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    • 9. 发明授权
    • Method of manufacturing SAW device substrates
    • 制造SAW器件衬底的方法
    • US08490260B1
    • 2013-07-23
    • US11969956
    • 2008-01-07
    • Sergei ZhgoonKushal Bhattacharjee
    • Sergei ZhgoonKushal Bhattacharjee
    • H04R17/10H01L21/20
    • H03H9/02614H03H9/02574Y10T29/42Y10T29/49005
    • A method of manufacturing composite structures, or composite substrates, for a Surface Acoustic Wave (SAW) device are provided. In one embodiment of the present disclosure, a piezoelectric substrate is provided. A supporting substrate is formed over a first surface of the piezoelectric substrate. The first surface of the piezoelectric substrate may be unpolished. A second surface of the piezoelectric substrate is then processed to a desired thickness and polished. SAW device components such as, for example, interdigitated transducers (IDTs) and reflectors are then formed on the polished surface of the piezoelectric substrate. The supporting substrate may be formed using any desired type of deposition or growth process.
    • 提供了一种制造用于表面声波(SAW)器件的复合结构或复合衬底的方法。 在本公开的一个实施例中,提供压电基板。 在压电基板的第一表面上形成支撑基板。 压电基板的第一表面可以是未抛光的。 然后将压电基板的第二表面加工成所需的厚度并抛光。 然后在压电基板的抛光表面上形成SAW器件部件,例如交叉换能器(IDT)和反射器。 可以使用任何所需类型的沉积或生长工艺来形成支撑衬底。