专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US10037948B2 Invisible compartment shielding 有权
公开(公告)号：US10037948B2
公开(公告)日：2018-07-31
申请号：US15241665
申请日：2016-08-19
申请人： Apple Inc.
发明人： Phillip R. Sommer , Kishore N. Renjan , Manoj Vadeentavida
IPC分类号： H01L21/56 , H01L23/552 , H01L23/29
CPC分类号： H01L23/552 , H01L21/56 , H01L21/565 , H01L23/293 , H01L23/3121 , H01L25/0655 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K9/0024 , H05K9/0045
摘要： A method for shielding a compartment in a module of an electronic device includes molding the module using a mold material that activates when a laser is applied. The method also includes cutting a trench on the mold of the module around a certain portion of the module using the laser. The method further includes plating the trench using a certain metal. The method also includes filling the trench with a filler material. The method further includes encapsulating the module, the mold, the trench, and the filler material.

2. 发明授权

US09774179B1 Fused T-splice wiring 有权
公开(公告)号：US09774179B1
公开(公告)日：2017-09-26
申请号：US15473807
申请日：2017-03-30
申请人： FORD GLOBAL TECHNOLOGIES, LLC
发明人： Jason C. Marcath , Zubair Hassan , Hagop J. Parnoutsoukian
IPC分类号： H01H85/04 , H01R11/01 , H01R13/684 , H02G15/10 , H05K5/04 , H05K5/06 , H02G15/08 , H05K9/00 , H05K5/00 , H01R9/05 , H01H85/02
CPC分类号： H02G15/085 , H01H85/0241 , H01H85/04 , H01R9/0509 , H01R11/01 , H01R13/684 , H01R13/688 , H01R31/02 , H02G15/10 , H02G15/113 , H05K5/0004 , H05K5/04 , H05K5/06 , H05K9/0045
摘要： A power distributor including a first conductive coupling device electrically coupled to a bare-wire non-terminating section of a first conduit. A second conductive coupling device is electrically coupled to a terminating end of a second conduit. The first conduit is a larger gauge than the second conduit. A fuse electrically connects the first conductive coupling device and the second conductive coupling device. A housing encases the first and second conductive coupling devices and the fuse.

3. 发明申请

US20160037690A1 ELECTROMAGNETIC SHIELD BODY AND BOX 审中-公开
标题翻译：电磁屏蔽体和盒
公开(公告)号：US20160037690A1
公开(公告)日：2016-02-04
申请号：US14799906
申请日：2015-07-15
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： Fumio NOMIZO , Hideo SATAKE , Tetsuyoshi FUKAYA , Hirofumi INOSHITA
IPC分类号： H05K9/00
CPC分类号： H05K9/0049 , H05K9/0045 , H05K9/005
摘要： An electromagnetic shield body includes a metal plate and insulating resin combined with each other by insert molding. The metal plate is provided with a projection portion projecting into the insulating resin from the metal plate. The projection portion has a supporting side that dams up and holds the insulating resin introduced into a space defined by the projection portion.
摘要翻译：电磁屏蔽体包括金属板和通过嵌件成型彼此结合的绝缘树脂。金属板设置有从金属板突出到绝缘树脂中的突出部分。突出部具有支撑侧，该支撑侧阻挡并保持引入到由突出部限定的空间中的绝缘树脂。

4. 发明授权

US09229483B1 Radiation inhibiting personal electronics case 有权
标题翻译：防辐射个人电子产品
公开(公告)号：US09229483B1
公开(公告)日：2016-01-05
申请号：US14461084
申请日：2014-08-15
申请人： Shahriar Davaran
发明人： Shahriar Davaran
IPC分类号： H05K9/00 , G06F1/16
CPC分类号： G06F1/1656 , H05K9/0045
摘要： A personal electronics case that is operable to inhibit the transmission of radiation in the direction of a user. The personal electronics case includes four walls and a first bottom layer contiguously formed to define an interior volume. A cavity is adjacent and underneath the first bottom layer and is of similar size. Secured within the cavity is a radiation shield that is operable to inhibit the transmission of radiation. A second bottom layer is adjacent to the cavity opposite the first bottom layer. A keeper is mounted within a void in the body to facilitate the releasable securing of the radiation shield within the cavity.
摘要翻译：一种个人电子机箱，其可操作以禁止在用户的方向上的辐射传输。个人电子机箱包括四个壁和连续地形成以限定内部容积的第一底层。空腔相邻并位于第一底层下方并具有相似尺寸。在空腔内固定的是辐射屏蔽，其可操作以抑制辐射的传播。第二底层与第一底层相对的空腔相邻。保持器安装在主体内的空隙内，以便于将辐射屏蔽件可释放地固定在空腔内。

