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1. 发明公开

US20240243019A1 SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM 审中-公开
公开(公告)号：US20240243019A1
公开(公告)日：2024-07-18
申请号：US18403818
申请日：2024-01-04
申请人： Kokusai Electric Corporation
发明人： Yuichiro TAKESHIMA , Masanori Nakayama , Yasutoshi Tsubota , Hiroto Igawa , Yuki Yamakado , Hiroki Kishimoto
IPC分类号： H01L21/66 , H01J37/32
CPC分类号： H01L22/26 , H01J37/32935 , H01J37/3299 , H01J2237/24585 , H01J2237/24592
摘要： To suppress fluctuations in substrate processing results over time due to operations of a substrate processing apparatus, there is provided a technique that includes: a transfer chamber where a substrate is transferred; a process chamber in which the substrate is processed under process conditions of the substrate; a measurer for measuring a mass of the substrate before the processing of the substrate starts and after the processing of the substrate ends; a calculator for calculating a film thickness value of the substrate from a difference in the mass measured by the measurer before the processing starts and after the processing ends; a determinator for determining whether the film thickness value calculated by the calculator is abnormal; a setter for setting the process conditions; and a controller for controlling the setter to change the process conditions when the determinator determines that the film thickness value is abnormal.

2. 发明公开

US20240242946A1 LOW POWER PLASMA SYSTEM MONITOR METHOD 审中-公开
公开(公告)号：US20240242946A1
公开(公告)日：2024-07-18
申请号：US18098131
申请日：2023-01-18
申请人： SKY TECH INC.
发明人： JING-CHENG LIN , JUNG-HUA CHANG
IPC分类号： H01J37/32 , G01B11/06 , G01N27/04 , H01L21/66
CPC分类号： H01J37/3299 , G01B11/06 , G01N27/04 , H01L22/12 , H01J2237/24592 , H01J2237/3323 , H01L29/7786
摘要： This disclosure is a low power plasma system monitor method, which can be used to monitor the uniformity of the low power plasma system. A deposition process is performed on a testing substrate to form a metal film on the testing substrate. The resistance of the metal film on the testing substrate is measured to generate a plurality of first sheet resistance values. A testing pretreatment process is performed on the testing substrate through the low power plasma system to form a testing passivation on the metal film of the testing substrate. The resistance of the testing substrate after the testing pretreatment process is measured to generate a plurality of second sheet resistance values. Then the first sheet resistance values and the second sheet resistance values are analyzed to know the uniformity of the low power plasma system.

3. 发明公开

US20240183656A1 DETECTOR FOR PROCESS KIT RING WEAR 审中-公开
公开(公告)号：US20240183656A1
公开(公告)日：2024-06-06
申请号：US18401881
申请日：2024-01-02
申请人： Applied Materials, Inc.
发明人： Yogananda Sarode Vishwanath , Phillip A. Criminale
IPC分类号： G01B11/30 , H01J37/32 , H01L21/683 , H01L21/687
CPC分类号： G01B11/303 , H01J37/32495 , H01J37/32642 , H01J37/32715 , H01J37/32807 , H01L21/6833 , H01L21/68742 , H01J2237/24495 , H01J2237/24592
摘要： A diagnostic disc includes a disc body having a sidewall around a circumference of the disc body and at least one protrusion extending outwardly from a top of the sidewall. A non-contact sensor is attached to an underside of each of the at least one protrusion. A printed circuit board (PCB) is positioned within an interior formed by the disc body. Circuitry is disposed on the PCB and coupled to each non-contact sensor, the circuitry including at least a wireless communication circuit, a memory, and a battery. A cover is positioned over the circuitry inside of the sidewall, where the cover seals the circuitry within the interior formed by the disc body from an environment outside of the disc body.

4. 发明公开

US20240078663A1 METHOD FOR PROCESSING SUBSTRATE 审中-公开
公开(公告)号：US20240078663A1
公开(公告)日：2024-03-07
申请号：US18462386
申请日：2023-09-06
申请人： PSK INC.
发明人： KWANG SUNG YOO , GEON JONG KIM
IPC分类号： G06T7/00 , G06T7/11 , G06T7/174 , H01J37/32
CPC分类号： G06T7/001 , G06T7/11 , G06T7/174 , H01J37/32348 , H01J37/3288 , H01J37/32899 , H01J2237/221 , H01J2237/24592 , H01J2237/3341
摘要： The inventive concept provides a substrate treating method. The substrate treating method includes treating an edge region of a substrate using a plasma; and acquiring an image to be determined by imaging a substrate on which a treatment has been completed in the treating the edge region, comparing the image to be determined with an image stored in a database, and determining whether a substrate treated in the treating the edge region is defective or not, and wherein the image stored in the database is a defective image of a substrate which has been determined as defective, which is previously stored in the database in the acquiring the image to be determined.

