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1. 发明申请

US20190219914A1 DIRECTLY WRITTEN WAVEGUIDE FOR COUPLING OF LASER TO PHOTONIC INTEGRATED CIRCUIT 审中-公开
公开(公告)号：US20190219914A1
公开(公告)日：2019-07-18
申请号：US16231289
申请日：2018-12-21
申请人： NORTH INC.
发明人： Jörg Pierer , Rony Jose James , Stefan Mohrdiek , Martin Jose Kiik , Syed Moez Haque , Douglas Raymond Dykaar
IPC分类号： G03B21/20 , G02B27/01 , H04N9/31 , G02B27/10
CPC分类号： G02B27/0172 , G02B6/12004 , G02B6/12007 , G02B6/124 , G02B6/125 , G02B6/13 , G02B6/42 , G02B6/4206 , G02B6/4215 , G02B6/4251 , G02B27/1006 , G02B27/4205 , G02B2006/12069 , G02B2006/12107 , G02B2006/12147 , G02B2006/12164 , G02B2027/011 , G02B2027/0112 , G02B2027/0116 , G02B2027/0178 , G03B21/2033 , H01S5/0206 , H01S5/02208 , H01S5/02248 , H01S5/0226 , H01S5/02272 , H01S5/02288 , H01S5/02296 , H01S5/0261 , H01S5/042 , H01S5/4012 , H01S5/4031 , H01S5/4093 , H01S5/423 , H04N9/3161
摘要： Systems, devices, and methods of manufacturing optical engines and laser projectors that are well-suited for use in wearable heads-up displays (WHUDs) are described. Generally, the optical engines of the present disclosure integrate a plurality of laser diodes (e.g., 3 laser diodes, 4 laser diodes) within a single, hermetically or partially hermetically sealed, encapsulated package. Photonic integrated circuits having grating or edge couplers thereon may be used to wavelength multiplex beams of light emitted by the plurality of laser diodes into a coaxially superimposed aggregate beam. A waveguide medium having one or more directly written waveguides may couple light from laser diodes to a photonic integrated circuit, and may optionally hermetically or partially hermetically seal the laser diodes, eliminating the need for a separate seal. Such optical engines may have advantages over existing designs including, for example, smaller volumes, better manufacturability, faster modulation speed, etc. WHUDs that employ such optical engines and laser projectors are also described.

2. 发明申请

US20190121024A1 Light Transmittable and Tissue Integrable Biofiber Device 审中-公开
公开(公告)号：US20190121024A1
公开(公告)日：2019-04-25
申请号：US15791414
申请日：2017-10-24
申请人： Luke Lu
发明人： Luke Lu , Michelle Lu , Emily Lu , Richard Lu
IPC分类号： G02B6/122 , G02B6/04 , A61B5/00 , G02B6/24
CPC分类号： G02B6/1221 , A61B5/0059 , G02B1/04 , G02B1/045 , G02B6/0008 , G02B6/02033 , G02B6/04 , G02B6/06 , G02B6/241 , G02B2006/12069 , C08L101/16
摘要： The present invention provides a light transmittable and tissue integration integrable biofiber device including a plurality of biofibers. The plurality of biofibers consist a single bare fiber or a single constructed fiber. The single constructed fiber consists a core layer and either a single cladding layer or a plurality of cladding layers, and the cladding layer dads and fuses a circumferential surface of the core layer. Each of the plurality of biofibers comprises a light receiving end and a light emitting end, a light radiates through the light receiving end and the light is emitted from the a light emitting end. Therefore, the biofiber device of the present invention may simultaneously accomplish light transmittable and tissue integrable purposes to facilitate light therapy, optical gene therapy and optogenetics.

3. 发明申请

US20180136389A1 FLEXIBLE OPTICAL WAVEGUIDES AND METHODS FOR MANUFACTURING FLEXIBLE OPTICAL WAVEGUIDES 审中-公开
公开(公告)号：US20180136389A1
公开(公告)日：2018-05-17
申请号：US15811203
申请日：2017-11-13
申请人： The Charles Stark Draper Laboratory, Inc.
发明人： Jesse J. Wheeler , Joseph J. Register , Parshant Kumar , Carlos A. Segura , Charles A. Lissandrello , John J. LeBlanc
IPC分类号： G02B6/02 , G02B1/04 , G02B6/26 , B05D1/00 , B05D3/10 , B05D3/12 , A61N5/06
CPC分类号： G02B6/02033 , A61B5/6846 , A61N5/0601 , A61N2005/0612 , B05D1/005 , B05D3/107 , B05D3/12 , G02B1/046 , G02B1/048 , G02B6/12 , G02B6/262 , G02B2006/12069 , G02B2006/12138
摘要： The material stack of the present disclosure can be used for fabricating optical waveguides that are thin and flexible, and that can bend light around small turns. The stack of materials can include a polymer core and a cladding, which together can create a large difference in refractive index. As a result, light can remain within the core even when bent around radii where standard glass fibers could fail.

