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1. 发明授权

US07832432B2 Chemical delivery apparatus for CVD or ALD 有权
标题翻译：用于CVD或ALD的化学输送装置
公开(公告)号：US07832432B2
公开(公告)日：2010-11-16
申请号：US12500319
申请日：2009-07-09
申请人： Norman Nakashima , Christophe Marcadal , Seshadri Ganguli , Paul Ma , Schubert S. Chu
发明人： Norman Nakashima , Christophe Marcadal , Seshadri Ganguli , Paul Ma , Schubert S. Chu
IPC分类号： F16K3/36 , F16K11/20
CPC分类号： C23C16/4481 , C23C16/4408 , C23C16/45561 , Y10T137/3127 , Y10T137/4259 , Y10T137/87249 , Y10T137/877
摘要： Embodiments described herein provide ampoule assemblies to contain, store, or dispense chemical precursors. In one embodiment, an ampoule assembly is provided which includes an ampoule containing a first material layer disposed on the outside of the ampoule and a second material layer disposed over the first material layer, wherein the first material layer is thermally more conductive than the second material layer, an inlet line in fluid communication with the ampoule and containing a first manual shut-off valve disposed therein, an outlet line in fluid communication with the ampoule and containing a second manual shut-off valve disposed therein, and a first bypass line connected between the inlet line and the outlet line. In some embodiments, the ampoule assembly may contain disconnect fittings. In other embodiments, the first bypass line has a shut-off valve disposed therein to fluidly couple or decouple the inlet line and the outlet line.
摘要翻译：本文所述的实施方案提供用于容纳，储存或分配化学前体的安瓿组件。在一个实施例中，提供安瓿组件，其包括安瓿，其包含设置在安瓿的外侧上的第一材料层和设置在第一材料层上的第二材料层，其中第一材料层比第二材料热导热层，与安瓿流体连通并且容纳设置在其中的第一手动截止阀的入口管线，与安瓿流体连通并且容纳设置在其中的第二手动截止阀的出口管线和连接的第一旁路管线在入口管线和出口管线之间。在一些实施例中，安瓿组件可以包含断开配件。在其他实施例中，第一旁路管线具有设置在其中的截止阀，以使入口管线和出口管线流体耦合或解耦。

2. 发明授权

US07597758B2 Chemical precursor ampoule for vapor deposition processes 有权
标题翻译：用于气相沉积工艺的化学前体安瓿瓶
公开(公告)号：US07597758B2
公开(公告)日：2009-10-06
申请号：US11849125
申请日：2007-08-31
申请人： Ling Chen , Vincent W. Ku , Hua Chung , Christophe Marcadal , Seshadri Ganguli , Jenny Lin , Dien-Yeh Wu , Alan Ouye , Mei Chang
发明人： Ling Chen , Vincent W. Ku , Hua Chung , Christophe Marcadal , Seshadri Ganguli , Jenny Lin , Dien-Yeh Wu , Alan Ouye , Mei Chang
IPC分类号： C30B23/08
CPC分类号： C23C16/45544 , C23C16/18 , C23C16/34 , C23C16/4402 , C23C16/4481 , C23C16/4482 , C23C16/4487 , Y10T117/10 , Y10T117/1004 , Y10T117/1008
摘要： Embodiments of the invention provide chemical precursor ampoules that may be used during vapor deposition processes. In one embodiment, an apparatus for generating a chemical precursor gas used in a vapor deposition processing system is provided which includes a canister having a sidewall, a top, and a bottom forming an interior volume and a solid precursor material at least partially contained within a lower region of the interior volume. The apparatus further contains an inlet port and an outlet port in fluid communication with the interior volume and an inlet tube connected to the inlet port and positioned to direct a carrier gas towards the sidewall and away form the outlet port. In one example, the solid precursor contains pentakis(dimethylamido) tantalum (PDMAT). In another example, the apparatus contains a plurality of baffles that form an extended mean flow path between the inlet port and the outlet port.
摘要翻译：本发明的实施方案提供可在气相沉积工艺期间使用的化学前体安瓿。在一个实施例中，提供了一种用于产生在气相沉积处理系统中使用的化学前体气体的装置，其包括具有侧壁，顶部和形成内部容积的底部的罐，以及固体前体材料，其至少部分地包含在内部体积的较低区域。该装置还包括与内部空间流体连通的入口端口和出口端口，以及连接到入口端口的入口管，并且定位成将载气朝向侧壁引导并从出口端口移开。在一个实例中，固体前体含有五（二甲基氨基）钽（PDMAT）。在另一示例中，该装置包含多个挡板，其在入口和出口之间形成延伸的平均流动路径。