5. 发明授权

US11915902B2 Conduction inspection method for multipole aberration corrector, and conduction inspection apparatus for multipole aberration corrector 有权
公开(公告)号：US11915902B2
公开(公告)日：2024-02-27
申请号：US17627294
申请日：2020-06-29
申请人： NuFlare Technology, Inc.
发明人： Atsushi Ando , Kazuhiko Inoue
IPC分类号： H01J37/153 , H01J37/147 , H01J37/21 , G01R31/307
CPC分类号： H01J37/153 , G01R31/307 , H01J37/147 , H01J37/21 , H01J2237/1534 , H01J2237/24592
摘要： A conduction inspection method for a multipole aberration corrector according to one aspect of the present invention includes applying, in a state where a predetermined potential has been applied to each shield electrode, an inspection charged particle beam to pass through a first opening, a second opening, and a third opening, using a multipole aberration corrector which includes an upper-stage substrate where the first opening is formed and a shield electrode is arranged around the first opening, a middle-stage substrate where the second opening is formed, a plurality of control electrodes are disposed to be opposite each other across the second opening, and a plurality of wirings are arranged to be individually connected to one of the plurality of control electrodes which are different from each other, and a lower-stage substrate where the third opening is formed and a shield electrode is arranged around the third opening, and which corrects aberration of a correction charged particle beam passing through the first opening, the second opening, and the third opening by individually variably applying a potential to each of the plurality of control electrodes; measuring, via a wiring individually connected to each control electrode of the plurality of control electrodes in the plurality of wirings, an inflow electron dose of electrons, into each control electrode of the plurality of control electrodes, which are secondarily emitted because the inspection charged particle beam has passed through the first opening, the second opening, and the third opening and has irradiated an object disposed at the downstream side of the lower-stage substrate; and determining individually, for each control electrode, whether there is conduction between a control electrode concerned and a wiring connected to the control electrode concerned, based on a result of measuring the inflow electron dose into each control electrode.

6. 发明授权

US11913777B2 Detector for process kit ring wear 有权
公开(公告)号：US11913777B2
公开(公告)日：2024-02-27
申请号：US16946147
申请日：2020-06-08
申请人： Applied Materials, Inc.
发明人： Yogananda Sarode Vishwanath , Phillip A. Criminale
IPC分类号： G01B11/30 , H01J37/32 , H01L21/687 , H01L21/683
CPC分类号： G01B11/303 , H01J37/32495 , H01J37/32642 , H01J37/32715 , H01J37/32807 , H01L21/6833 , H01L21/68742 , H01J2237/24495 , H01J2237/24592
摘要： A diagnostic disc includes a disc body having a sidewall around a circumference of the disc body and at least one protrusion extending outwardly from a top of the sidewall. A non-contact sensor is attached to an underside of each of the at least one protrusion. A a printed circuit board (PCB) is positioned within an interior formed by the disc body. Circuitry is disposed on the PCB and coupled to each non-contact sensor, the circuitry including at least a wireless communication circuit, a memory, and a battery. A cover is positioned over the circuitry inside of the sidewall, wherein the cover seals the circuitry within the interior formed by the disc body from an environment outside of the disc body.

7. 发明授权

US11835465B2 Detecting method and detecting device of gas components and processing apparatus using detecting device of gas components 有权
公开(公告)号：US11835465B2
公开(公告)日：2023-12-05
申请号：US16646487
申请日：2019-02-15
申请人： Hitachi High-Tech Corporation
发明人： Yoshifumi Ogawa , Yutaka Kouzuma , Masaru Izawa
IPC分类号： G01N21/73 , C23C16/52 , H01J37/32 , H01L21/67 , H05H1/24 , H01L21/66
CPC分类号： G01N21/73 , C23C16/52 , H01J37/32 , H01J37/32834 , H01L21/67253 , H05H1/24 , H01J2237/24592 , H01L21/67069 , H01L22/26
摘要： Provided is a detecting device of gas components that includes a gas component detecting unit for detection of a light emission of plasma that is formed by re-excitation downstream of an arrangement position of an object to be processed. The gas component detecting unit includes an introduced gas supply portion that supplies an introduced gas, a nozzle portion that is provided with a hole through which the introduced gas that is supplied from the introduced gas supply portion passes through and an opening through which a part of a gas to be analyzed flowing through an exhaust pipe portion is introduced into an inside of the hole, the opening being provided in an intermediate portion of the hole, a discharge electrode portion that generates plasma inside the nozzle portion by causing the gas to be analyzed that is introduced from the opening into an inside of the nozzle portion and the introduced gas that is supplied into the inside of the hole to discharge, and a light emission detecting unit that detects a light emission of the plasma generated inside the nozzle portion by the discharge electrode portion.