5. 发明授权

US09002288B1 Configurable shielded enclosure with signal transfer element 有权
标题翻译：具有信号传输元件的可配置屏蔽外壳
公开(公告)号：US09002288B1
公开(公告)日：2015-04-07
申请号：US13750976
申请日：2013-01-25
申请人： James Patrick Reible
发明人： James Patrick Reible
IPC分类号： H04B17/00 , H05K9/00 , A47B81/06 , G06K19/073
CPC分类号： A47B81/06 , G06K19/07318 , G06K19/07327 , H05K9/0009 , H05K9/0018 , H05K9/0045 , H05K9/0049 , H05K9/006 , H05K9/0084
摘要： An enclosure that has an interior space sized to receive a portable electronic device. The enclosure has a shielding layer that can shield and prevent communications between the interior space and the outside world in a first configuration. In a second configuration, communication is allowed. A signal transfer element is attached to the enclosure housing that can be moved between an isolation configuration and a communication configuration.
摘要翻译：具有尺寸适于接收便携式电子设备的内部空间的外壳。外壳具有能够在第一配置中屏蔽和防止内部空间与外界之间的通信的屏蔽层。在第二种配置中，允许通信。信号传递元件附接到可在隔离配置和通信配置之间移动的外壳外壳。

6. 发明申请

US20150085462A1 ELECTROMAGNETIC INTERFERENCE SHIELDING MATERIAL, ELECTROMAGNETIC INTERFERENCE SHIELDING DEVICE, METHOD FOR MAKING THE ELECTROMAGNETIC INTERFERENCE SHIELDING DEVICE, ELECTROMAGNETIC INTERFERENCE SHIELDING PACKAGE MODULE AND APPLIANCE 审中-公开
标题翻译：电磁干扰屏蔽材料，电磁干扰屏蔽装置，制造电磁干扰屏蔽装置的方法，电磁干涉屏蔽封装模块和电器
公开(公告)号：US20150085462A1
公开(公告)日：2015-03-26
申请号：US14037812
申请日：2013-09-26
申请人： Yoshinari MATSUDA
发明人： Shiho OKAMOTO
IPC分类号： H05K9/00
CPC分类号： H05K9/0083 , H01L23/28 , H01L23/3135 , H01L23/552 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/16227 , H01L2924/15311 , H01L2924/19105 , H05K1/0218 , H05K3/284 , H05K9/0045 , H05K2201/0715 , H01L2924/014 , H01L2924/00014
摘要： The present invention relates to an EMI shielding material that has a mixture that constitutes 70 wt % to 98 wt % of the EMI shielding material, wherein the mixture has: 1) a dendritic copper filler having copper dendritic crystals of lengths ranging from 0.1 μm to 50 μm, 2) a flaky copper filler having copper flakes of diameters ranging from 0.1 μm to 50 μm, 3) a resin binder, and 4) a diluent. The present invention also relates to an EMI shielding device made by applying the EMI shielding material on a surface of an electronic unit and by a following heating. The EMI shielding device has a volume resistivity of 10−5 to 10−3 acm. The invention also provides a method for making the EMI shielding device, a package module employing the foregoing EMI shielding device for shielding electromagnetic interference and an appliance employing the foregoing EMI shielding device.
摘要翻译：本发明涉及一种EMI屏蔽材料，其具有构成EMI屏蔽材料的70重量％至98重量％的混合物，其中该混合物具有：1）树枝状铜填料，其具有长度范围为0.1μm至 50μm，2）具有直径为0.1μm至50μm的铜薄片的片状铜填料，3）树脂粘合剂，和4）稀释剂。本发明还涉及通过将EMI屏蔽材料施加在电子单元的表面上并通过随后的加热而制成的EMI屏蔽装置。 EMI屏蔽装置的体积电阻率为10-5至10-3 acm。本发明还提供了制造EMI屏蔽装置的方法，采用前述EMI屏蔽装置的屏蔽电磁干扰的封装模块和采用上述EMI屏蔽装置的器具。

