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    • 1. 发明授权
    • Hydrophobic silane coating for preventing conductive anodic filament (CAF) growth in printed circuit boards
    • 用于防止印刷电路板中导电阳极丝(CAF)生长的疏水性硅烷涂层
    • US09351405B2
    • 2016-05-24
    • US13784514
    • 2013-03-04
    • INTERNATIONAL BUSINESS MACHINES CORPORATION
    • Dylan J. BodayJoseph Kuczynski
    • H05K3/00D06M11/79D06M13/513D06M13/517
    • H05K3/00D06M11/79D06M13/513D06M13/517Y10T428/31612Y10T442/218
    • An enhanced substrate for making a printed circuit board (PCB) includes a hydrophobic silane coating of a silane composition intermixed with a silane coupling agent applied to a glass fiber substrate. The silane coupling agent is applied to the surface of the substrate for coupling the substrate to a varnish coating. Applying the silane coupling agent to the surface of the substrate creates surface silanols, which are implicated in conductive anodic filament (CAF) growth. A silane composition, which reacts with the surface silanols, is applied to the surface of the substrate having the silane coupling agent applied thereto to form the hydrophobic silane coating. The surface presented by the hydrophobic silane coating/substrate is hydrophobic and essentially silanol-free. This surface is then dried, and varnish is applied thereto. Then, the substrate, hydrophobic silane coating and varnish are subjected to curing conditions to define the PCB.
    • 用于制造印刷电路板(PCB)的增强基板包括与施加到玻璃纤维基板的硅烷偶联剂混合的硅烷组合物的疏水性硅烷涂层。 将硅烷偶联剂施加到基底的表面以将基底连接到清漆涂层。 将硅烷偶联剂施加到基材的表面产生表面硅烷醇,其涉及导电阳极丝(CAF)生长。 将与表面硅烷醇反应的硅烷组合物施加到施加有硅烷偶联剂的基材的表面上以形成疏水性硅烷涂层。 由疏水性硅烷涂层/底物呈现的表面是疏水性的并且基本上不含硅烷醇。 然后将该表面干燥,并向其施加清漆。 然后,对基板,疏水性硅烷涂层和清漆进行固化条件以限定PCB。
    • 2. 发明申请
    • Hydrophobic Silane Coating for Preventing Conductive Anodic Filament (CAF) Growth in Printed Circuit Boards
    • 用于防止印刷电路板中导电阳极丝(CAF)生长的疏水硅烷涂层
    • US20130280417A1
    • 2013-10-24
    • US13784514
    • 2013-03-04
    • INTERNATIONAL BUSINESS MACHINES CORPORATION
    • Dylan J. BodayJoseph Kuczynski
    • H05K3/00
    • H05K3/00D06M11/79D06M13/513D06M13/517Y10T428/31612Y10T442/218
    • An enhanced substrate for making a printed circuit board (PCB) includes a hydrophobic silane coating of a silane composition intermixed with a silane coupling agent applied to a glass fiber substrate. The silane coupling agent is applied to the surface of the substrate for coupling the substrate to a varnish coating. Applying the silane coupling agent to the surface of the substrate creates surface silanols, which are implicated in conductive anodic filament (CAF) growth. A silane composition, which reacts with the surface silanols, is applied to the surface of the substrate having the silane coupling agent applied thereto to form the hydrophobic silane coating. The surface presented by the hydrophobic silane coating/substrate is hydrophobic and essentially silanol-free. This surface is then dried, and varnish is applied thereto. Then, the substrate, hydrophobic silane coating and varnish are subjected to curing conditions to define the PCB.