8. 发明公开

US20230274906A1 SYSTEM AND METHOD FOR SCANNING A SAMPLE USING MULTI-BEAM INSPECTION APPARATUS 审中-公开
公开(公告)号：US20230274906A1
公开(公告)日：2023-08-31
申请号：US17901767
申请日：2022-09-01
申请人： ASML Netherlands B.V.
发明人： Martinus Gerardus, Maria, Johannes MAASSEN , Joost Jeroen OTTENS , Long MA , Youfei JIANG , Weihua YIN , Wei-Te LI , Xuedong LIU
IPC分类号： H01J37/26 , H01J37/147 , H01J37/22 , H01J37/28
CPC分类号： H01J37/265 , H01J37/1474 , H01J37/222 , H01J37/28 , H01J2237/1505 , H01J2237/24592 , H01J2237/2817
摘要： An improved system and method for inspection of a sample using a particle beam inspection apparatus, and more particularly, to systems and methods of scanning a sample with a plurality of charged particle beams. An improved method of scanning an area of a sample using N charged particle beams, wherein N is an integer greater than or equal to two, and wherein the area of the sample comprises a plurality of scan sections of N consecutive scan lines, includes moving the sample in a first direction. The method also includes scanning, with a first charged particle beam of the N charged particle beams, first scan lines of at least some scan sections of the plurality of scan sections moving towards a probe spot of the first charged particle beam. The method further includes scanning, with a second charged particle beam of the N charged particle beams, second scan lines of at least some scan sections of the plurality of scan sections moving towards a probe spot of the second charged particle beam.

9. 发明公开

US20230197402A1 SEMICONDUCTOR INSPECTION APPARATUS AND SEMICONDUCTOR INSPECTION METHOD USING THE SAME 审中-公开
公开(公告)号：US20230197402A1
公开(公告)日：2023-06-22
申请号：US17891204
申请日：2022-08-19
申请人： Samsung Electronics Co., Ltd.
发明人： YUJIN CHO , JONGHYUK KANG , INHYE PARK , SUYOUNG LEE , CHUNGSAM JUN , HONGCHE NOH , JANGHEE LEE
IPC分类号： H01J37/28 , H01J37/244 , H01J37/26 , H01J37/147
CPC分类号： H01J37/28 , H01J37/244 , H01J37/265 , H01J37/1471 , H01J2237/2817 , H01J2237/0048 , H01J2237/24592
摘要： Disclosed are semiconductor inspection apparatuses and methods. The semiconductor inspection apparatus comprises a stage that supports a semiconductor device, a first column that irradiates a first electron beam toward the semiconductor device on the stage, a second column that irradiates a second electron beam toward the semiconductor device, and a detector that detects a secondary electron generated by the second electron beam. The first column is disposed to make a first angle with a top surface of the semiconductor device. The second column is disposed to make a second angle with the top surface of the semiconductor device. The first angle and the second angle are different from each other.

10. 发明申请

US20190108966A1 RUTHENIUM ENCAPSULATED PHOTOCATHODE ELECTRON EMITTER 审中-公开
公开(公告)号：US20190108966A1
公开(公告)日：2019-04-11
申请号：US16150675
申请日：2018-10-03
申请人： KLA-TENCOR CORPORATION
发明人： Gildardo R. Delgado , Rudy F. Garcia , Katerina Ioakeimidi , Frances Hill , Michael E. Romero
IPC分类号： H01J37/06 , H01J37/28 , H01J19/24
CPC分类号： H01J37/073 , G02B27/0927 , H01J1/3044 , H01J1/34 , H01J19/24 , H01J37/06 , H01J37/26 , H01J37/28 , H01J40/06 , H01J40/18 , H01J2201/30411 , H01J2201/30449 , H01J2201/3048 , H01J2201/308 , H01J2201/3423 , H01J2201/3425 , H01J2201/3426 , H01J2237/06333 , H01J2237/24521 , H01J2237/24592 , H01J2237/2817 , H01L21/67288
摘要： A photocathode structure, which can include an alkali halide, has a protective film on an exterior surface of the photocathode structure. The protective film includes ruthenium. This protective film can be, for example, ruthenium or an alloy of ruthenium and platinum. The protective film can have a thickness from 1 nm to 20 nm. The photocathode structure can be used in an electron beam tool like a scanning electron microscope.

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