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1. 发明授权

US09949376B2 Cortical implant system for brain stimulation and recording 有权
公开(公告)号：US09949376B2
公开(公告)日：2018-04-17
申请号：US14563778
申请日：2014-12-08
申请人： Second Sight Medical Products, Inc.
发明人： Robert J Greenberg , Neil H Talbot , James S Little
IPC分类号： A61N1/375 , A61N1/05 , A61N1/36 , A61N1/372 , H05K3/28 , H05K1/11 , H05K1/14 , A61B5/00 , A61B5/0478 , H05K1/18 , H01L23/055 , H05K1/02 , H05K1/03 , H05K1/09 , H05K3/00 , H05K3/32 , H05K3/36 , H05K3/40
CPC分类号： H05K3/282 , A61B5/0006 , A61B5/0478 , A61B5/4836 , A61B5/6868 , A61B2562/0209 , A61B2562/046 , A61B2562/125 , A61N1/0529 , A61N1/0531 , A61N1/0534 , A61N1/3606 , A61N1/36071 , A61N1/36082 , A61N1/36139 , A61N1/375 , A61N1/3752 , A61N1/3754 , H01L23/055 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H05K1/02 , H05K1/0271 , H05K1/028 , H05K1/0281 , H05K1/0306 , H05K1/092 , H05K1/11 , H05K1/111 , H05K1/145 , H05K1/147 , H05K1/189 , H05K3/0044 , H05K3/005 , H05K3/0058 , H05K3/28 , H05K3/321 , H05K3/363 , H05K3/4015 , H05K3/4061 , H05K2201/0245 , H05K2201/053 , H05K2201/055 , H05K2201/09063 , H05K2201/09145 , H05K2201/09163 , H05K2201/097 , H05K2201/09981 , H05K2201/10303 , H05K2201/10318 , H05K2201/10674 , H05K2201/10795 , H05K2201/10931 , H05K2201/2009 , H05K2203/0195 , H05K2203/025 , H05K2203/0278 , H05K2203/0307 , H05K2203/068 , H05K2203/082 , H05K2203/1322 , H05K2203/1327 , H05K2203/1394 , H05K2203/1461 , H05K2203/1476 , H05K2203/162 , H05K2203/304 , H01L2924/00014 , H01L2924/00
摘要： The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.

2. 发明申请

US20170202092A1 METHODS FOR CONNECTING A WIRE TO A FEEDTHROUGH PIN AND APPARATUS INCLUDING THE SAME 审中-公开
公开(公告)号：US20170202092A1
公开(公告)日：2017-07-13
申请号：US15326635
申请日：2014-08-12
申请人： Advanced Bionics AG
发明人： Lin Li , Jian Xie , Jeryle Walter
IPC分类号： H05K3/32 , A61N1/375 , A61N1/36 , H05K1/09 , H05K1/11
CPC分类号： H05K3/328 , A61N1/36036 , A61N1/3754 , H05K1/09 , H05K1/115 , H05K2201/09409 , H05K2201/09709 , H05K2201/1028 , H05K2201/10287 , H05K2201/10303 , H05K2201/10424 , H05K2201/10795 , H05K2201/10909 , H05K2201/10916 , H05K2203/0169 , H05K2203/0195 , Y10T29/49183
摘要： Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

3. 发明授权

US09125313B2 Solder and lead free electronic circuit and method of manufacturing same 有权
标题翻译：焊接和无铅电子电路及其制造方法
公开(公告)号：US09125313B2
公开(公告)日：2015-09-01
申请号：US14548805
申请日：2014-11-20
申请人： Carmen Rapisarda
发明人： Carmen Rapisarda
IPC分类号： H05K7/20 , H05K1/11 , H05K1/18 , H05K3/32 , H01R12/70 , H05K1/02 , H05K3/28
CPC分类号： H05K1/11 , H01R12/7076 , H05K1/0203 , H05K1/0271 , H05K1/0274 , H05K1/181 , H05K3/284 , H05K3/325 , H05K2201/035 , H05K2201/10106 , H05K2201/10166 , H05K2201/10393 , H05K2201/10454 , H05K2201/10598 , H05K2201/10757 , H05K2201/1078 , H05K2201/10787 , H05K2201/10795 , Y02P70/611
摘要： An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.
摘要翻译：电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部，并且每个这样的电子部件通过夹具保持在适当的位置，所述夹具与电子部件，以便将其导电触点保持与电路板的导电轨道电接触。夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

