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1. 发明申请

US20170194935A1 ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND VEHICLE 审中-公开
公开(公告)号：US20170194935A1
公开(公告)日：2017-07-06
申请号：US15302325
申请日：2015-04-09
申请人： SEIKO EPSON CORPORATION
发明人： Seiichi CHIBA
IPC分类号： H03H9/25 , H03B28/00 , H03H9/05
CPC分类号： H03H9/25 , H01L2224/48091 , H01L2224/73265 , H03B28/00 , H03H9/0547 , H03H9/058 , H03H9/1021 , H03H9/19 , H01L2924/00014
摘要： An electronic device includes: a container including first and second projections disposed on a bottom plate; and a vibration element having an end on a third surface side of the vibration element placed in a container via a connector so that the first and second projections, and a first surface face each other with a void therebetween, and the first and second projection portions partially overlap the first surface on a fourth surface side of the vibration element, and are aligned along the direction intersecting the longitudinal direction of the vibration element. In addition, a relationship of L1>L2>L3 is satisfied when an interval between ends in the intersecting direction is L1, an interval between the first and second projections is L2, and an interval between ends in the intersecting direction of an electrode film is L3.

2. 发明授权

US09252706B2 Saw device, saw oscillator, and electronic apparatus 有权
标题翻译：锯设备，锯片振荡器和电子设备
公开(公告)号：US09252706B2
公开(公告)日：2016-02-02
申请号：US14291457
申请日：2014-05-30
申请人： Seiko Epson Corporation
发明人： Kunihito Yamanaka , Naohisa Obata
IPC分类号： H03B5/30 , H03B5/32 , H03H9/25 , H01L41/053 , H03H9/02 , H03H9/05
CPC分类号： H03B5/326 , H01L41/053 , H01L2224/05554 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H03H9/02897 , H03H9/058 , H03H9/0585 , H03H9/25 , H01L2924/00014
摘要： A SAW device includes a SAW chip formed of a piezoelectric substrate and an IDT formed thereon, a base substrate that supports the SAW chip, and a fixing member that fixes the SAW chip to the base substrate. The SAW chip that forms a cantilever is supported by the base substrate via the fixing member in a position where the IDT does not overlap with the fixing member in a plan view of the SAW chip. The length W of the SAW chip in a y-axis direction and the length D of the fixing member in the y-axis direction satisfy 1
摘要翻译： SAW器件包括由压电基片和形成在其上的IDT形成的SAW芯片，支撑SAW芯片的基底基板和将SAW芯片固定到基底基板的固定部件。形成悬臂的SAW芯片在SAW芯片的平面图中，通过固定部件被支撑在IDT与固定部件不重叠的位置的基底基板上。 SAW芯片在y轴方向上的长度W和固定构件在y轴方向上的长度D满足1

3. 发明申请

US20150372659A1 ELASTIC WAVE DEVICE 有权
标题翻译：弹性波装置
公开(公告)号：US20150372659A1
公开(公告)日：2015-12-24
申请号：US14737723
申请日：2015-06-12
申请人： Murata Manufacturing Co., Ltd.
发明人： Yasuaki SHIN , Hiroyuki NISHI , Kazushi WATANABE
IPC分类号： H03H9/25 , H01L41/053
CPC分类号： H01L41/053 , H03H3/10 , H03H9/02559 , H03H9/058
摘要： An elastic wave device is configured such that a first surface acoustic wave chip including a piezoelectric substrate is mounted on a package board, a center of the first surface acoustic wave chip is shifted from a center of the package board when viewed from above, and a crystal Z-axis orientation of the piezoelectric substrate of the first surface acoustic wave chip is slanted to extend toward an outer side portion from a central portion of the package board as it progresses toward an upper surface from a lower surface of the piezoelectric substrate.
摘要翻译：弹性波装置被构造成使得包括压电基板的第一表面声波芯片安装在封装板上，当从上方观察时，第一声表面波芯片的中心从封装板的中心偏移，并且第一表面声波芯片的压电基板的晶体Z轴取向从压电基板的下表面朝向上表面从封装基板的中央部向外侧部倾斜。