3. 发明授权

US07588736B2 Apparatus and method for generating a chemical precursor 有权
标题翻译：用于产生化学前体的装置和方法
公开(公告)号：US07588736B2
公开(公告)日：2009-09-15
申请号：US11383642
申请日：2006-05-16
申请人： Ling Chen , Vincent W. Ku , Hua Chung , Christophe Marcadal , Seshadri Ganguli , Jenny Lin , Dien-Yeh Wu , Alan Ouye , Mei Chang
发明人： Ling Chen , Vincent W. Ku , Hua Chung , Christophe Marcadal , Seshadri Ganguli , Jenny Lin , Dien-Yeh Wu , Alan Ouye , Mei Chang
IPC分类号： F27B15/08
CPC分类号： C23C16/45544 , C23C16/18 , C23C16/34 , C23C16/4402 , C23C16/4481 , C23C16/4482 , C23C16/4487 , Y10T117/10 , Y10T117/1004 , Y10T117/1008
摘要： Embodiments of an apparatus for generating a chemical precursor used in a vapor deposition processing system are provide which include a canister having a sidewall, a top, and a bottom forming an interior volume which is in fluid communication with an inlet port and an outlet port. The canister contains a plurality of baffles that extend from the bottom to an upper portion of the interior volume and form an extended mean flow path between the inlet port and the outlet port. In one embodiment, the baffles are contained on a prefabricated insert positioned on the bottom of the canister. In one example, an inlet tube may extend from the inlet port into the interior region and be positioned substantially parallel to the baffles. An outlet end of the inlet tube may be adapted to direct a gas flow away from the outlet port, such as towards the sidewall or top of the canister.
摘要翻译：提供了一种用于生成在气相沉积处理系统中使用的化学前体的装置的实施例，其包括具有侧壁，顶部和底部的罐，该罐形成与入口端口和出口端口流体连通的内部容积。罐包含多个挡板，其从内部容积的底部延伸到上部，并且在入口和出口之间形成延伸的平均流动路径。在一个实施例中，挡板包含在位于罐底部的预制插入件上。在一个示例中，入口管可以从入口端口延伸到内部区域中并且基本平行于挡板定位。入口管的出口端可以适于将气流引导离开出口，例如朝向罐的侧壁或顶部。

