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1. 发明申请

US20230019554A1 METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND COATING SYSTEM FOR IMPLEMENTING THE METHOD 有权
公开(公告)号：US20230019554A1
公开(公告)日：2023-01-19
申请号：US17811707
申请日：2022-07-11
申请人： IBIDEN CO., LTD.
发明人： Yuji KADOWAKI , Tomomi KANO
IPC分类号： H05K3/02 , H05K3/00 , C25D5/02 , C25D5/22 , C25D5/54 , C25D7/00
摘要： A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying liquid resist on the seed layer formed on the surface of the resin insulating layer, drying the liquid resist applied on the seed layer such that a resist layer is formed on the seed layer, applying pressure and heat simultaneously to an entire surface of the resist layer formed on the seed layer, forming a plating resist on the seed layer from the resist layer formed on the seed layer using a photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the plating resist, removing the plating resist from the seed layer, and removing part of the seed layer exposed from the electrolytic plating film.

2. 发明申请

US20220084840A1 ELECTROCHEMICAL ADDITIVE MANUFACTURING METHOD USING DEPOSITION FEEDBACK CONTROL 有权
公开(公告)号：US20220084840A1
公开(公告)日：2022-03-17
申请号：US17535437
申请日：2021-11-24
申请人： FABRIC8LABS, INC.
发明人： David Pain , Andrew Edmonds , Jeffrey Herman , Charles Pateros , Kareemullah Shaik
IPC分类号： H01L21/48 , C25D1/00 , C25D5/10 , C25D5/22
摘要： A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 μm or more, diameters of 10 μm or below, and inter-pillar spacing below 20 μm. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.

3. 发明授权

US11232956B2 Electrochemical additive manufacturing of interconnection features 有权
公开(公告)号：US11232956B2
公开(公告)日：2022-01-25
申请号：US17112909
申请日：2020-12-04
申请人： FABRIC8LABS, INC.
发明人： David Pain , Andrew Edmonds , Jeffrey Herman , Charles Pateros , Kareemullah Shaik
IPC分类号： H01L21/48 , C25D1/00 , C25D5/10 , C25D5/22 , B33Y50/02 , B33Y80/00 , B33Y10/00 , B33Y30/00
摘要： A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 μm or more, diameters of 10 μm or below, and inter-pillar spacing below 20 μm. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.

4. 发明申请

US20170370014A1 METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF PYRAZOLE COMPOUNDS AND BISEPOXIDES 审中-公开
公开(公告)号：US20170370014A1
公开(公告)日：2017-12-28
申请号：US15621410
申请日：2017-06-13
申请人： Rohm and Haas Electronic Materials LLC
发明人： Ravi Pokhrel , Matthew Thorseth , James Byrnes , Mark Scalisi , Zuhra Niazimbetova , Joanna Dziewiszek
IPC分类号： C25D3/38 , C25D7/12 , C25D5/22 , H05K3/20 , C25D3/52
CPC分类号： C25D3/38 , C25D3/52 , C25D5/022 , C25D5/22 , C25D7/00 , C25D7/123 , H05K3/205
摘要： Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

5. 发明申请

US20160222537A1 ELECTROPLATING APPARATUS AND METHOD 审中-公开
标题翻译：电镀设备和方法
公开(公告)号：US20160222537A1
公开(公告)日：2016-08-04
申请号：US14610017
申请日：2015-01-30
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
发明人： YUNG DI SHEN , CHEN-HSIN FU , CHIH-MING YEH , YI-HU LO , JUI-MU CHO , YEN-YU CHEN , WEI ZHANG
IPC分类号： C25D7/12 , C25D5/22 , C25D17/10 , C25D21/10 , C25D17/00
CPC分类号： C25D7/123 , C25D3/38 , C25D5/04 , C25D5/48 , C25D17/001 , C25D17/06 , C25D17/10 , C25D21/12
摘要： An apparatus and a method for plating a substrate are provided. The apparatus includes: an electroplating cell for containing an electroplating solution; a substrate holder for holding a substrate in the electroplating solution; a rotation driver coupled to the substrate holder and configured to rotate the substrate holder; a power distribution assembly coupled to the rotation driver; an anode disposed within the electroplating cell; a power supply unit electrically coupled between the anode and the power distribution assembly, thereby forming an electric loop; and a current regulating member for providing a predetermined impedance value for the electric loop, wherein a voltage provided by the power supply unit causes an electric current to flow through the electric loop, and the predetermined impedance is such selected that the variation of the electric current is kept within a smaller range compared to that measured in the absence of the current regulating member.
摘要翻译：提供了一种用于电镀基板的装置和方法。该装置包括：用于容纳电镀液的电镀电池; 用于将基板保持在电镀液中的基板保持件; 旋转驱动器，其耦合到所述衬底保持器并且构造成旋转所述衬底保持器; 耦合到旋转驱动器的配电组件; 设置在所述电镀单元内的阳极; 电耦合在阳极和配电组件之间的电源单元，从而形成电路; 以及电流调节构件，用于为电路提供预定的阻抗值，其中由电源单元提供的电压使电流流过电路，并且预定阻抗被选择为使得电流的变化与不存在电流调节构件时测量的范围相比保持在较小的范围内。