4. 发明授权

US08841817B2 Surface acoustic wave sensor 有权
标题翻译：表面声波传感器
公开(公告)号：US08841817B2
公开(公告)日：2014-09-23
申请号：US13557378
申请日：2012-07-25
申请人： Hideaki Yamada , Kazuhiko Kano
发明人： Hideaki Yamada , Kazuhiko Kano
IPC分类号： H03H9/02 , H01L41/113 , H03H9/05 , G01N29/24 , G01N29/38 , G01N29/42
CPC分类号： H01L41/1132 , G01N29/2462 , G01N29/38 , G01N29/42 , G01N2291/0423 , H03H9/02622 , H03H9/058 , H03H9/0585
摘要： In a SAW device, a first area placed at a surface of a measurement subject directly under a propagation portion is fixed to the measurement subject, and a second area placed at the surface of the measurement subject directly under both a drive electrode and a reflector is not fixed to the measurement subject. When a strain is generated in the measurement subject, a strain is generated only in the propagation portion, and a phase change is generated in a surface acoustic wave reflected by the reflector. Because the phase change is hardly affected by a temperature change, the strain of the measurement subject can be measured based on the phase change. Because a resonant frequency of the SAW device is changed by the temperature change, but is not affected by the strain of the measurement subject, a temperature can be measured based on a resonant frequency change.
摘要翻译：在SAW器件中，将直接位于传播部分的测量对象的表面的第一区域固定在测定对象上，在测量对象的表面直接位于驱动电极和反射体的下方的第二区域是没有固定在测量对象上。当在测量对象中产生应变时，仅在传播部分中产生应变，并且在由反射器反射的表面声波中产生相变。由于相变几乎不受温度变化的影响，所以测量对象的应变可以基于相位变化来测量。由于SAW器件的谐振频率由于温度变化而变化，而是不受测量对象的应变的影响，所以可以基于谐振频率变化来测量温度。

5. 发明授权

US08749114B2 Acoustic wave device 有权
标题翻译：声波装置
公开(公告)号：US08749114B2
公开(公告)日：2014-06-10
申请号：US13352500
申请日：2012-01-18
申请人： Kazushige Hatakeyama , Takashi Miyagawa
发明人： Kazushige Hatakeyama , Takashi Miyagawa
IPC分类号： H01L41/053 , H03H9/05
CPC分类号： H03H9/058 , H01L2224/16225 , H01L2924/15184 , H01L2924/19105 , H03H3/02 , H03H3/08 , H03H9/0523 , H03H9/0542 , H03H9/059 , H03H9/1042 , H03H9/105 , H03H9/1078 , H03H9/1085
摘要： An acoustic wave device includes, a substrate, an acoustic wave device chip that has a vibration part exciting an acoustic wave and is mounted on a surface of the substrate so that the vibration part is exposed to a space formed between the substrate and the acoustic wave device chip, and a joining part that is provided so as to surround the vibration part and joins the substrate and the acoustic wave device chip together. The joining part includes a first member made of solder, and a second member that is stacked on the first member and is made of a substance having a melting point higher than the solder. The second member has a thickness larger than a coplanarity of the surface of the substrate.
摘要翻译：声波装置包括：衬底，声波器件芯片，其具有激励声波的振动部分并且安装在衬底的表面上，使得振动部分暴露于形成在衬底和声波之间的空间以及以包围振动部并且将基板和声波装置芯片连接在一起的方式设置的接合部。接合部包括由焊料构成的第一部件和层叠在第一部件上并且由熔点高于焊料的物质制成的第二部件。第二构件的厚度大于衬底表面的共面度。

