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1. 发明申请

US20180278235A1 VIBRATOR DEVICE, OSCILLATOR, GYRO SENSOR, ELECTRONIC APPARATUS, AND VEHICLE 审中-公开
公开(公告)号：US20180278235A1
公开(公告)日：2018-09-27
申请号：US15926571
申请日：2018-03-20
申请人： Seiko Epson Corporation
发明人： Tetsuya OTSUKI , Tsugio IDE
IPC分类号： H03H9/215 , H03B5/32 , H03H3/007 , B81B3/00 , H03L1/02 , G01C19/56
CPC分类号： H03H9/215 , B81B3/0072 , B81B7/0048 , G01C19/56 , G01C19/5621 , H03B5/32 , H03H3/0076 , H03H9/02023 , H03H9/02102 , H03H9/02157 , H03H9/0509 , H03H9/0542 , H03H9/0547 , H03H9/1021 , H03H9/177 , H03H9/19 , H03L1/028 , H03L1/04
摘要： A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1≥A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

2. 发明授权

US09985598B2 Frequency compensated oscillator design for process tolerances 有权
公开(公告)号：US09985598B2
公开(公告)日：2018-05-29
申请号：US14728930
申请日：2015-06-02
申请人： Robert Bosch GmbH
发明人： Markus Lutz , Aaron Partridge
IPC分类号： H03H3/007 , H03H9/24 , H03H9/02
CPC分类号： H03H3/0072 , H03H3/0076 , H03H3/0077 , H03H9/2447 , H03H9/2457 , H03H9/2463 , H03H2009/02299 , H03H2009/0233 , H03H2009/02496 , Y10T29/49016
摘要： A continuous or distributed resonator geometry is defined such that the fabrication process used to form a spring mechanism also forms an effective mass of the resonator structure. Proportional design of the spring mechanism and/or mass element geometries in relation to the fabrication process allows for compensation of process-tolerance-induced fabrication variances. As a result, a resonator having increased frequency accuracy is achieved.

3. 发明申请

US20170272050A1 RESONATOR MANUFACTURING METHOD 审中-公开
公开(公告)号：US20170272050A1
公开(公告)日：2017-09-21
申请号：US15610896
申请日：2017-06-01
申请人： Murata Manufacturing Co., Ltd.
发明人： Keiichi Umeda , Hiroshi Yamada , Yasuhiro Aida
IPC分类号： H03H9/02 , H03H9/17
CPC分类号： H03H9/02102 , B81B3/0081 , B81C2201/0181 , H03H3/0072 , H03H3/0076 , H03H9/02259 , H03H9/17 , H03H9/171 , H03H9/2463 , H03H9/2489 , H03H2009/02496 , H03H2009/241
摘要： A method for manufacturing a resonator that effectively addresses variations in resistivity for each wafer. The method for manufacturing a resonator includes forming a Si oxide film on a surface of a degenerated Si wafer, where the Si oxide film has a thickness set that is based on the doping amount of impurity in the degenerated Si wafer.

4. 发明授权

US09071223B2 At least first and second order temperature-compensated resonator 有权
标题翻译：至少一级和二阶温度补偿谐振器
公开(公告)号：US09071223B2
公开(公告)日：2015-06-30
申请号：US13510181
申请日：2010-11-10
申请人： Thierry Hessler , Thierry Conus , Kaspar Truempy
发明人： Thierry Hessler , Thierry Conus , Kaspar Truempy
IPC分类号： H01L41/08 , H03H9/02 , G04B17/22 , H01L41/22 , H03H3/007
CPC分类号： H03H9/02448 , G04B17/227 , H01L41/22 , H03H3/0076
摘要： A temperature compensated resonator including a body used in deformation, the core of the body including a first material. The body includes at least a first and second coating allowing the resonator to have substantially zero first and second order temperature coefficients. The temperature compensated regulator can be used in the field of time and frequency bases.
摘要翻译：一种温度补偿谐振器，包括用于变形的主体，所述主体的芯包括第一材料。主体包括至少第一和第二涂层，允许谐振器具有基本上零的一阶和二阶温度系数。温度补偿调节器可用于时基和频率场的领域。