4. 发明申请

US20180045903A1 OPTICAL-ELECTRIC CIRCUIT BOARD 审中-公开
公开(公告)号：US20180045903A1
公开(公告)日：2018-02-15
申请号：US15726475
申请日：2017-10-06
申请人： OLYMPUS CORPORATION
发明人： Yusuke NAKAGAWA
IPC分类号： G02B6/42 , H05K1/14 , H05K1/02 , H05K1/18 , G02B6/122 , G02B6/036
CPC分类号： G02B6/428 , G02B6/03616 , G02B6/12 , G02B6/122 , G02B6/4214 , G02B6/4298 , G02B2006/12069 , H05K1/0274 , H05K1/144 , H05K1/181 , H05K2201/041 , H05K2201/10121 , H05K2201/10151 , H05K2201/10174 , H05K2201/10303 , H05K2201/2054
摘要： An optical-electric circuit board includes: a polymer-type optical waveguide substrate provided with a reflective surface which optically couples a first optical path and a second optical path to each other; and electrical wiring, wherein at least a portion of a member which configures the reflective surface is formed of a conductive member, the electrical wiring is formed of first wiring disposed on a side of a first principal surface of the optical waveguide substrate and second wiring disposed on a side of a second principal surface of the optical waveguide substrate, and the conductive member electrically connects the first wiring and the second wiring with each other.

5. 发明授权

US09823539B2 Methods and systems for forming optical modulators using micro-contact lithography 有权
公开(公告)号：US09823539B2
公开(公告)日：2017-11-21
申请号：US14901676
申请日：2013-06-26
申请人： EMPIRE TECHNOLOGY DEVELOPMENT LLC
发明人： Vincenzo Casasanta, III
IPC分类号： G02B6/13 , G02B6/122 , G02F1/225 , G02B6/138 , G02F1/025 , G02F1/065 , G02B6/12
CPC分类号： G02F1/225 , G02B6/122 , G02B6/13 , G02B6/138 , G02B2006/12069 , G02B2006/12142 , G02F1/025 , G02F1/065 , G02F2203/15
摘要： Optical modulators, one or more components of various optical modulators, and methods of forming optical modulators and/or one or more components are disclosed. A substrate may be provided and a precursor material may be applied to the substrate with a micro-contact printing stamp. The precursor material may be cured on the substrate and the waveguide may be formed into a micro-ring resonator. The micro-contact printing stamp may be configured to create a waveguide on the substrate.

6. 发明申请

US20170186739A1 PACKAGING OPTOELECTRONIC COMPONENTS AND CMOS CIRCUITRY USING SILICON-ON-INSULATOR SUBSTRATES FOR PHOTONICS APPLICATIONS 有权
公开(公告)号：US20170186739A1
公开(公告)日：2017-06-29
申请号：US15456769
申请日：2017-03-13
申请人： International Business Machines Corporation
发明人： Russell A. Budd , Mounir Meghelli , Jason Scott Orcutt , Jean-Olivier Plouchart
IPC分类号： H01L25/00 , H01L21/84 , H01L23/367 , H01L23/498 , H01S5/022 , H01L25/16 , G02B6/122 , G02B6/132 , G02B6/124 , H01L21/48 , H01L27/12
CPC分类号： H01L25/167 , G02B6/122 , G02B6/1221 , G02B6/124 , G02B6/132 , G02B6/34 , G02B6/4204 , G02B6/4214 , G02B6/4274 , G02B6/428 , G02B2006/12061 , G02B2006/12069 , G02B2006/12123 , G02B2006/12147 , H01L21/4853 , H01L21/486 , H01L21/84 , H01L23/367 , H01L23/3675 , H01L23/485 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L23/585 , H01L25/117 , H01L25/50 , H01L27/1203 , H01L2223/58 , H01L2224/16225 , H01L2924/15311 , H01S5/021 , H01S5/0215 , H01S5/02248 , H01S5/02272 , H01S5/02469 , H01S5/026 , H01S5/1032 , H01S5/105 , H01S5/18341 , H01S5/18361 , H01S5/1838
摘要： Package structures and methods are provided to integrate optoelectronic and CMOS devices using SOI semiconductor substrates for photonics applications. For example, a package structure includes an integrated circuit (IC) chip, and an optoelectronics device and interposer mounted to the IC chip. The IC chip includes a SOI substrate having a buried oxide layer, an active silicon layer disposed adjacent to the buried oxide layer, and a BEOL structure formed over the active silicon layer. An optical waveguide structure is patterned from the active silicon layer of the IC chip. The optoelectronics device is mounted on the buried oxide layer in alignment with a portion of the optical waveguide structure to enable direct or adiabatic coupling between the optoelectronics device and the optical waveguide structure. The interposer is bonded to the BEOL structure, and includes at least one substrate having conductive vias and wiring to provide electrical connections to the BEOL structure.

