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1. 发明公开

US20240274314A1 JUMPER CHIP COMPONENT 审中-公开
公开(公告)号：US20240274314A1
公开(公告)日：2024-08-15
申请号：US18570010
申请日：2022-06-16
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： Shogo NAKAYAMA
IPC分类号： H01B5/14 , H05K1/18
CPC分类号： H01B5/14 , H05K1/181 , H05K2201/10363
摘要： A jumper chip component is designed to be mounted onto a printed board. The jumper chip component includes a base, a conductor, and an end face electrode. The base has electrical insulation properties. The conductor is disposed on a lower surface, facing the printed board, of the base to extend from a first end of the lower surface through a second end, facing the first end, of the lower surface. The end face electrode is disposed on at least a side surface of the base and arranged to be electrically connected to the conductor. The jumper chip component has one surface facing the printed board. The one surface is a flat surface.

2. 发明授权

US11949407B2 Solid state relay 有权
公开(公告)号：US11949407B2
公开(公告)日：2024-04-02
申请号：US18062429
申请日：2022-12-06
申请人： Zonit Structured Solutions, LLC
发明人： Steve Chapel , William Pachoud
IPC分类号： H03K17/13 , H03K17/687 , H05K1/02 , H05K3/30
CPC分类号： H03K17/133 , H03K17/687 , H05K1/0204 , H05K3/306 , H05K2201/042 , H05K2201/066 , H05K2201/10053 , H05K2201/10242 , H05K2201/10303 , H05K2201/10363 , H05K2201/2036 , Y10T29/4913
摘要： A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.

3. 发明授权

US09755341B2 Flexible printed circuit board connector 有权
公开(公告)号：US09755341B2
公开(公告)日：2017-09-05
申请号：US14736866
申请日：2015-06-11
申请人： Tyco Electronics Corporation
发明人： Kyle Gary Annis , Dustin Carson Belack
IPC分类号： H01R12/79 , H05K1/18 , H01R12/78 , H05K1/11 , H05K1/14 , H05K3/36
CPC分类号： H01R12/79 , H01R12/78 , H05K1/118 , H05K1/147 , H05K1/189 , H05K3/365 , H05K2201/10189 , H05K2201/10363
摘要： A flexible printed circuit board (FPCB) connector includes a housing having a first mating interface configured for mating with a first FPCB and a second mating interface configured for mating with a second FPCB. A plurality of jumper conductors are held by the housing. The jumper conductors have first mating ends at the first mating interface being configured for mating with the first FPCB and the jumper conductors having second mating ends at the second mating interface being configured for mating with the second FPCB. The first mating interface is configured to be mated to the first FPCB at any location along a length of the first FPCB including locations remote from an end of the first FPCB.

4. 发明申请

US20160249449A1 PRINTED BOARD AND IMAGE FORMING APPARATUS 审中-公开
公开(公告)号：US20160249449A1
公开(公告)日：2016-08-25
申请号：US15142197
申请日：2016-04-29
申请人： CANON KABUSHIKI KAISHA
发明人： Shinsuke Serizawa
IPC分类号： H05K1/02
CPC分类号： H05K1/0296 , G03G15/50 , G03G15/80 , G03G21/1652 , H05K1/0269 , H05K1/117 , H05K3/4015 , H05K3/403 , H05K2201/0394 , H05K2201/09063 , H05K2201/09181 , H05K2201/10287 , H05K2201/10363
摘要： The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.

5. 发明申请

US20160049741A1 COMPLIANT STAPLE PIN FOR CONNECTING MULTIPLE PRINTED CIRCUIT BOARDS 有权
标题翻译：用于连接多个打印的电路板的合适的针脚
公开(公告)号：US20160049741A1
公开(公告)日：2016-02-18
申请号：US14459481
申请日：2014-08-14
申请人： Continental Automotive Systems, Inc.
发明人： Jake P. Cassin , Thomas Brey
IPC分类号： H01R11/01 , H05K3/36
CPC分类号： H05K3/36 , H01R9/096 , H01R12/52 , H01R12/585 , H01R12/732 , H05K1/142 , H05K3/368 , H05K2201/10363
摘要： Circuit boards are mechanically connected to each other by a U-shaped pin, the legs of which are forcibly inserted into holes along edges of the circuit boards. The holes are conventional through-holes having metal linings that are electrically connected to circuit board traces that extend to components on the circuit boards. The U-shaped pin thus electrically connects components on the two circuit boards to each other.
摘要翻译：电路板通过U形销钉相互机械连接，U形销的腿部被强制插入电路板边缘的孔中。这些孔是具有金属衬里的常规通孔，其电连接到电路板迹线，电路板迹线延伸到电路板上的部件。因此，U形销将两个电路板上的部件彼此电连接。