7. 发明申请

US20150043172A1 CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE 审中-公开
标题翻译：电路模块和电路模块的制造方法
公开(公告)号：US20150043172A1
公开(公告)日：2015-02-12
申请号：US14103601
申请日：2013-12-11
申请人： Taiyo Yuden Co., Ltd.
发明人： Eiji MUGIYA , Kenzo KITAZAKI , Masaya SHIMAMURA , Tetsuo SAJI , Hiroshi NAKAMURA
IPC分类号： H05K1/02 , H05K3/30
CPC分类号： H05K1/0218 , H01L2224/16225 , H01L2924/16152 , H01L2924/16153 , H01L2924/181 , H01L2924/19105 , H05K1/0215 , H05K1/0216 , H05K3/284 , H05K3/303 , H05K9/0024 , H05K9/0045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09145 , H05K2201/0919 , H05K2201/09972 , H05K2201/1056 , H05K2203/108 , Y10T29/4913 , H01L2924/00012
摘要： There is provided a circuit module and a method of producing the same where interlayer wirings of a circuit substrate are prevented from damaging by laser irradiation, and a shield is assuredly electrically connected to the superficial conductor of the circuit substrate. The circuit substrate includes mount components, a sealing body, and a shield. The circuit substrate is a multi-layer substrate on which interlayer wirings are formed, and includes a mount surface on which a superficial conductor is disposed. The mount components are mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench including a first trench section reaching the superficial conductor and a second trench section not reaching the superficial conductor. The shield has an outer shield section and an inner shield section.
摘要翻译：提供一种电路模块及其制造方法，可以防止电路基板的层间布线受到激光照射的损害，并且屏蔽层可靠地电连接到电路基板的表面导体。电路基板包括安装部件，密封体和屏蔽件。电路基板是形成有层间配线的多层基板，具有设置有表面导体的安装面。安装部件安装在安装表面上。密封体形成在安装表面上，覆盖安装部件，并且具有包括到达表面导体的第一沟槽部分和没有到达表面导体的第二沟槽部分的沟槽。屏蔽件具有外屏蔽部分和内屏蔽部分。

8. 发明授权

US08766857B2 Wireless communication terminal, shield case, and method of manufacturing case body 有权
标题翻译：无线通信终端，屏蔽箱，以及壳体的制造方法
公开(公告)号：US08766857B2
公开(公告)日：2014-07-01
申请号：US12088364
申请日：2006-09-27
申请人： Yasuhiro Abe
发明人： Yasuhiro Abe
IPC分类号： H01Q1/24
CPC分类号： H01Q1/243 , H04M1/0214 , H04M1/0277 , H05K9/003 , H05K9/0045
摘要： There are provided a first circuit substrate 22 on which an antenna 32 and electronic components are arranged, a case body 24 that is molded of a non-conductive material and that is attached to the first circuit substrate 22 so that the case body 24 overlaps the first circuit substrate 22 in the thickness direction of the first circuit substrate 22, and a housing 8 including the first circuit substrate 22 and the case body 24 in the housing 8. The case body 24 comprises a conductive layer formed on the surface of the case body 24, except for an antenna opposing area S where the case body 24 overlaps the antenna 32 in the thickness direction of the first circuit substrate 22.
摘要翻译：设置有天线32和电子部件布置在其上的第一电路基板22，由非导电材料模制并且附接到第一电路基板22的壳体24，使得壳体24与第一电路基板22的厚度方向上的第一电路基板22以及在壳体8中包括第一电路基板22和壳体24的壳体8.壳体24包括形成在壳体的表面上的导电层主体24除了壳体24在第一电路基板22的厚度方向上与天线32重叠的天线相对区域S之外。

