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    • 10. 发明授权
    • Method and apparatus for testing a semiconductor device
    • 用于测试半导体器件的方法和装置
    • US09075101B2
    • 2015-07-07
    • US14018653
    • 2013-09-05
    • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    • Jhih Jie ShaoSzu-Chia HuangTang-Hsuan ChungHuan Chi Tseng
    • G01R31/28G01R27/22G01R31/26G01R31/27
    • G01R31/26G01R31/2607G01R31/275
    • The present disclosure provides a method for testing a semiconductor device. The method includes providing a testing unit and an electronic circuit coupled to the testing unit and applying a first electrical signal to the testing unit. The method includes sweeping a second electrical signal across a range of values, the second electrical signal supplying power to the electronic circuit, wherein the sweeping is performed while a value of the first electrical signal remains the same. The method includes measuring a third electrical signal during the sweeping, the measured third electrical signal having a range of values that each correspond to one of the values of the second electrical signal. The method includes adopting an optimum value of the second electrical signal that yields a minimum value of the third electrical signal. The method includes testing the testing unit while the second electrical signal is set to the optimum value.
    • 本公开提供了一种用于测试半导体器件的方法。 该方法包括提供耦合到测试单元的测试单元和电子电路,并向测试单元施加第一电信号。 该方法包括跨越一定范围的值扫描第二电信号,第二电信号向电子电路供电,其中在第一电信号的值保持相同时进行扫描。 该方法包括在扫描期间测量第三电信号,所测量的第三电信号具有各自对应于第二电信号中的一个值的值的范围。 该方法包括采用产生第三电信号的最小值的第二电信号的最佳值。 该方法包括测试单元,而第二电信号被设置为最佳值。