7. 发明申请

US20170047312A1 PACKAGING OPTOELECTRONIC COMPONENTS AND CMOS CIRCUITRY USING SILICON-ON-INSULATOR SUBSTRATES FOR PHOTONICS APPLICATIONS 有权
标题翻译：使用硅绝缘体基板包装光电元件和CMOS电路用于光电子应用
公开(公告)号：US20170047312A1
公开(公告)日：2017-02-16
申请号：US14825393
申请日：2015-08-13
申请人： International Business Machines Corporation
发明人： Russell A. Budd , Mounir Meghelli , Jason Scott Orcutt , Jean-Olivier Plouchart
IPC分类号： H01L25/16 , H01L27/12 , H01S5/022 , H01L23/367 , G02B6/34 , H01L21/84 , H01S5/024 , G02B6/122 , G02B6/124 , H01L23/498 , H01L21/48
CPC分类号： H01L25/167 , G02B6/122 , G02B6/1221 , G02B6/124 , G02B6/132 , G02B6/34 , G02B6/4204 , G02B6/4214 , G02B6/4274 , G02B6/428 , G02B2006/12061 , G02B2006/12069 , G02B2006/12123 , G02B2006/12147 , H01L21/4853 , H01L21/486 , H01L21/84 , H01L23/367 , H01L23/3675 , H01L23/485 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L23/585 , H01L25/117 , H01L25/50 , H01L27/1203 , H01L2223/58 , H01L2224/16225 , H01L2924/15311 , H01S5/021 , H01S5/0215 , H01S5/02248 , H01S5/02272 , H01S5/02469 , H01S5/026 , H01S5/1032 , H01S5/105 , H01S5/18341 , H01S5/18361 , H01S5/1838
摘要： Package structures and methods are provided to integrate optoelectronic and CMOS devices using SOI semiconductor substrates for photonics applications. For example, a package structure includes an integrated circuit (IC) chip, and an optoelectronics device and interposer mounted to the IC chip. The IC chip includes a SOI substrate having a buried oxide layer, an active silicon layer disposed adjacent to the buried oxide layer, and a BEOL structure formed over the active silicon layer. An optical waveguide structure is patterned from the active silicon layer of the IC chip. The optoelectronics device is mounted on the buried oxide layer in alignment with a portion of the optical waveguide structure to enable direct or adiabatic coupling between the optoelectronics device and the optical waveguide structure. The interposer is bonded to the BEOL structure, and includes at least one substrate having conductive vias and wiring to provide electrical connections to the BEOL structure.
摘要翻译：提供封装结构和方法，以集成使用SOI半导体衬底的光电子和CMOS器件进行光子学应用。例如，封装结构包括集成电路（IC）芯片和安装到IC芯片的光电子器件和插入器。 IC芯片包括具有掩埋氧化物层的SOI衬底，与掩埋氧化物层相邻设置的活性硅层和在活性硅层上形成的BEOL结构。从IC芯片的有源硅层图案化光波导结构。光电子器件安装在掩埋氧化物层上，与光波导结构的一部分对准，以实现光电子器件与光波导结构之间的直接或绝热耦合。插入器结合到BEOL结构，并且包括至少一个具有导电通孔和布线的基板以提供到BEOL结构的电连接。