6. 发明申请

US20110148250A1 Spherical surface acoustic wave apparatus 失效
标题翻译：球面声波装置
公开(公告)号：US20110148250A1
公开(公告)日：2011-06-23
申请号：US12929925
申请日：2011-02-24
申请人： Noritaka Nakaso
发明人： Noritaka Nakaso
IPC分类号： H01L41/04 , H01L41/047 , H01L41/08
CPC分类号： H03H3/08 , H03H9/02614 , H03H9/058
摘要： A spherical surface acoustic wave apparatus includes a surface acoustic wave propagation substrate which has a surface acoustic wave circulation path on an outer surface thereof. The path is configured to be annular and continuous using at least a part of a spherical shape, and is able to be excited to generate surface acoustic wave and allows the excited surface acoustic wave to propagate and circulate therein in its annular and continuous direction. The apparatus further includes a substrate support which supports a region of the outer surface of the substrate, the region excluding the circulation path, and a support for a surface acoustic wave excitation/detection unit, which supports an elastic member supporting the excitation/detection unit, which makes the excitation/detection unit being in contact with the circulation path of the outer surface of the substrate through the elastic member, and which elastically deforms the elastic member.
摘要翻译：球面声波装置包括在其外表面上具有表面声波循环路径的声表面波传播基板。该路径被构造为使用至少一部分球形的环形和连续的，并且能够被激发以产生表面声波，并且允许激发的表面声波在其环形和连续方向上传播和循环。该装置还包括支撑基板的外表面的区域，不包括循环路径的区域的基板支撑件和支撑弹性构件的表面声波激励/检测单元的支撑件，该弹性构件支撑激励/检测单元，使得激发/检测单元通过弹性构件与基板的外表面的循环路径接触，并且弹性构件弹性变形。

7. 发明申请

US20040238928A1 Electronic component and package 失效
标题翻译：电子元器件和封装
公开(公告)号：US20040238928A1
公开(公告)日：2004-12-02
申请号：US10852311
申请日：2004-05-25
发明人： Naoyuki Mishima , Satoshi Ichikawa , Takamasa Oto
IPC分类号： H01L023/02
CPC分类号： H03H9/058 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48472 , H03H9/1071 , H01L2924/00014 , H01L2924/00
摘要： An electronic component includes: a package that includes a metal portion formed by pressing a metal, and an insulating portion attached to the metal portion through fusing; a chip housed in the package; first external terminals that are electrically connected to the chip with metal wires, and are partially embedded in the insulating portion; and ground terminals that are convexities of metal portion and are electrically connected to the chip with metal wires, connecting points between the first external terminals and the chip being located at the same height as connecting points between the ground terminals and the chip.
摘要翻译：电子部件包括：包括通过按压金属形成的金属部分和通过熔合附接到金属部分的绝缘部分的封装; 封装中的芯片; 第一外部端子，其用金属线电连接到芯片，并且部分地嵌入绝缘部分中; 和接地端子，金属部分凸起并用金属线电连接到芯片，第一外部端子和芯片之间的连接点位于与接地端子和芯片之间的连接点相同的高度处。

8. 发明授权

US6037698A Acoustic surface wave device 失效
标题翻译：声表面波装置
公开(公告)号：US6037698A
公开(公告)日：2000-03-14
申请号：US615144
申请日：1996-03-14
申请人： Masanori Ueda , Yoshiro Fujiwara , Takumi Kooriike
发明人： Masanori Ueda , Yoshiro Fujiwara , Takumi Kooriike
IPC分类号： H03H9/25 , H03H9/05 , H03H9/64 , H03H9/10
CPC分类号： H03H9/1071 , H03H9/058 , H03H9/64 , H01L2224/48091 , H01L2224/48227 , H01L2924/16195
摘要： This invention relates to an acoustic surface wave device suitably used in a high-frequency circuit, in which high attenuation characteristics are provided.The present invention includes an acoustic surface wave element, a ceramic package having a ceramic substrate of a multi-layer structure, the ceramic substrate having a die-attach portion on which the acoustic surface wave element is mounted, the ceramic package having an input terminal and an output terminal connected to the acoustic surface wave element, the ceramic package having an opening located above the ceramic substrate, each of the input terminal and the output terminal having a ground terminal, and a metallic cap sealing the opening of the ceramic package. The metallic cap is electrically connected to one of the ground terminal of the input terminal and the ground terminal of the output terminal.
摘要翻译：本发明涉及适用于提供高衰减特性的高频电路中的声表面波装置。本发明包括声表面波元件，具有多层结构的陶瓷基片的陶瓷封装体，陶瓷基片具有安装声表面波元件的管芯附着部分，陶瓷封装具有输入端子以及连接到所述声表面波元件的输出端子，所述陶瓷封装具有位于所述陶瓷基板上方的开口，所述输入端子和所述输出端子中的每一个具有接地端子，以及密封所述陶瓷封装的开口的金属盖。金属盖电连接到输入端子的接地端子和输出端子的接地端子之间。