6. 发明申请

US20160177463A1 Portable, Liquid Free, Electroless, Electrochemical Deposition of Metal on Conductive and Nonconductive Surfaces 审中-公开
标题翻译：便携式，无液体，无电解，金属在导电和非导电表面上的电化学沉积
公开(公告)号：US20160177463A1
公开(公告)日：2016-06-23
申请号：US14656217
申请日：2015-03-12
申请人： Oceanit Laboratories, Inc.
发明人： Ganesh Kumar Arumugam , Ashavani Kumar , Vinod P. Veedu , Sumil Thapa
IPC分类号： C25D5/22 , B29C37/00 , B29C39/00 , C25D17/14 , C25D17/00
CPC分类号： C25D5/22 , B29C39/003 , B29K2995/0005 , B29L2031/7722 , C23C18/161 , C23C18/38 , C23C18/54 , C25D3/00 , C25D5/06 , C25D17/005 , C25D17/14
摘要： Electroless plating is accomplished by forming a metal salt and a polymer solution as a binder into a solid electrolyte block and depositing metal on the surface by rubbing or brushing the solid electrolyte block onto a surface with minimal or no water and without an electric potential/power source. The solid electrolyte block is also conformable/moldable and can be used to deposit metal on to both conductive and nonconductive surface through electroless deposition process.
摘要翻译：通过将金属盐和作为粘合剂的聚合物溶液形成固体电解质块并通过将固体电解质块摩擦或刷涂在表面上，用最小或不用水并且没有电势/功率来将金属沉积在表面上来实现化学镀资源。固体电解质块也是一致的/可模制的，并且可用于通过无电沉积工艺将金属沉积到导电表面和非导电表面上。

7. 发明申请

US20150322584A1 SYSTEM AND METHODS FOR ELECTROCHEMICAL GRINDING WITH A SCREEN 有权
标题翻译：用屏幕电化学研磨的系统和方法
公开(公告)号：US20150322584A1
公开(公告)日：2015-11-12
申请号：US14703079
申请日：2015-05-04
申请人： Ying SHE , Raja KOUNTANYA , Changsheng GUO , Daniel V. VIENS
发明人： Ying SHE , Raja KOUNTANYA , Changsheng GUO , Daniel V. VIENS
IPC分类号： C25D5/22 , C25D17/10 , C25D21/12 , C25F7/00 , C25F3/16
CPC分类号： C25D5/22 , C25C1/00 , C25C7/00 , C25C7/02 , C25C7/06 , C25D17/10 , C25D21/12 , C25F3/16 , C25F7/00
摘要： A system and methods are provided for electrochemical grinding a workpiece. In one embodiment, a method includes controlling potentials to grinding tool and the workpiece, controlling applying electrolyte, and controlling grinding of the workpiece by the grinding tool. The method may also include determining screen replacement when there is sufficient metal plated.
摘要翻译：提供了用于电化学研磨工件的系统和方法。在一个实施例中，一种方法包括控制研磨工具和工件的电位，控制施加电解质，以及通过研磨工具控制工件的研磨。该方法还可以包括当存在足够的金属镀层时确定屏幕更换。