    • 用于制造印刷电路板(PCB)的增强基板包括与施加到玻璃纤维基板的硅烷偶联剂混合的硅烷组合物的疏水性硅烷涂层。 将硅烷偶联剂施加到基底的表面以将基底连接到清漆涂层。 将硅烷偶联剂施加到基材的表面产生表面硅烷醇,其涉及导电阳极丝(CAF)生长。 将与表面硅烷醇反应的硅烷组合物施加到施加有硅烷偶联剂的基材的表面上以形成疏水性硅烷涂层。 由疏水性硅烷涂层/底物呈现的表面是疏水性的并且基本上不含硅烷醇。 然后将该表面干燥,并向其施加清漆。 然后,对基板,疏水性硅烷涂层和清漆进行固化条件以限定PCB。
    • 5. 发明申请
    • Hydrophobic Silane Coating for Preventing Conductive Anodic Filament (CAF) Growth in Printed Circuit Boards
    • 用于防止印刷电路板中导电阳极丝(CAF)生长的疏水硅烷涂层
    • US20110214909A1
    • 2011-09-08
    • US12718213
    • 2010-03-05
    • Dylan Joseph BodayJoseph Kuczynski
    • Dylan Joseph BodayJoseph Kuczynski
    • H05K1/00B32B17/02B32B17/06H05K3/46H05K3/38H05K3/22
    • H05K3/00D06M11/79D06M13/513D06M13/517Y10T428/31612Y10T442/218
    • An enhanced substrate for making a printed circuit board (PCB) includes a hydrophobic silane coating of a silane composition intermixed with a silane coupling agent applied to a glass fiber substrate. The silane coupling agent is applied to the surface of the substrate for coupling the substrate to a varnish coating. Applying the silane coupling agent to the surface of the substrate creates surface silanols, which are implicated in conductive anodic filament (CAF) growth. A silane composition, which reacts with the surface silanols, is applied to the surface of the substrate having the silane coupling agent applied thereto to form the hydrophobic silane coating. The surface presented by the hydrophobic silane coating/substrate is hydrophobic and essentially silanol-free. This surface is then dried, and varnish is applied thereto. Then, the substrate, hydrophobic silane coating and varnish are subjected to curing conditions to define the PCB.
    • 用于制造印刷电路板(PCB)的增强基板包括与施加到玻璃纤维基板的硅烷偶联剂混合的硅烷组合物的疏水性硅烷涂层。 将硅烷偶联剂施加到基底的表面以将基底连接到清漆涂层。 将硅烷偶联剂施加到基材的表面产生表面硅烷醇,其涉及导电阳极丝(CAF)生长。 将与表面硅烷醇反应的硅烷组合物施加到施加有硅烷偶联剂的基材的表面上以形成疏水性硅烷涂层。 由疏水性硅烷涂层/底物呈现的表面是疏水性的并且基本上不含硅烷醇。 然后将该表面干燥,并向其施加清漆。 然后,对基板,疏水性硅烷涂层和清漆进行固化条件以限定PCB。
    • 7. 发明授权
    • Thermal foot cover
    • US06973742B2
    • 2005-12-13
    • US09768969
    • 2001-01-24
    • Dave W. Gordon
    • Dave W. Gordon
    • A43B1/00A43B3/16A43B7/02
    • A43D999/00A43B1/00A43B3/163A43B7/02Y10S428/92Y10T442/116Y10T442/121Y10T442/126Y10T442/184Y10T442/218Y10T442/2189Y10T442/2213Y10T442/674
    • The thermal foot cover is an article of footwear to be worn when the wearer's foot is subjected to cold temperatures. The thermal foot cover has an upper cover portion attached to a bottom panel to define a cavity for insertion of a wearer's shoe-encased or boot-encased foot or a wearer's foot. The upper cover portion and the bottom panel are made from a material comprising an outer covering, a radiant barrier and a inner covering where the radiant barrier is sandwiched between the outer cover and the inner cover. The radiant barrier is the insulation system of the thermal foot cover, which reflects the wearer's body heat back inside the footwear and keeps the wearer's feet warm. The thermal foot cover is flexible, lightweight and readily washable due to the use of the radiant barrier as the insulation system. The addition of a cavity enlargement means and a means for fastening the cavity enlargement means can be used to facilitate the insertion of the wearer's shoe-encased or boot-encased foot or the wearer's foot into the thermal foot cover and facilitate securing of the thermal foot cover to the wearer's shoe-encased or boot-encased foot or the wearer's foot and ankle to prevent loss of body heat when the thermal foot cover is being worn. A coating may be added to bottom of the thermal foot cover to provide a non-skid surface for walking. A flexible sole may also be provided for increased durability.