9. 发明申请

US20120162930A1 MODULE IC PACKAGE STRUCTURE WITH ELECTRICAL SHIELD FUNCTION AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：具有电屏蔽功能的模块IC封装结构及其制造方法
公开(公告)号：US20120162930A1
公开(公告)日：2012-06-28
申请号：US12977796
申请日：2010-12-23
申请人： CHUNG-ER HUANG , YUEH-CHENG LEE
发明人： CHUNG-ER HUANG , YUEH-CHENG LEE
IPC分类号： H05K7/00 , H05K3/30
CPC分类号： H05K9/0045 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2924/14 , H01L2924/19105 , H05K1/0218 , H05K3/284 , H05K2201/10371 , Y10T29/49146 , H01L2924/00
摘要： A module IC package structure with electrical shield function includes a substrate unit, an electronic unit, a conductive unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate having at least one grounding pad. The electronic unit includes a plurality of electronic elements electrically connected to the circuit substrate. The conductive unit includes at least one conductive element disposed on the circuit substrate, and the conductive element has a first end portion electrically connected to the grounding pad. The package unit includes a package resin body disposed on the circuit substrate to cover the electronic elements and one part of the conductive element, and the conductive element has a second end portion is exposed from the package resin body. The shielding unit includes a metal shielding layer formed on the outer surface of the package resin body to electrically contact the second end portion.
摘要翻译：具有电屏蔽功能的模块IC封装结构包括基板单元，电子单元，导电单元，封装单元和屏蔽单元。基板单元包括具有至少一个接地垫的电路基板。电子单元包括电连接到电路基板的多个电子元件。导电单元包括设置在电路基板上的至少一个导电元件，并且导电元件具有电连接到接地垫的第一端部。封装单元包括设置在电路基板上以覆盖电子元件和导电元件的一部分的封装树脂体，并且具有第二端部的导电元件从封装树脂体露出。屏蔽单元包括形成在封装树脂体的外表面上以电接触第二端部的金属屏蔽层。

10. 发明申请

US20120100414A1 ENCAPSULATED EMI/RFI SHIELDING FOR A NON-CONDUCTIVE THERMOSETTING PLASTIC COMPOSITE PHEV BATTERY COVER 审中-公开
标题翻译：用于非导电热塑复合材料PHEV电池盖的防护EMI / RFI屏蔽
公开(公告)号：US20120100414A1
公开(公告)日：2012-04-26
申请号：US12910174
申请日：2010-10-22
申请人： Kestutis A. Sonta
发明人： Kestutis A. Sonta
IPC分类号： H01M2/02
CPC分类号： H01M2/1072 , B60K2001/0411 , B60K2001/0416 , H01M2/1094 , H01M2220/20 , H05K9/0045 , Y02T90/14
摘要： A cover for a high voltage vehicle battery is disclosed that is made of a light weight, non-conductive thermoset plastic composite, such as a polyester resin matrix, and includes an EMI/RFI shield. In one embodiment, the EMI/RFI shield is a Faraday cage including a ferrous mesh that is molded into the thermoset plastic composite so that it is completely encapsulated therein. In another embodiment, the EMI/RFI shield is an acrylic polymer coating including nickel plated copper flakes formed on an outside surface of the thermoset plastic composite.
摘要翻译：公开了一种用于高压车辆电池的盖，其由诸如聚酯树脂基体的重量轻的非导电性热固性塑料复合材料制成，并且包括EMI / RFI屏蔽。在一个实施例中，EMI / RFI屏蔽是法拉第笼，其包括被模制到热固性塑料复合材料中以使其完全封装在其中的铁网。在另一个实施例中，EMI / RFI屏蔽是丙烯酸聚合物涂层，包括形成在热固性塑料复合材料的外表面上的镀镍铜片。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式