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1. 发明授权

US08944738B2 Stacked process modules for a semiconductor handling system 有权
标题翻译：用于半导体处理系统的堆叠过程模块
公开(公告)号：US08944738B2
公开(公告)日：2015-02-03
申请号：US13248600
申请日：2011-09-29
申请人： Peter van der Meulen
发明人： Peter van der Meulen
IPC分类号： H01L21/677 , H01L21/67 , B25J9/04 , H01L21/68 , H01L21/687
CPC分类号： H01L21/67167 , B25J9/042 , H01L21/67126 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67201 , H01L21/67207 , H01L21/67253 , H01L21/67259 , H01L21/67706 , H01L21/67727 , H01L21/67733 , H01L21/67736 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/67757 , H01L21/67781 , H01L21/68 , H01L21/68707 , H01L21/68735 , Y10S414/135 , Y10S414/137 , Y10S414/139 , Y10T74/20305
摘要： Methods and systems are provided for a vacuum-based semiconductor handling system. The system may be a linear system with a four-link robotic SCARA arm for moving materials in the system. The system may include one or more vertically stacked load locks or vertically stacked process modules.
摘要翻译：为基于真空的半导体处理系统提供了方法和系统。该系统可以是具有用于在系统中移动材料的四链接机器人SCARA臂的线性系统。该系统可以包括一个或多个垂直堆叠的加载锁或垂直堆叠的过程模块。

2. 发明授权

US08870514B2 Semiconductor manufacturing process module 有权
标题翻译：半导体制造工艺模块
公开(公告)号：US08870514B2
公开(公告)日：2014-10-28
申请号：US13616683
申请日：2012-09-14
申请人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese
发明人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese
IPC分类号： H01L21/677 , H01L21/67 , B65G25/02 , H01L21/687 , B65G37/00
CPC分类号： H01L21/67703 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67772 , H01L21/68792 , Y10S414/139
摘要： A semiconductor handling system including a vacuum workpiece handling system having a vacuum environment therein, the vacuum workpiece handling system including at least two workpiece handling robotic facilities, a mid-entry station positioned between the at least two workpiece handling robotic facilities, the mid-entry station including vertically stacked load locks, where the at least two workpiece handling robotic facilities are configured to transfer workpieces between the vertically stacked load locks, at least one workpiece loading station connected to the vacuum handling system, and a workpiece delivery system having an internal environment different from the vacuum environment, the workpiece delivery system being configured to transport the workpieces between each of the vertically stacked load locks of the mid-entry station and the at least one workpiece loading station.
摘要翻译：一种半导体处理系统，包括其中具有真空环境的真空工件处理系统，所述真空工件处理系统包括至少两个工件处理机器人设施，位于所述至少两个工件处理机器人设施之间的中间入口站，其包括垂直堆叠的装载锁，其中至少两个工件处理机器人设施构造成在垂直堆叠的负载锁之间传送工件，连接到真空处理系统的至少一个工件装载站以及具有内部环境的工件传送系统与真空环境不同的是，工件传送系统被配置为在中间入口站的每个垂直堆叠的负载锁和至少一个工件装载站之间输送工件。

3. 发明授权

US08812150B2 Semiconductor manufacturing process modules 有权
标题翻译：半导体制造工艺模块
公开(公告)号：US08812150B2
公开(公告)日：2014-08-19
申请号：US11876869
申请日：2007-10-23
申请人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese
发明人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese
IPC分类号： G06F7/00
CPC分类号： H01L21/67184 , H01L21/67161 , H01L21/6719
摘要： A method is provided. The method includes disposing a plurality of robotic facilities to form a semiconductor handling system, controlling the semiconductor handling system with a controller to handoff a workpiece between neighboring robotic facilities, and providing a software interface for the controller, wherein the software interface permits a user to view alternate configurations of the handling system in order to optimize a characteristic of the handling system.
摘要翻译：提供了一种方法。该方法包括设置多个机器人设备以形成半导体处理系统，通过控制器控制半导体处理系统以在相邻机器人设备之间切换工件，并为控制器提供软件接口，其中软件接口允许用户查看处理系统的备用配置，以优化处理系统的特性。

