amplifier that has an inverting input terminal to which the other one of the electrodes is input, a dummy capacity that is connected in parallel to the pair of electrodes, and a carrier signal conditioning circuit that inverts a phase of a carrier signal supplied from the carrier signal generating circuit to the dummy capacity and adjusts a gain to inhibit the dummy capacity.

5. 发明申请

US20170184628A1 MICRO-ELECTROMECHANICAL APPARATUS HAVING CENTRAL ANCHOR 审中-公开
公开(公告)号：US20170184628A1
公开(公告)日：2017-06-29
申请号：US15252226
申请日：2016-08-31
申请人： Industrial Technology Research Institute
发明人： Yu-Wen Hsu , Chung-Yuan Su , Chao-Ta Huang
IPC分类号： G01P15/18 , G01P15/08 , B81B3/00
CPC分类号： G01P15/18 , B81B3/0062 , B81B3/0072 , B81B2201/0235 , B81B2201/025 , B81B2203/0163 , B81B2203/0307 , B81B2203/04 , B81B2203/051 , B81B2203/053 , B81B2203/055 , G01P15/08 , G01P15/125 , G01P2015/084
摘要： A micro-electromechanical (MEMS) apparatus includes a substrate, two first anchors, a frame, and two elastic members. The substrate is provided with a reference point thereon. The frame surrounds the two first anchors, and each of the elastic members connects the corresponding first anchor and the frame. Each of the first anchors is disposed near the center of the MEMS apparatus to decrease an effect caused by warpage of the substrate. The MEMS apparatus can be applied to an MEMS sensor having a rotatable mass, such as a three-axis accelerometer or a magnetometer, to improve process yield, reliability, and measurement accuracy.

6. 发明申请

US20170123091A1 OCEAN BOTTOM SEISMIC SYSTEMS 审中-公开
公开(公告)号：US20170123091A1
公开(公告)日：2017-05-04
申请号：US15339233
申请日：2016-10-31
申请人： ION Geophysical Corporation
发明人： Peter Graham Stewart , Kees Faber
IPC分类号： G01V1/38
CPC分类号： G01V1/3852 , G01P15/0802 , G01P15/097 , G01P2015/084 , G01V1/164 , G01V1/38 , G01V1/3808 , G01V13/00 , G01V2210/1427
摘要： A seismic sensor system includes a seismic sensor suspended in an acoustic medium, which is disposed between first and second sensor housings. The acoustic medium can be selected to preferentially transmit pressure wave energy, based on the acoustic impedance of the surrounding water column or other seismic medium. The acoustic medium can also be selected to preferentially dissipate or otherwise reduce the transmitted shear wave energy. The second housing can similarly be configured to dissipate shear wave energy, while transmitting pressure wave energy in the form of acoustic waves that propagate through the acoustic medium to the seismic sensor.