6. 发明授权

US09039442B2 Solder-less electrical assembly 有权
标题翻译：无焊接电气组件
公开(公告)号：US09039442B2
公开(公告)日：2015-05-26
申请号：US13646489
申请日：2012-10-05
申请人： Carmen Rapisarda
发明人： Carmen Rapisarda
IPC分类号： H01R3/00 , H01R4/24 , H01R4/26
CPC分类号： F21V23/06 , F21Y2115/10 , H01M2/1044 , H01M2/20 , H01M2220/30 , H01R4/2404 , H01R4/26 , H01R12/592 , H01R12/79 , H01R13/41 , H01R13/506 , H01R13/665 , H01R25/003 , H05K1/184 , H05K3/325 , H05K5/0026 , H05K5/0091 , H05K2201/10037 , H05K2201/10106 , H05K2201/10363 , H05K2201/10393 , H05K2203/0173
摘要： A PCB assembly can be attached to hold one or more such assemblies. A resilient PCB housing holds a PCB by an interference fit while conductive wires are inserted into its wire cavity so that exposed portions of conductive wires make electrical contact with electrical traces of the PCB which is biased by wire insulation. Two conductors can be held by the PCB housing which are forced into electrical contact with the PCB when it is inserted into the resilient PCB housing which then biases such contacts. A switch can also be held by a switch interference fit with the resilient PCB housing such that its leads are biased against the PCB by the resilient PCB housing.
摘要翻译：可以连接PCB组件以保持一个或多个这样的组件。弹性PCB外壳通过过盈配合来保持PCB，同时将导线插入其导线腔中，使得导线的暴露部分与由电线绝缘偏压的PCB的电迹线电接触。两个导线可以被PCB外壳固定，当PCB插入到弹性PCB外壳中时，PCB外壳将被强制与PCB电接触，然后弹性PCB外壳偏压这些触点。也可以通过与弹性PCB外壳的过盈配合来保持开关，使得其引线被弹性PCB外壳偏置在PCB上。

7. 发明授权

US08860296B2 Illumination devices and methods for making the same 有权
标题翻译：照明装置及其制作方法
公开(公告)号：US08860296B2
公开(公告)日：2014-10-14
申请号：US13955455
申请日：2013-07-31
申请人： 3M Innovative Properties Company
发明人： Ellen O. Aeling , John R. David , Michael A. Meis , Ronald S. Steelman
IPC分类号： H01R33/00 , F21S4/00 , F21V21/002 , H01L33/60 , H05K1/11 , H05K1/18 , F21K99/00 , H05K3/22 , H05K1/02 , H05K3/46
CPC分类号： F21V19/0015 , F21K9/00 , F21K9/60 , F21K9/68 , F21K9/90 , F21V19/0025 , F21Y2115/10 , H01L33/60 , H05K1/0287 , H05K1/11 , H05K1/189 , H05K3/222 , H05K3/4611 , H05K2201/09681 , H05K2201/10106 , H05K2201/10363 , H05K2203/063 , Y10T156/10
摘要： The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.
摘要翻译：本公开一般涉及照明装置及其制造方法。该器件特别地包括第一导体层，第一绝缘体层，设置在第一导体层上并且具有通过第一绝缘体层限定在其中的至少一个第一孔;第二导体层，设置在第一绝缘体层上并具有通过所述第二导体层限定的至少一个第二孔，并且定位成与所述至少一个第一孔对准，以及光操纵层，其设置在所述第二导体层上并且具有通过所述光操纵层限定在其中的至少一对孔，包括第三孔和第四孔，其中所述第三孔被定位成与所述至少一个第二孔和第一孔对准。