4. 发明申请

US20100236815A1 PLANAR CONTACT WITH SOLDER 有权
标题翻译：平面与焊接接触
公开(公告)号：US20100236815A1
公开(公告)日：2010-09-23
申请号：US12727146
申请日：2010-03-18
申请人： Jack Seidler
发明人： Jack Seidler
IPC分类号： H01B5/00 , H05K3/00
CPC分类号： H05K3/00 , B23K35/0244 , H01R12/57 , H01R12/707 , H01R43/0235 , H05K3/3426 , H05K3/3478 , H05K3/3489 , H05K2201/0311 , H05K2201/10704 , H05K2201/10795 , H05K2201/1084 , H05K2201/10924 , H05K2201/10984 , H05K2203/0405 , H05K2203/0415 , Y02P70/613 , Y10T29/49147
摘要： A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.
摘要翻译：将可回流元件固定在电触点上的方法。该方法包括提供具有多个电触点的条带，每个触点包括接触体和远离接触体延伸的尾部。然后将触头的尾部设置在细长的可回流构件附近。细长可回流构件被推到多个触点的尾部。随后，细长可回流构件被切割成多个单独的可回流元件，每个可回流元件对应于尾部中的一个。与附接到其上的可回流元件的电接触与条分离。

5. 发明授权

US07719174B2 Surface mounting discharge tube has soldering tapers formed at peripheral edges of electrode side surfaces that seal and project outwardly from opposite ends of cylindrical ceramic envelope 有权
标题翻译：表面安装放电管具有形成在电极侧表面的周边边缘处的焊接锥形，其从圆柱形陶瓷封套的相对端向外密封并向外突出
公开(公告)号：US07719174B2
公开(公告)日：2010-05-18
申请号：US11114190
申请日：2005-04-26
申请人： Kazuhiko Machida , Kesayuki Takeuchi , Chisato Emori
发明人： Kazuhiko Machida , Kesayuki Takeuchi , Chisato Emori
IPC分类号： H01J17/26
CPC分类号： H01T4/12 , H01T1/00 , H05K3/3426 , H05K2201/10795 , Y02P70/613
摘要： A surface mounting discharge tube, comprise of a cylindrical ceramic envelope sealed at its two ends by side surfaces of electrodes, designed to be directly soldered on to a mounting board, where the electrodes at the two ends are rectangular, project outward radially at the ends of the ceramic envelope and are provided at peripheral edges at the side surfaces of the electrodes with soldering use tapers or step differences, whereby positional deviation at the time of soldering is suppressed and sufficient PCT properties are secured.
摘要翻译：表面安装放电管包括圆柱形陶瓷外壳，其两端由电极的侧表面密封，设计成直接焊接到安装板上，其中两端的电极为矩形，在端部径向向外突出并且在电极的侧面的周边处设置有焊接使用锥度或阶差，由此抑制了焊接时的位置偏差并确保了足够的PCT性能。

6. 发明授权

US07630210B2 Lead(Pb)-free electronic component attachment 有权
标题翻译：无铅（Pb）电子元件附件
公开(公告)号：US07630210B2
公开(公告)日：2009-12-08
申请号：US11604710
申请日：2006-11-28
申请人： Mark W. Gailus , Leon M. Khilchenko
发明人： Mark W. Gailus , Leon M. Khilchenko
IPC分类号： H05K7/00
CPC分类号： H05K3/321 , H01L2924/0002 , H05K2201/10628 , H05K2201/10795 , H05K2201/10984 , H01L2924/00
摘要： A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb)-free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. To further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.
摘要翻译：用于电子部件的接触尾部，其可用于使用导电粘合剂附接部件，其可以是无铅（Pb）。接触尾部被冲压，提供相对低的制造成本和高精度。接触尾部具有每单位长度具有大的表面积的远端部分。远端部分将导电粘合剂形成接头，将粘合剂保持在邻近引线的位置，用于更牢固的接头。此外，远端部分在形成接头之前将粘合剂保持在接触尾部，便于使用粘合剂转移过程来分配粘合剂。为了进一步有助于粘合剂的转移，接触尾部可以形成有凹部，其增加粘附到接触尾部的粘合剂的体积。通过将增加但可控制的粘合剂量粘附到接触尾部，接触尾部的阵列可以简单且可靠地附接到印刷电路板和其它基底。

7. 发明申请

US20070205497A1 Lead(Pb)-free electronic component attachment 有权
标题翻译：无铅（Pb）电子元件附件
公开(公告)号：US20070205497A1
公开(公告)日：2007-09-06
申请号：US11604710
申请日：2006-11-28
申请人： Mark Gailus , Leon Khilchenko
发明人： Mark Gailus , Leon Khilchenko
IPC分类号： H01L23/48
CPC分类号： H05K3/321 , H01L2924/0002 , H05K2201/10628 , H05K2201/10795 , H05K2201/10984 , H01L2924/00
摘要： A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb)-free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. To further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.
摘要翻译：用于电子部件的接触尾部，其可用于使用导电粘合剂附接部件，其可以是无铅（Pb）。接触尾部被冲压，提供相对低的制造成本和高精度。接触尾部具有每单位长度具有大的表面积的远端部分。远端部分将导电粘合剂形成接头，将粘合剂保持在铅附近，以保持更牢固的接头。此外，远端部分在形成接头之前将粘合剂保持在接触尾部，便于使用粘合剂转移过程来分配粘合剂。为了进一步有助于粘合剂的转移，接触尾部可以形成有凹部，其增加粘附到接触尾部的粘合剂的体积。通过将增加但可控制的粘合剂量粘附到接触尾部，接触尾部的阵列可以简单且可靠地附接到印刷电路板和其它基底。