7. 发明申请

US20160341759A1 SENSOR AND METHOD OF MANUFACTURING SAME 审中-公开
标题翻译：传感器及其制造方法
公开(公告)号：US20160341759A1
公开(公告)日：2016-11-24
申请号：US15114369
申请日：2015-01-26
申请人： KYOCERA CORPORATION
发明人： Tokuichi YAMAJI , Yuko YOKOTA , Atsuo HATATE , Hiroki ISHIKAWA , Takeshi SUZUKI , Hideaki ASAO
IPC分类号： G01P15/12 , G01P15/18 , G01D11/30 , G01L9/00 , G01L19/00 , G01P15/08
CPC分类号： G01P15/123 , G01D11/30 , G01L9/0054 , G01L19/0092 , G01P15/0802 , G01P15/18 , G01P2015/084 , H01L29/84
摘要： A sensor comprising: a mass element; a frame surrounding the mass element; a connecting body having flexibility, and connecting the mass element to the frame; a pressure detecting unit; and an acceleration detecting unit. The mass element comprises: a main portion comprising a through-hole passing therethrough from the top surface to the bottom surface; a mounting portion connected to the top surface of the main portion, and surrounding an outer periphery of the through-hole; a first cover portion having flexibility, connected to the mounting portion and covering the through-hole; and a second cover portion, disposed on the bottom surface of the main portion, covering the through-hole, and deformable less than the first cover portion when received an external force. The pressure detecting unit is disposed on the first cover portion and configured to detect, with an electrical signal, bending in the first cover portion caused by an air pressure difference between an outside pressure and an airtight space that is defined by the main portion, the first cover portion, the second cover portion, and the mounting portion. The acceleration detecting unit is disposed on the connecting body and configured to detect, with an electrical signal, bending in the connecting body.
摘要翻译：一种传感器，包括：质量元件; 围绕质量元件的框架; 具有柔性的连接体，并将质量元件连接到框架上; 压力检测单元; 和加速度检测单元。质量元件包括：主要部分，包括从顶表面到底表面穿过的通孔; 安装部分，连接到主体部分的顶表面，并围绕通孔的外周; 具有柔性的第一盖部分，连接到所述安装部分并覆盖所述通孔; 以及第二盖部，其设置在所述主体部的底面上，覆盖所述通孔，并且当受到外力时可变形为比所述第一盖部小。所述压力检测单元设置在所述第一盖部上，并且被配置为利用电信号检测由所述主要部分限定的外部压力和气密空间之间的空气压力差引起的所述第一盖部中的弯曲，第一盖部分，第二盖部分以及安装部分。加速度检测单元设置在连接体上并且被配置为用电信号检测连接体中的弯曲。

8. 发明申请

US20160107880A1 SUBSTRATE FOR DIAPHRAGM-TYPE RESONANT MEMS DEVICES, DIAPHRAGM-TYPE RESONANT MEMS DEVICE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：用于膜片型共振MEMS器件的基板，膜型谐振MEMS器件及其制造方法
公开(公告)号：US20160107880A1
公开(公告)日：2016-04-21
申请号：US14970933
申请日：2015-12-16
申请人： FUJIFILM Corporation
发明人： Takahiro SANO , Takayuki NAONO
IPC分类号： B81B3/00 , B81C1/00
CPC分类号： B81B3/0072 , B81B2203/0127 , B81B2203/0353 , B81B2203/04 , B81C1/00666 , B81C2201/0112 , B81C2201/0169 , B81C2201/017 , B81C2201/0176 , G01C19/56 , G01P15/09 , G01P2015/084 , H01L41/0815 , H01L41/1138 , H01L41/319 , H03H9/17 , H03H2003/027 , H03H2003/0414 , H04R17/10 , H04R31/00 , H04R2201/003
摘要： A producing method for a diaphragm-type resonant MEMS device includes forming a first silicon oxide film, forming a second silicon oxide film, forming a lower electrode, forming a piezoelectric film, forming an upper electrode, laminating the first silicon oxide film, the second silicon oxide film, the lower electrode, the piezoelectric film, and the upper electrode in this order on a first surface of a silicon substrate, and etching the opposite side surface of the first surface of the silicon substrate by deep reactive ion etching to form a diaphragm structure, in which the proportion R2 of the film thickness t2 of the second silicon oxide film with respect to the sum of the film thickness t1 of the first silicon oxide film and the film thickness t2 of the second silicon oxide film satisfies the following condition: 0.10 μm≦t1≦2.00 μm; and R2≧0.70.
摘要翻译：一种膜片式谐振MEMS器件的制造方法，包括：形成第一氧化硅膜，形成第二氧化硅膜，形成下部电极，形成压电膜，形成上部电极，层叠第一氧化硅膜，第二氧化硅膜氧化硅膜，下电极，压电膜和上电极，在硅衬底的第一表面上，并且通过深反应离子蚀刻蚀刻硅衬底的第一表面的相对侧表面，以形成膜结构，其中第二氧化硅膜的膜厚度t2的比例R2相对于第一氧化硅膜的膜厚度t1与第二氧化硅膜的膜厚度t2之和的比例满足以下条件：0.10μm＆nlE; t1＆nlE;2.00μm; R2≥0.70。

