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1. 发明申请

US20180209604A1 METAL PCB, HEADLIGHT MODULE HAVING METAL PCB APPLIED THERETO, AND METHOD FOR ASSEMBLING HEADLIGHT MODULE 审中-公开
公开(公告)号：US20180209604A1
公开(公告)日：2018-07-26
申请号：US15745363
申请日：2016-12-28
申请人： ECOCAB.CO.,LTD
发明人： Chang-Won KIM
IPC分类号： F21S41/19 , H01L25/075 , H01L33/62 , H01L33/64 , H01L23/538 , F21S41/141 , F21V29/503 , F21S45/47 , F21V29/89
CPC分类号： F21S41/192 , F21S41/141 , F21S43/14 , F21S43/195 , F21S45/47 , F21V29/503 , F21V29/89 , F21Y2115/10 , H01L23/5387 , H01L25/0753 , H01L33/62 , H01L33/64 , H01L33/641 , H01L33/647 , H01L2933/0066 , H01L2933/0075 , H05K1/0284 , H05K1/05 , H05K1/181 , H05K1/189 , H05K3/0061 , H05K2201/09054 , H05K2201/09063 , H05K2201/091 , H05K2201/10106
摘要： Provided are a metal PCB, a headlight module having the metal PCB applied thereto, and a method for assembling the headlight module, wherein the metal PCB has a base made of a metal material and configured as a thin plate, or the base has a predetermined thickness and is bent in a desired direction through a bending groove formed on the rear surface thereof, and the base has a plurality of chip mounting portions integrated thereon such that one or more LED chips are mounted thereon, the chip mounting portions being spaced at a predetermined interval and having at least two parts of incision surfaces formed on one side of the base such that the chip mounting portions are inclined and installed to have a predetermined angle with regard to the base.

2. 发明授权

US09914065B2 Selectively conductive toy building elements 有权
公开(公告)号：US09914065B2
公开(公告)日：2018-03-13
申请号：US14917564
申请日：2014-09-03
申请人： BRIXO SMART TOYS LTD.
发明人： Boaz Almog , Amir Saraf
IPC分类号： A63H33/04 , A63H33/08 , H05K1/02 , H05K1/11 , H05K3/32
CPC分类号： A63H33/042 , A63H33/086 , H05K1/0284 , H05K1/119 , H05K3/326 , H05K2201/0367 , H05K2201/09045 , H05K2201/09081 , H05K2201/091 , H05K2201/0999 , H05K2201/209
摘要： The present invention relates to a selectively conductive toy building element, comprising: a body adapted for releasable engagement to at least one other toy building element body or to a corresponding baseplate, the body including at least one conductive portion having at least one contact area adapted to generate pressure on a conductive portion or contact area of an adjacent toy building element body, in such a way that ensures electrical conduction between said toy building elements in a desired location and direction.

3. 发明申请

US20160135302A1 SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：用于安装电子元件的基板及其制造方法
公开(公告)号：US20160135302A1
公开(公告)日：2016-05-12
申请号：US14938191
申请日：2015-11-11
申请人： IBIDEN CO., LTD.
发明人： Naoyuki NAGAYA , Kiyotaka Tsukada
IPC分类号： H05K1/18 , H05K3/10 , H05K3/46 , H05K1/02 , H05K3/00
CPC分类号： H05K3/341 , H05K1/0206 , H05K3/005 , H05K2201/09072 , H05K2201/091 , H05K2201/10106 , H05K2201/10416 , Y02P70/613
摘要： A substrate for mounting an electronic component includes a base material including insulating resin, a first conductor layer formed on first surface of the material, a second conductor layer formed on second surface of the material, and a metal block inserted into a hole penetrating through the first conductor, material and second conductor such that the metal block is fitted in the hole. The material has a bent portion in contact with the metal block in the hole such that the bent portion is bending toward the second conductor, the metal block has surface on first conductor side such that the surface has an outer peripheral portion having a curved-surface shape, and the hole has a first fitting inlet on the first conductor layer side and a second fitting inlet on second conductor side and that the metal block is positioned in contact with the second fitting inlet.
摘要翻译：用于安装电子部件的基板包括：基材，其包括绝缘树脂，形成在所述材料的第一表面上的第一导体层，形成在所述材料的第二表面上的第二导体层，以及插入穿透所述材料的孔中的金属块第一导体，材料和第二导体，使得金属块安装在孔中。所述材料具有与所述孔中的所述金属块接触的弯曲部分，使得所述弯曲部朝向所述第二导体弯曲，所述金属块在第一导体侧具有表面，使得所述表面具有具有弯曲表面的外周部分并且所述孔在所述第一导体层侧具有第一配件入口，在所述第二导体侧具有第二配件入口，并且所述金属块被定位成与所述第二配件入口接触。