5. 发明申请

US20150116050A1 VIBRATING ELEMENT, VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT 有权
标题翻译：振动元件，振动器，振荡器，电子设备和移动对象
公开(公告)号：US20150116050A1
公开(公告)日：2015-04-30
申请号：US14522961
申请日：2014-10-24
申请人： Seiko Epson Corporation
发明人： Keiji NAKAGAWA , Ryuta NISHIZAWA
IPC分类号： H03H9/21 , H03B5/32 , H03B5/36 , H03H9/17
CPC分类号： H03H9/21 , H03B5/32 , H03H3/0076 , H03H9/0542 , H03L1/028
摘要： A vibrating element has a drive mode, and first and second detection modes in which the vibrating element vibrates in a direction orthogonal to a vibration direction in the drive mode. In frequency-temperature characteristic curves representing a change in frequency due to a change in temperature in the respective modes with a horizontal axis representing an ambient temperature and a vertical axis representing a change in frequency, when a turnover temperature of the frequency-temperature characteristic curve in the drive mode is Ta [° C.], a turnover temperature of the frequency-temperature characteristic curve in the first detection mode is Tb [° C.], and a turnover temperature of the frequency-temperature characteristic curve in the second detection mode is Tc [° C.], Ta is lower than Tb and Tc, or Ta is higher than Tb and Tc.
摘要翻译：振动元件具有驱动模式，以及第一和第二检测模式，其中振动元件在与驱动模式下的振动方向正交的方向上振动。在频率 - 温度特性曲线中，表示由横轴表示环境温度的各模式的温度变化引起的频率变化，表示频率变化的纵轴表示频率温度特性曲线，在频率 - 温度特性曲线的周转温度在驱动模式为Ta [℃]时，第一检测模式下的频率 - 温度特性曲线的周转温度为Tb [℃]，第二检测中的频率 - 温度特性曲线的周转温度模式为Tc [℃]，Ta低于Tb和Tc，或Ta高于Tb和Tc。

6. 发明申请

US20140290019A1 METHOD FOR FABRICATING VIBRATOR 审中-公开
标题翻译：制造振动器的方法
公开(公告)号：US20140290019A1
公开(公告)日：2014-10-02
申请号：US14226824
申请日：2014-03-27
申请人： NIHON DEMPA KOGYO CO., LTD.
发明人： MAKIKO NAKAMURA
IPC分类号： H03H3/02
CPC分类号： H03H3/0076 , H03H9/2436 , Y10T29/42
摘要： A method for fabricating a vibrator with a vibrating plate and an electrode for vibrating the vibrating plate includes laminating, forming, filling-in, patterning, subsequently laminating, and subsequently etching. The forming forms a through hole that passes through a conductive film and a second sacrifice film and reaches at least a middle portion in a film thickness direction of a first sacrifice film. The filling-in fills in an auxiliary film for adjusting temperature characteristics including silicon and oxygen from a lower end position to an upper end position of the through hole. The subsequently etching etchs an upper end portion of the auxiliary film, a lower end portion of the auxiliary film, the first sacrifice film, the second sacrifice film, and a third sacrifice film, while leaving the auxiliary film inside the through hole on the vibrating plate, with a use of an etching fluid including hydrogen fluoride.
摘要翻译：用于振动振动板振动器的振动器的制造方法包括层压，成型，填充，图案化，随后的层叠和随后蚀刻。该成形形成通过导电膜和第二牺牲膜并且到达第一牺牲膜的膜厚度方向的至少中间部分的通孔。填充物填充辅助膜，用于调节从通孔的下端位置到上端位置的包括硅和氧的温度特性。随后蚀刻辅助膜的上端部分，辅助膜的下端部分，第一牺牲膜，第二牺牲膜和第三牺牲膜，同时使辅助膜留在通孔内振动使用包括氟化氢的蚀刻流体。

7. 发明授权

US08667665B2 Method of manufacturing a microelectromechanical system (MEMS) resonator 有权
标题翻译：制造微机电系统（MEMS）谐振器的方法
公开(公告)号：US08667665B2
公开(公告)日：2014-03-11
申请号：US13562684
申请日：2012-07-31
申请人： Paul Merritt Hagelin , Charles Grosjean
发明人： Paul Merritt Hagelin , Charles Grosjean
IPC分类号： H04R31/00
CPC分类号： H03H9/02448 , H01L41/22 , H01L41/253 , H02N1/00 , H03B5/30 , H03B5/32 , H03H3/0072 , H03H3/0073 , H03H3/0076 , H03H9/02244 , H03H9/02433 , H03H9/125 , H03H9/21 , H03H9/2405 , H03H9/2468 , H03H9/2484 , H03H2009/02251 , H03H2009/02283 , H03H2009/02291 , H03H2009/02299 , H03H2009/02322 , H03H2009/0233 , H03H2009/02496 , H03H2009/155 , Y10T29/42 , Y10T29/49002 , Y10T29/49005 , Y10T29/4902 , Y10T29/4908
摘要： One embodiment of the present inventions sets forth a method for decreasing a temperature coefficient of frequency (TCF) of a MEMS resonator. The method comprises lithographically defining slots in the MEMS resonator beams and filling the slots with a compensating material (for example, an oxide) wherein the temperature coefficient of Young's Modulus (TCE) of the compensating material has a sign opposite to a TCE of the material of the resonating element.
摘要翻译：本发明的一个实施例提出了降低MEMS谐振器的频率（TCF）的温度系数的方法。该方法包括光刻地限定MEMS谐振器光束中的狭缝并用补偿材料（例如，氧化物）填充槽，其中补偿材料的杨氏模量（TCE）的温度系数具有与材料的TCE相反的符号的谐振元件。

