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    • 2. 发明申请
    • METHOD OF FORMING CAPACITIVE MEMS SENSOR DEVICES
    • 形成电容式MEMS传感器器件的方法
    • US20160363609A1
    • 2016-12-15
    • US15148086
    • 2016-05-06
    • Texas Instruments Incorporated
    • IRA OAKTREE WYGANTPETER B. JOHNSON
    • G01P15/125B81C1/00B81B7/00H03H3/007H03H9/24
    • G01P15/125B81B7/007B81B2201/0271B81B2203/0127B81B2207/096B81C1/00301B81C2201/013B81C2203/0109B81C2203/0118B81C2203/036H02N1/006H03H3/0072H03H9/1057H03H9/2468H03H9/2489H04R19/005Y10T29/49165
    • A method of forming a capacitive micro-electro-mechanical system (MEMS) sensor device includes at least one capacitive MEMS sensor element with at least one capacitive MEMS sensor cell. A patterned dielectric layer including a thick dielectric region and a thin dielectric region is formed on a top side of a first substrate. A second substrate is bonded to the thick dielectric region to provide at least one sealed micro-electro-mechanical system (MEMS) cavity. The second substrate is thinned to reduce a thickness of said second substrate to provide a membrane layer. Vias are etched through the membrane layer and said thick dielectric region extending into the first substrate to form embedded vias. A dielectric liner which lines the embedded vias is formed within the first substrate. The embedded vias are filed with electrically conductive TSV filler material to form a plurality of through-substrate vias (TSVs), said plurality of TSVs extending to at least a top of said membrane layer. A patterned metal cap layer including metal caps is formed on top of said plurality of TSVs. Trenches are etched through regions of the membrane layer for releasing a first portion of the membrane layer over said MEMS cavity to provide a MEMS electrode and to define a fixed electrode. A third substrate including an inner cavity and outer protruding portions framing said inner cavity is bonded to the thick dielectric. The protruding portions are bonded to the thick dielectric region and, together with said first substrate vacuum, seals said MEMS electrode. The plurality of TSVs on a bottom side of said first substrate are exposed.
    • 形成电容式微机电系统(MEMS)传感器装置的方法包括具有至少一个电容式MEMS传感器单元的至少一个电容式MEMS传感器元件。 包括厚电介质区域和薄介电区域的图案化电介质层形成在第一衬底的顶侧上。 第二衬底被结合到厚电介质区域以提供至少一个密封的微机电系统(MEMS)空腔。 第二衬底被薄化以减小所述第二衬底的厚度以提供膜层。 通过膜层蚀刻通孔,并且延伸到第一衬底中的所述厚电介质区域形成嵌入的通孔。 在第一基板内形成有嵌入通孔的电介质衬垫。 嵌入的通孔与导电TSV填充材料一起放置以形成多个穿通基板通孔(TSV),所述多个TSV延伸到所述膜层的至少顶部。 在所述多个TSV的顶部上形成包括金属盖的图案化金属盖层。 通过膜层的区域蚀刻沟槽,以在所述MEMS空腔上释放膜层的第一部分,以提供MEMS电极并限定固定电极。 包括内腔的第三基板和框架所述内腔的外突出部分结合到厚电介质。 突出部分结合到厚电介质区域,并与所述第一衬底真空一起密封所述MEMS电极。 在所述第一基板的底侧上的多个TSV暴露。
    • 9. 发明申请
    • PIEZOELECTRIC DEVICE AND ELECTRONIC APPARATUS
    • 压电器件和电子设备
    • US20140368088A1
    • 2014-12-18
    • US14293630
    • 2014-06-02
    • Sony Corporation
    • Kazuo TAKAHASHISatoshi MITANIHidetoshi KABASAWA
    • H03H9/21
    • H03H9/21G01C19/5607H03H9/02259H03H9/2484H03H9/2489
    • A piezoelectric device includes a vibrator, a piezoelectric drive unit, and a first piezoelectric detector. The vibrator includes a first surface, a first groove formed along a first axis direction, and a second groove formed to be parallel to the first groove. The piezoelectric drive unit includes a first electrode pair provided in the first groove and opposed to each other in a second axis direction orthogonal to the first axis direction and parallel to the first surface, and a first piezoelectric body provided between the first electrode pair, and is capable of vibrating the vibrator. The first piezoelectric detector includes a second electrode pair provided in the second groove and opposed to each other in the second axis direction, and a second piezoelectric body provided between the second electrode pair, and is capable of detecting a vibration of the vibrator.
    • 压电装置包括振动器,压电驱动单元和第一压电检测器。 振动器包括第一表面,沿着第一轴线方向形成的第一凹槽和形成为平行于第一凹槽的第二凹槽。 所述压电驱动单元包括:第一电极对,设置在所述第一槽中,并且在与所述第一轴方向正交且与所述第一表面平行的第二轴方向上彼此相对;以及第一压电体,设置在所述第一电极对之间, 能振动振动器。 第一压电检测器包括设置在第二槽中并在第二轴向彼此相对的第二电极对,以及设置在第二电极对之间并且能够检测振动器的振动的第二压电体。