4. 发明授权

US08833972B2 All in one snow crystal-shaped LED module 有权
标题翻译：所有在一个雪晶体LED模组
公开(公告)号：US08833972B2
公开(公告)日：2014-09-16
申请号：US13712914
申请日：2012-12-12
申请人： Seong Gon Baik
发明人： Seong Gon Baik
IPC分类号： F21S4/00 , F21K99/00 , H05K1/02 , F21V21/00 , F21W121/00 , F21Y101/02
CPC分类号： F21S4/00 , F21K9/90 , F21V21/00 , F21W2121/006 , F21Y2115/10 , H05K1/028 , H05K2201/052 , H05K2201/0909 , H05K2201/091 , H05K2201/10106
摘要： A straight middle LED module having a certain length and positioned at a middle portion; side LED modules which are provided at both sides of the middle LED module at a regular interval along a longitudinal direction; a middle connection portion at which the side LED modules and the middle LED module are connected and integrally formed in order for the side LED modules to be bent; and a horizontal connection portion to which a lower side of the middle LED module is connected at a regular interval along a horizontal direction, and the middle connection portion has grooves alternately formed at both sides and has a width narrower than the width of the side LED module.
摘要翻译：具有一定长度并位于中间部分的直的中间LED模块; 在所述中间LED模块的两侧设置有沿着长度方向的规定间隔的侧面LED模块; 侧面LED模块和中间LED模块连接并整体形成的中间连接部分，以使侧面LED模块弯曲; 以及水平连接部，中间LED模块的下侧沿水平方向以规定的间隔连接到中间连接部，并且中间连接部具有交替地形成在两侧的槽，并且宽度窄于侧面LED的宽度模块。

5. 发明授权

US08778124B2 Method for making three-dimensional liquid crystal polymer multilayer circuit boards 有权
标题翻译：制备三维液晶聚合物多层电路板的方法
公开(公告)号：US08778124B2
公开(公告)日：2014-07-15
申请号：US12016060
申请日：2008-01-17
申请人： Louis Joseph Rendek, Jr. , Lawrence Wayne Shacklette , Philip Anthony Marvin
发明人： Louis Joseph Rendek, Jr. , Lawrence Wayne Shacklette , Philip Anthony Marvin
IPC分类号： B32B37/00
CPC分类号： H05K3/0014 , H01H2219/01 , H05K1/0284 , H05K1/185 , H05K3/4611 , H05K2201/0141 , H05K2201/091 , H05K2203/1105 , H05K2203/302
摘要： A method is for making a non-planar three-dimensional (3D) multilayered circuit board. The method may include forming a stacked arrangement including at least one pair of liquid crystal polymer (LCP) layers with a bonding layer therebetween. The stacked arrangement may further include at least one electrically conductive pattern layer on at least one of the LCP layers. The method may further include heating and applying pressure to the stacked arrangement to shape the stacked arrangement into a non-planar 3D shape and concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement to thereby form the non-planar 3D multi-layered circuit board.
摘要翻译：一种制造非平面三维（3D）多层电路板的方法。该方法可以包括形成包括至少一对液晶聚合物（LCP）层的层叠布置，其间具有结合层。所述堆叠布置还可包括至少一个LCP层上的至少一个导电图案层。该方法还可以包括加热和施加压力到堆叠的布置以将堆叠布置形成非平面3D形状并且同时使结合层将堆叠布置的相邻LCP层结合在一起，从而形成非平面3D 多层电路板。