4. 发明申请

US20080085611A1 DEPOSITION AND DENSIFICATION PROCESS FOR TITANIUM NITRIDE BARRIER LAYERS 失效
标题翻译：硝酸钡阻挡层的沉积和渗透过程
公开(公告)号：US20080085611A1
公开(公告)日：2008-04-10
申请号：US11869557
申请日：2007-10-09
申请人： AMIT KHANDELWAL , AVGERINOS V. GELATOS , CHRISTOPHE MARCADAL , MEI CHANG
发明人： AMIT KHANDELWAL , AVGERINOS V. GELATOS , CHRISTOPHE MARCADAL , MEI CHANG
IPC分类号： H01L21/31
CPC分类号： H01L21/28556 , H01L21/321 , H01L21/76843 , H01L21/76862
摘要： In one embodiment, a method for forming a titanium nitride barrier material on a substrate is provided which includes depositing a titanium nitride layer on the substrate by a metal-organic chemical vapor deposition (MOCVD) process, and thereafter, densifying the titanium nitride layer by exposing the substrate to a plasma process. In one example, the MOCVD process and the densifying plasma process is repeated to form a barrier stack by depositing a second titanium nitride layer on the first titanium nitride layer. In another example, a third titanium nitride layer is deposited on the second titanium nitride layer. Subsequently, the method provides depositing a conductive material on the substrate and exposing the substrate to a annealing process. In one example, each titanium nitride layer may have a thickness of about 15 Å and the titanium nitride barrier stack may have a copper diffusion potential of less than about 5×1010 atoms/cm2.
摘要翻译：在一个实施例中，提供了一种在衬底上形成氮化钛阻挡材料的方法，其包括通过金属 - 有机化学气相沉积（MOCVD）工艺在衬底上沉积氮化钛层，然后通过以下步骤致密化氮化钛层：将衬底暴露于等离子体工艺。在一个实例中，通过在第一氮化钛层上沉积第二氮化钛层来重复MOCVD工艺和致密等离子体工艺以形成势垒堆叠。在另一示例中，在第二氮化钛层上沉积第三氮化钛层。随后，该方法提供在衬底上沉积导电材料并将衬底暴露于退火过程。在一个示例中，每个氮化钛层可以具有约的厚度，并且氮化钛阻挡层可以具有小于约5×10 10原子/ cm 2的铜扩散电位， SUP>。

5. 发明授权

US07265048B2 Reduction of copper dewetting by transition metal deposition 有权
标题翻译：通过过渡金属沉积减少铜的去湿
公开(公告)号：US07265048B2
公开(公告)日：2007-09-04
申请号：US11069514
申请日：2005-03-01
申请人： Hua Chung , Seshadri Ganguli , Christophe Marcadal , Jick M. Yu
发明人： Hua Chung , Seshadri Ganguli , Christophe Marcadal , Jick M. Yu
IPC分类号： H01L21/4763
CPC分类号： H01L21/76846 , H01L21/28556 , H01L21/76868 , H01L21/76873 , H01L2221/1089
摘要： A method and apparatus for forming layers on a substrate comprising depositing a metal seed layer on a substrate surface having apertures, depositing a transition metal layer over the copper seed layer, and depositing a bulk metal layer over the transition metal layer. Also a method and apparatus for forming a via through a dielectric to reveal metal at the base of the via, depositing a transition metal layer, and depositing a first metal layer on the transition metal layer. Additionally, a method and apparatus for depositing a transition metal layer on an exposed metal surface, and depositing a layer thereover selected from the group consisting of a capping layer and a low dielectric constant layer.
摘要翻译：一种用于在衬底上形成层的方法和装置，包括在具有孔的衬底表面上沉积金属籽晶层，在铜籽晶层上沉积过渡金属层，以及在过渡金属层上沉积体金属层。还有一种用于通过电介质形成通孔以在通孔底部露出金属的方法和装置，沉积过渡金属层，以及在过渡金属层上沉积第一金属层。另外，一种用于在暴露的金属表面上沉积过渡金属层并在其上沉积选自由封盖层和低介电常数层组成的层的方法和装置。

6. 发明申请

US20070151861A1 RELIABILITY BARRIER INTEGRATION FOR CU APPLICATION 审中-公开
标题翻译： CU应用可靠性障碍集成
公开(公告)号：US20070151861A1
公开(公告)日：2007-07-05
申请号：US11682005
申请日：2007-03-05
申请人： MING XI , Paul Smith , Ling Chen , Michael Yang , Mei Chang , Fusen Chen , Christophe Marcadal , Jenny Lin
发明人： MING XI , Paul Smith , Ling Chen , Michael Yang , Mei Chang , Fusen Chen , Christophe Marcadal , Jenny Lin
IPC分类号： C23C28/00 , C23C28/02
CPC分类号： H01L21/76804 , C25D5/02 , H01L21/2855 , H01L21/28556 , H01L21/28562 , H01L21/76831 , H01L21/76843 , H01L21/76844 , H01L21/76846 , H01L21/76877 , H01L23/5226 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the present invention provide a process sequence and related hardware for filling a patterned feature on a substrate with a metal, such as copper. The sequence comprises first forming a reliable barrier layer in the patterned feature to prevent diffusion of the metal into the dielectric layer through which the patterned feature is formed. One sequence comprises forming a generally conformal barrier layer over a patterned dielectric, etching the barrier layer at the bottom of the patterned feature, depositing a second barrier layer, and then filling the patterned feature with a metal, such as copper.
摘要翻译：本发明的实施例提供了用金属（例如铜）在衬底上填充图案化特征的工艺顺序和相关硬件。序列包括首先在图案化特征中形成可靠的阻挡层，以防止金属扩散到通过其形成图案化特征的电介质层。一个序列包括在图案化电介质上形成大致共形的阻挡层，在图案化特征的底部蚀刻阻挡层，沉积第二阻挡层，然后用诸如铜的金属填充图案化的特征。