9. 发明申请

US20150211884A1 INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：惯性传感器及其制造方法
公开(公告)号：US20150211884A1
公开(公告)日：2015-07-30
申请号：US14610949
申请日：2015-01-30
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Jong Woon KIM , Sung Jun Lee , Won Kyu Jeung , Min Kyu Choi , Heung Woo Park
IPC分类号： G01C25/00 , B32B37/12 , G01P15/135 , B32B38/10 , B32B37/00 , C23F1/02 , B32B37/18 , B32B37/02
CPC分类号： G01C25/00 , B32B37/0076 , B32B37/02 , B32B37/12 , B32B37/18 , B32B38/10 , B32B2457/00 , C23F1/02 , G01C19/5755 , G01C19/5769 , G01P15/08 , G01P15/0802 , G01P15/135 , G01P2015/084 , Y10T156/1064
摘要： Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 disposed under a central portion 113 of the membrane 110, a post 130 disposed under an edge 115 of the membrane 110 so as to support the membrane 110, and a bottom cap 150 of which the edge 153 is provided with the first cavity 155 into which an adhesive 140 is introduced, wherein the adhesive 140 bonds an edge 153 to a bottom surface of the post, whereby the edge 153 of the bottom cap 150 is provided with the first cavity 155 to introduce the adhesive 140 into the first cavity 155, thereby preventing the adhesive 140 from being permeated into the post 130.
摘要翻译：这里公开了惯性传感器及其制造方法。根据本发明的优选实施例的惯性传感器100被构造成包括板状膜110，设置在膜110的中心部分113下方的质量体120，设置在膜110的边缘115下方的柱130 110，以支撑膜110，底盖150的边缘153设置有第一腔155，粘合剂140被引入到其中，其中粘合剂140将边缘153粘合到柱的底表面，由此底盖150的边缘153设置有第一腔155以将粘合剂140引入第一腔155中，从而防止粘合剂140渗透到柱130中。

10. 发明授权

US09075079B2 Method and structure of an integrated MEMS inertial sensor device using electrostatic quadrature-cancellation 有权
标题翻译：使用静电正交取消的集成MEMS惯性传感器装置的方法和结构
公开(公告)号：US09075079B2
公开(公告)日：2015-07-07
申请号：US14297337
申请日：2014-06-05
申请人： mCube Inc.
发明人： Shingo Yoneoka , Sudheer Sridharamurthy , Wenhua Zhang , Te-Hsi Terrence Lee
IPC分类号： G01P15/13 , G01C19/5762 , G01C19/5719 , G01P15/125 , G01P15/08 , G01C19/5712
CPC分类号： G01P15/131 , G01C19/5712 , G01C19/5719 , G01C19/5762 , G01P15/0802 , G01P15/125 , G01P2015/084 , G01P2015/0865
摘要： An integrated MEMS inertial sensor device. The device includes a MEMS inertial sensor overlying a CMOS substrate. The MEMS inertial sensor includes a drive frame coupled to the surface region via at least one drive spring, a sense mass coupled to the drive frame via at least a sense spring, and a sense electrode disposed underlying the sense mass. The device also includes at least one pair of quadrature cancellation electrodes disposed within a vicinity of the sense electrode, wherein each pair includes an N-electrode and a P-electrode.
摘要翻译：集成的MEMS惯性传感器装置。该器件包括覆盖CMOS衬底的MEMS惯性传感器。 MEMS惯性传感器包括经由至少一个驱动弹簧耦合到表面区域的驱动框架，经由至少一个感测弹簧耦合到驱动框架的感测质量块和设置在感测质量块下方的感测电极。该装置还包括设置在感测电极附近的至少一对正交消除电极，其中每对包括N电极和P电极。

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