8. 发明申请

US20160109653A1 OPTICAL INTERCONNECTS AND METHODS OF FABRICATING SAME 审中-公开
标题翻译：光学互连及其制作方法
公开(公告)号：US20160109653A1
公开(公告)日：2016-04-21
申请号：US14884242
申请日：2015-10-15
申请人： GEORGIA TECH RESEARCH CORPORATION
发明人： William A. Vis , Bruce Chia-Te Chou , Venkatesh Sundaram , Rao R. Tummala , Terry P. Bowen , Jibin Sun
IPC分类号： G02B6/12 , G02B6/26 , G02B6/122 , G02B6/136 , G02B6/132
CPC分类号： G02B6/1221 , G02B6/4202 , G02B2006/12069
摘要： An embodiment provides an optical interconnect comprising first and second planar metallization layers, a glass substrate disposed between at least portions of the first and second metallization layers, an aperture in the second metallization layer having a first and second ends, and a polymer waveguide having a first end adjacent the first end of the aperture. The first end of the waveguide can have a first edge defining a first acute angle with respect to a top surface of the waveguide. The first end of the optical waveguide can be configured to receive an optical signal traversing through the glass substrate from a source proximate a first position on a top surface of the glass substrate and direct the optical signal with the first edge in a direction parallel to the glass substrate towards a second end of the waveguide.
摘要翻译：实施例提供了包括第一和第二平面金属化层的光学互连，设置在第一和第二金属化层的至少部分之间的玻璃衬底，第二金属化层中的孔具有第一和第二端，以及聚合物波导，其具有第一端邻近孔的第一端。波导的第一端可以具有相对于波导的顶表面限定第一锐角的第一边缘。光波导的第一端可以被配置为接收从玻璃基板的顶表面附近的第一位置处的源极穿过玻璃基板的光信号，并且将光信号与第一边缘沿平行于玻璃基板的方向引导玻璃基板朝向波导的第二端。

9. 发明申请

US20140341519A1 MONOLITHIC POLYMER OPTICAL FIBER RIBBON 有权
标题翻译：单模聚合物光纤罗宾
公开(公告)号：US20140341519A1
公开(公告)日：2014-11-20
申请号：US14344080
申请日：2012-10-19
申请人： CHROMIS FIBEROPTICS, INC.
发明人： Whitney R. White
IPC分类号： G02B6/44
CPC分类号： G02B6/4403 , G02B1/046 , G02B1/048 , G02B6/02033 , G02B6/4495 , G02B2006/12069
摘要： The present disclosure includes an optical fiber ribbon, using polymer optical fibers and an extremely thin adhesive coating to provide adhesion between the fibers. The external surfaces of the optical fiber ribbons are precisely placed with respect to the optical cores of the constituent fibers, and the optical cores of the fibers are precisely placed with respect to each other. Therefore, the external surface of the ribbon is used as a reference surface for aligning the array of optical fiber cores to arrays of optical emitters or detectors at the ends of the ribbon. Thus, the optical fiber ribbon of the present disclosure is cut, either by a sharp blade or other tool as suitable to expose a cross-section of the ribbon, and inserted as a single unit into a receptacle that aligns the outer surface of the ribbon with respect to the array of optical emitters or detectors.
摘要翻译：本公开包括使用聚合物光纤的光纤带和极薄的粘合剂涂层以提供纤维之间的粘附。光纤带的外表面相对于构成纤维的光芯被精确地放置，并且光纤的光纤芯相对于彼此精确地放置。因此，带的外表面用作参考表面，用于将光纤芯阵列对准在色带末端的光发射器或检测器的阵列。因此，本公开的光纤带通过锋利的刀片或其他工具被切割成适合于暴露带的横截面，并且作为单个单元插入插座中，该插座使带的外表面对齐相对于光发射器或检测器的阵列。

10. 发明申请

US20130209045A1 VISUAL TRACER SYSTEM FOR FIBER OPTIC CABLE 有权
标题翻译：光纤电缆视觉跟踪系统
公开(公告)号：US20130209045A1
公开(公告)日：2013-08-15
申请号：US13431565
申请日：2012-03-27
申请人： David L. Dean, JR. , William C. Hurley
发明人： David L. Dean, JR. , William C. Hurley
IPC分类号： G02B6/44 , G02B6/02
CPC分类号： G02B6/02033 , G02B6/00 , G02B6/001 , G02B6/443 , G02B6/447 , G02B2006/12069 , G02B2006/12083 , G02B2006/12111 , G02B2006/1219
摘要： A fiber optic cable includes a first optical fiber, a jacket, and a second optical fiber. The first optical fiber includes a glass core and cladding. The glass core is configured to provide controlled transmission of light through the fiber optic cable for high-speed data communication. The jacket has an interior surface that defines a conduit through which the first optical fiber extends. The jacket further has an exterior surface that defines the outside of the fiber optic cable. The second optical fiber is integrated with the exterior surface of the jacket.
摘要翻译：光纤电缆包括第一光纤，护套和第二光纤。第一光纤包括玻璃芯和包层。玻璃芯被配置为提供通过光纤电缆的光的受控传输以用于高速数据通信。护套具有内表面，该内表面限定第一光纤延伸穿过的导管。护套还具有限定光纤电缆外部的外表面。第二光纤与护套的外表面一体化。

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