8. 发明授权

US08783899B2 Light bar assembly 有权
标题翻译：灯条组装
公开(公告)号：US08783899B2
公开(公告)日：2014-07-22
申请号：US13688983
申请日：2012-11-29
申请人： Lextar Electronics Corporation
发明人： Ming-Hua Tsai , Chen-I Lu
IPC分类号： F21S4/00 , F21V21/00 , F21V31/00
CPC分类号： F21V21/00 , F21K9/00 , F21V23/06 , F21V31/00 , F21Y2103/10 , F21Y2113/00 , F21Y2115/10 , H05K1/117 , H05K1/142 , H05K3/3405 , H05K2201/09709 , H05K2201/10106 , H05K2201/10287 , H05K2201/10363 , Y10S362/80
摘要： A first substrate of a light bar assembly includes a first edge and a second edge parallel to each other along a first direction. A first connecting end includes a first connecting portion protruding further outward than a second connecting portion. A first bonding pad and a second bonding pad are disposed on the first substrate. First solid-state semiconductor light sources are disposed along the first edge and the second edge. A second substrate, disposed corresponding to the first substrate, includes a third edge, a fourth edge, a second connecting portion, a third bonding pad, a fourth bonding pad, and second solid-state semiconductor light sources. A first connecting device is electrically connected to the first bonding pad and the fourth bonding pad; a second connecting device is electrically connected to the second bonding pad and the third bonding pad to fix the first substrate and the second substrate.
摘要翻译：光棒组件的第一基板包括沿着第一方向彼此平行的第一边缘和第二边缘。第一连接端包括比第二连接部更向外突出的第一连接部。第一接合焊盘和第二接合焊盘设置在第一基板上。第一固态半导体光源沿着第一边缘和第二边缘设置。对应于第一基板设置的第二基板包括第三边缘，第四边缘，第二连接部分，第三焊盘，第四焊盘和第二固态半导体光源。第一连接装置电连接到第一焊盘和第四接合焊盘; 第二连接装置电连接到第二接合焊盘和第三接合焊盘以固定第一基板和第二基板。

9. 发明申请

US20140133119A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：接线板及其制造方法
公开(公告)号：US20140133119A1
公开(公告)日：2014-05-15
申请号：US14160766
申请日：2014-01-22
申请人： IBIDEN CO., LTD.
发明人： Takashi Kariya , Toshiki Furutani
IPC分类号： H05K1/02 , H05K3/00 , H05K3/46
CPC分类号： H05K1/0298 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L2224/16225 , H01L2224/1703 , H01L2924/15151 , H01L2924/15311 , H05K1/181 , H05K1/182 , H05K3/0047 , H05K3/4602 , H05K3/4623 , H05K3/4644 , H05K2201/10159 , H05K2201/10363 , H05K2201/10522 , H05K2201/1053 , H05K2201/10674 , Y02P70/611 , Y10T29/49155 , Y10T29/49165
摘要： A wiring board includes a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on a surface of the first substrate and including interlayer resin insulation layers and wiring layers, the built-up layer having an opening portion communicated with the penetrating hole of the fist substrate and opened to the outermost surface of the built-up layer, an interposer accommodated in the opening portion of the built-up layer and including a second substrate and a wiring layer formed on the second substrate, the wiring layer of the interposer including conductive circuits for being connected to semiconductor elements, a filler filling the opening portion such that the interposer is held in the opening portion of the built-up layer, and mounting pads formed on the first substrate and positioned to mount the semiconductor elements. The mounting pads are positioned to form a matrix on the first substrate.
摘要翻译：布线基板包括具有穿透第一基板的穿透孔的第一基板，形成在第一基板的表面上并且包括层间树脂绝缘层和布线层的积层，所述积层具有连通的开口部与第一基板的贯通孔相通并且向构成层的最外表面开放，插入到容纳在积层的开口部分的内插件，并且包括形成在第二基板上的第二基板和布线层，所述插入器的布线层包括用于连接到半导体元件的导电电路，填充所述开口部的填充物，使得所述插入件保持在所述积层的开口部中，以及安装焊盘，其形成在所述第一基板上并且被定位成安装半导体元件。定位安装垫以在第一基板上形成矩阵。

10. 发明授权

US08711575B2 Printed circuit board unit having routing unit mounted thereon and computer device having the same 有权
标题翻译：具有安装在其上的路由单元的印刷电路板单元和具有其的计算机设备
公开(公告)号：US08711575B2
公开(公告)日：2014-04-29
申请号：US13011980
申请日：2011-01-24
申请人： Do-kyun Lee
发明人： Do-kyun Lee
IPC分类号： H05K1/11
CPC分类号： H05K3/222 , H05K1/113 , H05K1/181 , H05K2201/09772 , H05K2201/10159 , H05K2201/10363 , H05K2201/10522 , H05K2201/10545
摘要： A printed circuit board unit usable with a computer device includes a main board on which a first component and a second component are mounted on an upper surface, and a routing unit mounted on at least one of the upper surface and a lower surface of the main board and including a sub-wire forming at least part of a wire to transmit a data between the first component and the second component.
摘要翻译：可与计算机装置一起使用的印刷电路板单元包括：主板，第一部件和第二部件安装在主板上;以及布线单元，安装在主板的上表面和下表面中的至少一个上并且包括形成至少一部分线的子线以在第一部件和第二部件之间传输数据。

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