4. 发明授权

US08634633B2 Wafer center finding with kalman filter 有权
标题翻译：晶圆中心发现与卡尔曼滤波器
公开(公告)号：US08634633B2
公开(公告)日：2014-01-21
申请号：US13617333
申请日：2012-09-14
申请人： Christopher C Kiley , Peter van der Meulen , Forrest T Buzan , Paul E. Fogel
发明人： Christopher C Kiley , Peter van der Meulen , Forrest T Buzan , Paul E. Fogel
IPC分类号： G06K9/00
CPC分类号： H01L21/681 , B65G25/02 , B65G37/00 , G05B19/02 , H01L21/67259 , H01L21/67742 , H01L21/67748 , H01L21/68 , Y10S901/09 , Y10S901/47
摘要： A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
摘要翻译：提供一种具有用于处理晶片的机器人手臂的装置，所述机器人臂包括一个或多个编码器，所述编码器提供识别所述机器人臂的一个或多个部件的位置的编码器数据。该装置还具有适于将扩展卡尔曼滤波器应用于编码器数据以估计晶片的位置的处理器。

5. 发明授权

US08523507B2 Semiconductor manufacturing systems 有权
标题翻译：半导体制造系统
公开(公告)号：US08523507B2
公开(公告)日：2013-09-03
申请号：US13248386
申请日：2011-09-29
申请人： Peter van der Meulen
发明人： Peter van der Meulen
IPC分类号： B65G49/07
CPC分类号： H01L21/67742 , H01L21/67167 , H01L21/67173 , H01L21/67184 , Y10S414/139
摘要： Linear semiconductor handling systems provide more balanced processing capacity using various techniques to provide increased processing capacity to relatively slow processes. This may include use of hexagonal vacuum chambers to provide additional facets for slow process modules, use of circulating process modules to provide more processing capacity at a single facet of a vacuum chamber, or the use of wide process modules having multiple processing sites. This approach may be used, for example, to balance processing capacity in a typical process that includes plasma enhanced chemical vapor deposition steps and bevel etch steps.
摘要翻译：线性半导体处理系统使用各种技术提供更平衡的处理能力，以提供相对较慢工艺的增加的处理能力。这可能包括使用六边形真空室来为慢速过程模块提供附加面，使用循环过程模块在真空室的单个面提供更多的处理能力，或使用具有多个处理位置的宽工艺模块。该方法可以用于例如在包括等离子体增强化学气相沉积步骤和斜面蚀刻步骤的典型工艺中平衡处理能力。

6. 发明申请

US20130085595A1 WAFER CENTER FINDING WITH KALMAN FILTER 有权
标题翻译：用KALMAN过滤器找到WAFER CENTER
公开(公告)号：US20130085595A1
公开(公告)日：2013-04-04
申请号：US13617333
申请日：2012-09-14
申请人： Christopher C. Kiley , Peter van der Meulen , Forrest T. Buzan , Paul E. Fogel
发明人： Christopher C. Kiley , Peter van der Meulen , Forrest T. Buzan , Paul E. Fogel
IPC分类号： H01L21/68 , G05B19/02
CPC分类号： H01L21/681 , B65G25/02 , B65G37/00 , G05B19/02 , H01L21/67259 , H01L21/67742 , H01L21/67748 , H01L21/68 , Y10S901/09 , Y10S901/47
摘要： A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
摘要翻译：提供一种具有用于处理晶片的机器人手臂的装置，所述机器人臂包括一个或多个编码器，所述编码器提供识别所述机器人臂的一个或多个部件的位置的编码器数据。该装置还具有适于将扩展卡尔曼滤波器应用于编码器数据以估计晶片的位置的处理器。

7. 发明授权

US08313277B2 Semiconductor manufacturing process modules 有权
标题翻译：半导体制造工艺模块
公开(公告)号：US08313277B2
公开(公告)日：2012-11-20
申请号：US11876915
申请日：2007-10-23
申请人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese
发明人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese
IPC分类号： B65G49/07
CPC分类号： H01L21/67703 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67772 , H01L21/68792 , Y10S414/139
摘要： A variety of process modules are described for use in semiconductor manufacturing processes.
摘要翻译：描述了用于半导体制造工艺的各种工艺模块。