8. 发明授权

US08519806B2 Bulk-mode resonator having at least partially filled open cavities 有权
标题翻译：具有至少部分填充的开放空腔的体模式谐振器
公开(公告)号：US08519806B2
公开(公告)日：2013-08-27
申请号：US12794037
申请日：2010-06-04
申请人： Fabrice Casset , Cédric Durand
发明人： Fabrice Casset , Cédric Durand
IPC分类号： H03H9/24 , H03H9/46 , H03H3/013
CPC分类号： H03H3/0077 , H03H3/0076 , H03H9/2463 , H03H2009/02496
摘要： A method for forming a resonator including a resonant element, the resonant element being at least partly formed of a body at least partly formed of a first conductive material, the body including open cavities, this method including the steps of measuring the resonator frequency; and at least partially filling said cavities.
摘要翻译：一种用于形成包括谐振元件的谐振器的方法，所述谐振元件至少部分地由至少部分地由第一导电材料形成的主体形成，所述主体包括开放空腔，该方法包括以下步骤：测量谐振器频率; 并且至少部分地填充所述空腔。

9. 发明申请

US20130154054A1 MICRO-ELECTRO-MECHANICAL STRUCTURE (MEMS) CAPACITOR DEVICES, CAPACITOR TRIMMING THEREOF AND DESIGN STRUCTURES 有权
标题翻译：微电子机械结构（MEMS）电容器件，电容器及其设计结构
公开(公告)号：US20130154054A1
公开(公告)日：2013-06-20
申请号：US13326409
申请日：2011-12-15
申请人： Christopher V. JAHNES , Anthony K. STAMPER
发明人： Christopher V. JAHNES , Anthony K. STAMPER
IPC分类号： H01L29/02 , G06F17/50
CPC分类号： H01G5/18 , B81B2201/0221 , B81C99/0065 , H01G5/38 , H03H3/0076
摘要： Micro-electro-mechanical structure (MEMS) capacitor devices, capacitor trimming for MEMS capacitor devices, and design structures are disclosed. The method includes identifying a process variation related to a formation of micro-electro-mechanical structure (MEMS) capacitor devices across a substrate. The method further includes providing design offsets or process offsets in electrode areas of the MEMS capacitor devices across the substrate, based on the identified process variation.
摘要翻译：公开了微电子机械结构（MEMS）电容器件，用于MEMS电容器件的电容器微调和设计结构。该方法包括识别跨越衬底形成微机电结构（MEMS）电容器器件的过程变化。该方法还包括基于所识别的过程变化，在跨越衬底的MEMS电容器器件的电极区域中提供设计偏移或过程偏移。

10. 发明授权

US08381378B2 Methods of forming micromechanical resonators having high density trench arrays therein that provide passive temperature compensation 有权
标题翻译：形成其中具有高密度沟槽阵列的微机械谐振器的方法，其提供无源温度补偿
公开(公告)号：US08381378B2
公开(公告)日：2013-02-26
申请号：US12794361
申请日：2010-06-04
申请人： Farrokh Ayazi , Roozbeh Tabrizian , Giorgio Casinovi
发明人： Farrokh Ayazi , Roozbeh Tabrizian , Giorgio Casinovi
IPC分类号： H01L41/22 , H04R17/00
CPC分类号： H03H3/0076 , H03H9/02448 , H03H2009/2442 , Y10T29/42 , Y10T29/49005 , Y10T29/49155
摘要： A method of forming a micromechanical resonator includes forming a resonator body anchored to a substrate by at least a first anchor. This resonator body may include a semiconductor or other first material having a negative temperature coefficient of elasticity (TCE). A two-dimensional array of spaced-apart trenches are provided in the resonator body. These trenches may be filled with an electrically insulating or other second material having a positive TCE. The array of trenches may extend uniformly across the resonator body, including regions in the body that have relatively high and low mechanical stress during resonance. This two-dimensional array (or network) of trenches can be modeled as a network of mass-spring systems with springs in parallel and/or in series with respect to a direction of a traveling acoustic wave within the resonator body during resonance.
摘要翻译：形成微机械谐振器的方法包括通过至少第一锚固件将锚固到基板的谐振器体形成。该谐振器体可以包括具有负温度弹性系数（TCE）的半导体或其它第一材料。在谐振器体中设置有间隔开的沟槽的二维阵列。这些沟槽可以用具有正TCE的电绝缘或其它第二材料填充。沟槽阵列可以均匀地延伸穿过谐振器主体，包括在谐振期间具有相对高和低的机械应力的主体中的区域。沟槽的这个二维阵列（或网络）可以被模拟为质量弹簧系统的网络，弹簧在谐振期间相对于谐振器体内的行进声波的方向并联和/或串联。

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