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    • 9. 发明申请
    • ELECTRONIC/PHOTONIC CHIP INTEGRATION AND BONDING
    • 电子/光子芯片整合与接合
    • US20160131862A1
    • 2016-05-12
    • US14752476
    • 2015-06-26
    • Rockley Photonics Limited
    • Andrew RickmanGuomin YuAaron ZilkieHaydn F. Jones
    • G02B6/43G02B6/12G02B6/42
    • G02B6/43G02B6/12019G02B6/3548G02B6/356G02B6/4279G02B6/4295G02F1/025H04B10/40
    • An optical waveguide device comprising: one or more photonic chips, the one or more photonic chips including: a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and a second portion of a photonic chip comprising an array of second components, each of the second components configured to receive an electrical input; the optical waveguide device further comprising: an integrated circuit; the integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components; wherein the integrated circuit is directly mounted onto the one or more photonic chips; and/or wherein the integrated circuit is located between the first portion of a photonic chip and the second portion of a photonic chip.
    • 一种光波导装置,包括:一个或多个光子芯片,所述一个或多个光子芯片包括:包括第一部件阵列的光子芯片的第一部分,所述第一部件中的每一个具有光输入和电输出; 以及包括第二组件阵列的光子芯片的第二部分,所述第二组件中的每一个被配置为接收电输入; 所述光波导装置还包括:集成电路; 所述集成电路在所述第一组件的电输出和所述第二组件的相应电输入之间形成电桥; 其中所述集成电路直接安装在所述一个或多个光子芯片上; 和/或其中集成电路位于光子芯片的第一部分和光子芯片的第二部分之间。