8. 发明授权

US06593523B2 Shield structure for electronic circuit parts 失效
标题翻译：电子电路部件的屏蔽结构
公开(公告)号：US06593523B2
公开(公告)日：2003-07-15
申请号：US09883946
申请日：2001-06-20
申请人： Masaaki Okada , Hitoshi Matsudaira
发明人： Masaaki Okada , Hitoshi Matsudaira
IPC分类号： H05K900
CPC分类号： H05K9/0028 , H05K3/341 , H05K2201/10371 , H05K2201/10787 , H05K2201/10795 , Y02P70/613 , Y10S174/35
摘要： The invention provides a shield structure that allows an easy installment of a shield case on a circuit board with more strength and firmness even if the shield case is warped or distorted. The proposed shield case includes a frame member consisting of four sidewalls and a cover member covering a farther end of the frame member from the circuit board. The frame member comprises a supporting member for sustaining the frame member on the circuit board and end faces confronting the circuit board. The supporting member comprises three projections protruding from the end face toward the circuit board.
摘要翻译：本发明提供了一种屏蔽结构，即使屏蔽壳体翘曲或变形，也能够在电路板上容易地安装屏蔽壳体，并具有更强的强度和坚固性。所提出的屏蔽壳包括由四个侧壁构成的框架构件和覆盖框架构件与电路板的更远端的盖构件。框架构件包括用于维持电路板上的框架构件的支撑构件和面对电路板的端面。支撑构件包括从端面朝向电路板突出的三个突起。

9. 发明申请

US20190191565A1 ELECTRONIC DEVICE AND MULTILAYER CERAMIC SUBSTRATE 审中-公开
公开(公告)号：US20190191565A1
公开(公告)日：2019-06-20
申请号：US16283858
申请日：2019-02-25
申请人： Murata Manufacturing Co., Ltd.
发明人： Takahiro Oka , Yuki Takemori , Kazuo Kishida , Hiromichi Kawakami , Yukio Yamamoto , Kensuke Otake
IPC分类号： H05K1/18 , H01L23/13 , H01L23/15 , H01L23/498 , H05K1/11 , H05K1/03 , H05K3/34
CPC分类号： H05K1/181 , H01L21/4857 , H01L21/486 , H01L21/4864 , H01L21/4867 , H01L23/13 , H01L23/15 , H01L23/49822 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L2224/13017 , H01L2224/13147 , H01L2224/1357 , H01L2224/1403 , H01L2224/16227 , H01L2224/16237 , H01L2924/014 , H05K1/0306 , H05K1/111 , H05K1/18 , H05K3/1216 , H05K3/26 , H05K3/34 , H05K3/3436 , H05K3/4007 , H05K3/4061 , H05K3/4644 , H05K2201/09472 , H05K2201/10795 , H05K2201/1081
摘要： An electronic device that includes an electronic component mounted on a multilayer ceramic substrate. The electronic component includes a connection terminal on the mounting surface side thereof, the connection terminal having an end with a rounded convex shape when viewed in cross section. The multilayer ceramic substrate includes a recessed portion at a position corresponding to the connection terminal, the recessed portion having a rounded concave shape when viewed in cross section, and a surface electrode disposed on at least part of the recessed portion and electrically connected to the connection terminal.

10. 发明申请

US20180188290A1 TEST SOCKET, TEST SOCKET MANUFACTURING METHOD, AND JIG ASSEMBLY FOR TEST SOCKET 审中-公开
公开(公告)号：US20180188290A1
公开(公告)日：2018-07-05
申请号：US15741213
申请日：2016-07-04
申请人： OKINS ELECTRONICS CO.,LTD
发明人： Sung Gye PARK , Jin Kook JUN
IPC分类号： G01R3/00 , G01R1/04 , G01R31/28 , H05K3/10 , H05K3/28 , H05K1/11 , H05K1/02 , H05K3/40
CPC分类号： G01R3/00 , G01R1/0433 , G01R31/2863 , G01R31/2896 , H05K1/0268 , H05K1/028 , H05K1/111 , H05K3/103 , H05K3/28 , H05K3/285 , H05K3/3484 , H05K3/4007 , H05K3/4015 , H05K2201/0154 , H05K2201/0162 , H05K2201/09827 , H05K2201/10234 , H05K2201/10265 , H05K2201/10287 , H05K2201/10757 , H05K2201/10795 , H05K2201/10856 , H05K2203/041 , H05K2203/1327 , H05K2203/166
摘要： A method of manufacturing a test socket includes preparing a printed circuit board (PCB) on which a bonding pad is disposed, bonding a conductive wire on the bonding pad, mounting, on an upper surface of the PCB, a space through which the bonding pad is exposed, mounting, on an upper surface of the space, a base through which the bonding pad is exposed, mounting, on an upper surface of the base, a jig which covers the bonding pad, and injecting a liquid silicone rubber into a jig assembly by using the jig assembly as a mold, the jig assembly including the PCB, the space, the base, and the jig.

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