9. 发明授权

US4314215A Surface acoustic wave filter device with equalization of stray coupling 失效
标题翻译：具有杂散耦合均衡的表面声波滤波器件
公开(公告)号：US4314215A
公开(公告)日：1982-02-02
申请号：US168324
申请日：1980-07-11
申请人： Shigeo Tanji , Noboru Wakatsuki , Hideki Tominaga
发明人： Shigeo Tanji , Noboru Wakatsuki , Hideki Tominaga
IPC分类号： H03H9/145 , H03H3/08 , H03H9/02 , H03H9/05 , H03H9/64 , H03H9/25 , H03H9/42
CPC分类号： H03H9/6496 , H03H9/02874 , H03H9/0296 , H03H9/058
摘要： A surface acoustic wave filter device in which a capacitative coupling means is provided to couple at least one of the terminals of the SAW input transducer to at least one of the terminals of the output transducer, in order to equalize the levels of signals which are induced on the pair of output terminals of said output transducer without assuming the form of surface acoustic waves. The stray inductive coupling which normally occurs between the input and output terminals of the SAW filter degrades filter performance. Since the inductive coupling to the two output terminals is normally unequal, the inductively coupled unfiltered signals cannot be completely rejected by a balanced differential amplifier. By equalizing the levels of unfiltered signals at the output terminal, effective rejection by a differential amplifier is possible.
摘要翻译：一种表面声波滤波器装置，其中提供电容耦合装置以将SAW输入换能器的至少一个端子耦合到输出换能器的至少一个端子，以便均衡感应的信号电平在所述输出换能器的一对输出端子上，而不采取表面声波的形式。通常发生在SAW滤波器的输入和输出端子之间的杂散电感耦合会降低滤波器性能。由于与两个输出端子的电感耦合通常是不相等的，电感耦合未滤波信号不能被平衡差分放大器完全拒绝。通过均衡输出端子上未滤波信号的电平，差分放大器的有效抑制是可能的。

10. 发明申请

US20190245510A1 ELASTIC WAVE DEVICE, RADIO-FREQUENCY FRONT-END CIRCUIT, AND COMMUNICATION APPARATUS 审中-公开
公开(公告)号：US20190245510A1
公开(公告)日：2019-08-08
申请号：US16240836
申请日：2019-01-07
申请人： Murata Manufacturing Co., Ltd.
发明人： Masakazu MIMURA
IPC分类号： H03H9/17 , H03H9/02 , H03H9/145 , H03H3/08 , H01L41/312 , H01L41/29
CPC分类号： H03H9/175 , H01L41/29 , H01L41/312 , H03H3/08 , H03H9/02559 , H03H9/02929 , H03H9/058 , H03H9/14538
摘要： An elastic wave device using the S0 mode of plate waves includes a support substrate, an acoustic reflective layer laminated on the support substrate, a piezoelectric body laminated on the acoustic reflective layer, and an IDT electrode disposed on the piezoelectric body. In the acoustic reflective layer, T1+T2 is between about 0.40 and about 0.60 inclusive in a portion in which low and high acoustic impedance layers are adjacent in the laminating direction. T1 is the thickness of the low acoustic impedance layers. T2 is the thickness of the high acoustic impedance layers. T1/(T1+T2) is between about 0.35 and about 0.65 inclusive.

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