6. 发明授权

US08618828B2 Connection structure of electronic component and wired circuit board, wired circuit board assembly, and method for testing electronic component 有权
标题翻译：电子元件和有线电路板的连接结构，有线电路板组装，电子元器件测试方法
公开(公告)号：US08618828B2
公开(公告)日：2013-12-31
申请号：US12926441
申请日：2010-11-18
申请人： Tetsuya Ohsawa , Hitoki Kanagawa
发明人： Tetsuya Ohsawa , Hitoki Kanagawa
IPC分类号： G01R31/00
CPC分类号： H05K3/326 , G11B5/455 , G11B5/486 , H05K1/056 , H05K1/118 , H05K3/305 , H05K3/4092 , H05K2201/091
摘要： In a connection structure of an electronic component and a wired circuit board, the electronic component includes a plurality of external terminals. The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, and a conductive pattern formed on the insulating base layer. The conductive pattern includes a plurality of terminal portions for connection with the plurality of external terminals. The electronic component and the wired circuit board are disposed such that the plurality of external terminals and the plurality of terminal portions face each other. The wired circuit board is bent such that the conductive pattern is warped, and by the reaction force of the warping, the terminal portions and the external terminals are abutted, and the electronic component and the wired circuit board are electrically connected.
摘要翻译：在电子部件和布线电路基板的连接结构中，电子部件包括多个外部端子。布线电路板包括金属支撑板，形成在金属支撑板上的绝缘基底层和形成在绝缘基底层上的导电图案。导电图案包括用于与多个外部端子连接的多个端子部分。电子部件和布线电路基板被配置为使得多个外部端子和多个端子部彼此面对。弯曲布线电路板使得导电图案翘曲，并且通过翘曲的反作用力使端子部分和外部端子抵接，并且电子部件和布线电路板电连接。

7. 发明授权

US08562358B2 Patch panel assembly for use with data networks 有权
标题翻译：用于数据网络的配线架组件
公开(公告)号：US08562358B2
公开(公告)日：2013-10-22
申请号：US13123030
申请日：2009-10-07
申请人： Augusto P. Panella , Elliot A. Baines , Jeng-De Lin
发明人： Augusto P. Panella , Elliot A. Baines , Jeng-De Lin
IPC分类号： H01R29/00
CPC分类号： H04Q1/136 , H04L41/12 , H05K1/118 , H05K1/144 , H05K1/147 , H05K3/326 , H05K2201/0311 , H05K2201/042 , H05K2201/09063 , H05K2201/09072 , H05K2201/091 , H05K2201/09445 , H05K2201/10189
摘要： A patch panel (100) for use with infrastructure management systems that utilizes a plurality of cables interconnected to end-user devices and work area outlets, and integrated circuits to monitor the status of these end-user devices and outlets includes a pair of circuit boards. A plurality of connective jacks (31) are mounted on the first (36) of the two circuit boards, and are interconnected to other network devices. Wires from the jacks extend to and connect with network devices and the first circuit board has a plurality of first integrated circuits (45) mounted thereon which monitor the status of the network devices connected to the jacks. The second circuit board (49) is spaced apart from the first circuit board and it includes a plurality of second integrated circuits (52) that convey the status information obtained from the network work area outlets on the network to network devices, such as switches and scanners of the network (104).
摘要翻译：用于与利用与终端用户设备和工作区域出口相互连接的多条电缆的基础设施管理系统使用的接线板（100）以及用于监控这些终端用户设备和出口的状态的集成电路包括一对电路板。多个连接插座（31）安装在两个电路板的第一（36）上，并且互连到其他网络设备。插座的电线延伸到网络设备并与其连接，并且第一电路板具有安装在其上的多个第一集成电路（45），其监测连接到插座的网络设备的状态。第二电路板（49）与第一电路板间隔开，并且包括多个第二集成电路（52），其将从网络上的网络工作区域出口获得的状态信息传送到网络设备，诸如交换机和网络扫描仪（104）。