8. 发明申请

US20150108004A1 Multi-Layer Structures and Methods for Forming 审中-公开
标题翻译：多层结构和形成方法
公开(公告)号：US20150108004A1
公开(公告)日：2015-04-23
申请号：US14587883
申请日：2014-12-31
申请人： University of Southern California
发明人： Adam L. Cohen
IPC分类号： C25D5/10 , C25D5/22
CPC分类号： C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
摘要翻译：一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。还公开了电镀制品和电镀装置。

9. 发明申请

US20150040375A1 Metal Cleaning and Deposition Process for Coiled Tubing Using Electro Plasma 审中-公开
标题翻译：使用电浆的卷管的金属清洗和沉积工艺
公开(公告)号：US20150040375A1
公开(公告)日：2015-02-12
申请号：US14455875
申请日：2014-08-09
申请人： CAP TECHNOLOGIES, LLC
发明人： Edward O. Daigle , Pratheesh George
IPC分类号： C25D5/22 , B21C47/02 , C25D5/00 , F16L9/02
CPC分类号： C25D5/22 , B21C37/0811 , B21C37/083 , B21C37/09 , B21C43/00 , B21C47/02 , B23K2101/06 , C25D3/22 , C25D3/562 , C25D3/565 , C25D5/003 , C25D5/36 , C25D5/48 , C25D7/0614 , C25D17/00 , C25D17/02 , C25F1/04 , C25F1/06 , F16L1/203 , F16L9/02 , F16L58/08 , Y10T29/49885 , Y10T29/49968 , Y10T29/49982
摘要： A method for creating an improved coiled tubing is provided, comprising cleaning a sheet metal workpiece using an electroplasma process to remove oxide scale and other contaminants on surfaces of the workpiece; applying a first metal coating to the workpiece using the electroplasma process; forming the sheet metal workpiece into a tube having abutting edges to form a seam; welding the seam to complete the formation of the tube; grinding the seam to establish a smooth exterior surface on the seam; applying a second metal coating to the seam of the tube using the electroplasma process; and coiling the tube around a spool.
摘要翻译：提供了一种用于创建改进的连续油管的方法，包括使用电镀工艺清洁钣金工件以去除工件表面上的氧化皮和其它污染物; 使用电镀工艺将第一金属涂层施加到工件上; 将所述钣金工件形成为具有邻接边缘的管以形成接缝; 焊缝焊接完成管的形成; 研磨接缝以在缝上建立光滑的外表面; 使用电镀工艺将第二金属涂层施加到管的接缝; 并将管缠绕在线轴上。

10. 发明申请

US20140097088A1 ELECTROFILL VACUUM PLATING CELL 有权
标题翻译： ELECTROFILL真空镀层电池
公开(公告)号：US20140097088A1
公开(公告)日：2014-04-10
申请号：US14102239
申请日：2013-12-10
申请人： Novellus Systems, Inc.
发明人： R. Marshall Stowell , Jingbin Feng , David W. Porter
IPC分类号： C25D5/22 , C25D17/00
CPC分类号： C25D5/22 , C25D3/38 , C25D5/003 , C25D5/02 , C25D5/04 , C25D7/123 , C25D17/001 , C25D21/04 , C25D21/12 , C25D21/18
摘要： The disclosed embodiments relate to methods and apparatus for immersing a substrate in electrolyte in an electroplating cell under sub-atmospheric conditions to reduce or eliminate the formation/trapping of bubbles as the substrate is immersed. Various electrolyte recirculation loops are disclosed to provide electrolyte to the plating cell. The recirculation loops may include pumps, degassers, sensors, valves, etc. The disclosed embodiments allow a substrate to be immersed quickly, greatly reducing the issues related to bubble formation and uneven plating times during electroplating.
摘要翻译：所公开的实施方案涉及用于在亚低温大气条件下将基板浸入电镀池中的电解质中的方法和装置，以减少或消除基底浸入时气泡的形成/捕获。公开了各种电解质循环回路以向电镀槽提供电解质。再循环回路可以包括泵，脱气器，传感器，阀门等。所公开的实施例允许衬底被快速浸入，大大减少了与电镀期间的气泡形成和电镀时间不均有关的问题。

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