8. 发明申请

US20120154822A1 WAFER CENTER FINDING WITH CHARGE-COUPLED DEVICES 有权
标题翻译：使用充电耦合设备的WAFER CENTER发现
公开(公告)号：US20120154822A1
公开(公告)日：2012-06-21
申请号：US13406252
申请日：2012-02-27
申请人： Christopher C. Kiley , Peter van der Meulen , Forrest T. Buzan , Paul E. Fogel
发明人： Christopher C. Kiley , Peter van der Meulen , Forrest T. Buzan , Paul E. Fogel
IPC分类号： G01B11/14
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substantially circular wafer, at a predetermined location within the interior, wherein the plurality of sensors are arranged so that at least two of the plurality of sensors detect the wafer for any position of the wafer entirely within the interior, wherein a first one of the two sensors is positioned to detect the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances, and a second one of the two sensors is positioned immediately outside a diameter of the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances.
摘要翻译：提供了一种用于处理基本圆形晶片的装置。该装置包括可通过多个入口访问的内部，以及由多个入口中的每一个入口的两个传感器组成的多个传感器，每个传感器能够在内部的预定位置处检测基本圆形的晶片的存在，其中所述多个传感器被布置成使得所述多个传感器中的至少两个传感器在所述内部中完全检测所述晶片的任何位置的晶片，其中所述两个传感器中的第一传感器定位成当所述晶片具有通过多个入口中的一个完全通过内部，并且当晶片已经通过多个入口之一完全通过内部时，两个传感器中的第二个位于晶片直径的正上方。

9. 发明申请

US20120148374A1 LINEAR SEMICONDUCTOR PROCESSING FACILITIES 有权
标题翻译：线性半导体加工设备
公开(公告)号：US20120148374A1
公开(公告)日：2012-06-14
申请号：US13158883
申请日：2011-06-13
申请人： Peter van der Meulen
发明人： Peter van der Meulen
IPC分类号： H01L21/677
CPC分类号： H01L21/67167 , B25J9/042 , H01L21/67126 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67201 , H01L21/67207 , H01L21/67253 , H01L21/67259 , H01L21/67706 , H01L21/67727 , H01L21/67733 , H01L21/67736 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/67757 , H01L21/67781 , H01L21/68 , H01L21/68707 , H01L21/68735 , Y10S414/135 , Y10S414/137 , Y10S414/139 , Y10T74/20305
摘要： Methods and systems are provided for handling materials, including materials used in semiconductor manufacturing systems. The methods and systems include linear semiconductor processing facilities for vacuum-based semiconductor processing and handling, as well as linkable or extensible semiconductor processing facilities that can be flexibly configured to meet a variety of constraints.
摘要翻译：提供了用于处理材料的方法和系统，包括在半导体制造系统中使用的材料。该方法和系统包括用于基于真空的半导体处理和处理的线性半导体处理设备，以及可以灵活地配置以满足各种限制的可连接或可扩展的半导体处理设备。

10. 发明申请

US20120014769A1 STACKED PROCESS MODULES FOR A SEMICONDUCTOR HANDLING SYSTEM 有权
标题翻译：用于半导体处理系统的堆叠处理模块
公开(公告)号：US20120014769A1
公开(公告)日：2012-01-19
申请号：US13248600
申请日：2011-09-29
申请人： Peter van der Meulen
发明人： Peter van der Meulen
IPC分类号： H01L21/677
CPC分类号： H01L21/67167 , B25J9/042 , H01L21/67126 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67201 , H01L21/67207 , H01L21/67253 , H01L21/67259 , H01L21/67706 , H01L21/67727 , H01L21/67733 , H01L21/67736 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/67757 , H01L21/67781 , H01L21/68 , H01L21/68707 , H01L21/68735 , Y10S414/135 , Y10S414/137 , Y10S414/139 , Y10T74/20305
摘要： Methods and systems are provided for a vacuum-based semiconductor handling system. The system may be a linear system with a four-link robotic SCARA arm for moving materials in the system. The system may include one or more vertically stacked load locks or vertically stacked process modules.
摘要翻译：为基于真空的半导体处理系统提供了方法和系统。该系统可以是具有用于在系统中移动材料的四链接机器人SCARA臂的线性系统。该系统可以包括一个或多个垂直堆叠的加载锁或垂直堆叠的过程模块。

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