8. 发明授权

US08535623B2 Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interprolated cylinder 有权
标题翻译：凹形连接器基板，其制造方法，测量套件，传感器基板和传感器基板插入筒
公开(公告)号：US08535623B2
公开(公告)日：2013-09-17
申请号：US12762510
申请日：2010-04-19
申请人： Hidehiro Nakamura
发明人： Hidehiro Nakamura
IPC分类号： B01L99/00 , H01R13/15
CPC分类号： H05K13/00 , G01D1/00 , G01D15/00 , H05K1/028 , H05K1/118 , H05K3/3447 , H05K3/365 , H05K3/4602 , H05K3/4635 , H05K2201/09063 , H05K2201/09081 , H05K2201/091 , H05K2201/09109 , H05K2201/09127 , H05K2201/09163 , H05K2201/09318 , H05K2201/0969 , H05K2201/10151 , H05K2201/10189 , H05K2201/10598 , H05K2203/061 , H05K2203/167
摘要： A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and a cut portion; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region.
摘要翻译：一种制造凹形连接器基板的方法包括：准备具有将板状连接器引导到连接位置和切割部分的引导/保持区域的引导基板的步骤; 在导向基板的两个表面上布置和对准两个布线基板，每个布线基板具有布线和与布线电连接的通孔连接部分，并且将粘合剂施加到引导基板的预定区域以键合布线基板到引导基板; 将布线基板的一部分朝向引导基板的切断部的内侧弯曲并使配置在弯曲部的布线与切断部的内部压力接触的步骤; 以及去除切割部分内的部分以形成引导/保持区域的步骤。

9. 发明授权

US08522429B2 Method of manufacturing wiring board 有权
标题翻译：制造布线板的方法
公开(公告)号：US08522429B2
公开(公告)日：2013-09-03
申请号：US13187995
申请日：2011-07-21
申请人： Michimasa Takahashi , Masakazu Aoyama
发明人： Michimasa Takahashi , Masakazu Aoyama
IPC分类号： H01K3/10
CPC分类号： H05K3/4691 , H05K1/0366 , H05K3/0052 , H05K3/4602 , H05K3/4652 , H05K2201/0191 , H05K2201/0209 , H05K2201/091 , H05K2201/09563 , H05K2201/096 , H05K2201/09845 , H05K2203/1536
摘要： A method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.
摘要翻译：一种形成布线板的方法。布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的边缘，以及形成在第一衬底或第二衬底中的至少一个衬底中的至少一个通孔。夹在第一基板和第二基板之间的基底基板的一部分的厚度大于未被夹在第一基板和第二基板之间的基底部分的厚度。

10. 发明申请

US20120092867A1 METHOD FOR PRODUCING A CIRCUIT BOARD HAVING LEDS AND PRINTED REFLECTOR SURFACES, AND CIRCUIT BOARD PRODUCED ACCORDING TO THE METHOD 有权
标题翻译：用于制造具有LED和印刷反射镜表面的电路板的方法以及根据该方法生产的电路板
公开(公告)号：US20120092867A1
公开(公告)日：2012-04-19
申请号：US13266144
申请日：2010-04-24
申请人： Alexander Kasper
发明人： Alexander Kasper
IPC分类号： F21V7/00 , H01L33/60
CPC分类号： H05K1/02 , H01L33/60 , H01L2224/48091 , H01L2924/3025 , H05K2201/091 , H05K2201/09781 , H05K2201/09909 , H05K2201/10106 , H05K2201/2054 , H05K2203/013 , H05K2203/1476 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a circuit board having a light source for illumination purposes, having at least one LED electrically conductively connected to conductors of the circuit board, and the light thereof being converted into directed light by means of at least one mirror disposed on the circuit board, characterized in that the mirror is designed as a reflective coating printed onto the circuit board.
摘要翻译：本发明涉及一种具有用于照明目的的光源的电路板，具有至少一个LED导电连接到电路板的导体，并且其光被借助于设置在电路上的至少一个反射镜转换成定向光其特征在于，所述镜被设计为印刷到所述电路板上的反射涂层。

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