7. 发明申请

US20070054487A1 ATOMIC LAYER DEPOSITION PROCESSES FOR RUTHENIUM MATERIALS 审中-公开
公开(公告)号：US20070054487A1
公开(公告)日：2007-03-08
申请号：US11470466
申请日：2006-09-06
申请人： PAUL MA , KAVITA SHAH , DIEN-YEH WU , SESHADRI GANGULI , CHRISTOPHE MARCADAL , FREDERICK WU , SCHUBERT CHU
发明人： PAUL MA , KAVITA SHAH , DIEN-YEH WU , SESHADRI GANGULI , CHRISTOPHE MARCADAL , FREDERICK WU , SCHUBERT CHU
IPC分类号： H01L21/44
CPC分类号： H01L21/28562 , C23C16/18 , C23C16/45525 , C23C16/45542 , C23C16/45553 , H01L21/28556 , H01L21/76843 , H01L21/76846
摘要： Embodiments of the invention provide a method for depositing ruthenium materials on a substrate by various vapor deposition processes, such as atomic layer deposition (ALD) and plasma-enhanced ALD (PE-ALD). In one aspect, the process has little or no initiation delay and maintains a fast deposition rate while forming a ruthenium material. The ruthenium material may be deposited with good step coverage, strong adhesion, and contains a low carbon concentration for high electrical conductivity. The method for depositing the ruthenium material on a substrate generally includes sequentially exposing the substrate to a pyrrolyl ruthenium precursor and a reagent during the ALD process. The pyrrolyl ruthenium precursor contains ruthenium and at least one pyrrolyl ligand. In some examples, the reagent may contain a plasma of ammonia, nitrogen, or hydrogen during a PE-ALD process. In other examples, a reducing gas may be used during a thermal ALD process.

8. 发明申请

US20050074968A1 Tantalum barrier layer for copper metallization 有权
标题翻译：用于铜金属化的钽阻挡层
公开(公告)号：US20050074968A1
公开(公告)日：2005-04-07
申请号：US10693775
申请日：2003-10-25
申请人： Ling Chen , Seshadri Ganguli , Wei Cao , Christophe Marcadal
发明人： Ling Chen , Seshadri Ganguli , Wei Cao , Christophe Marcadal
IPC分类号： H01L21/285 , H01L21/4763 , H01L21/768 , H01L21/44
CPC分类号： H01L21/76844 , H01L21/2855 , H01L21/28556 , H01L21/76843 , H01L21/76846 , H01L21/76856 , H01L21/76865
摘要： A method of forming barrier layers in a via hole extending through an inter-level dielectric layer and including a preformed first barrier coated onto the bottom and sidewalls of the via holes. In a single plasma sputter reactor, a first step sputters the wafer rather than the target with high energy ions to remove the barrier layer from the bottom of the via but not from the sidewalls and a second step sputter deposits a second barrier layer, for example of Ta/TaN, onto the via bottom and sidewalls. The two steps may be differentiated by power applied to the target, by chamber pressure, or by wafer bias. The second step may include the simultaneous removal of the first barrier layer from the via bottom and sputter deposition of the second barrier layer onto the via sidewalls.
摘要翻译：在穿过层间电介质层的通孔中形成阻挡层的方法，包括涂覆在通孔的底部和侧壁上的预先形成的第一屏障。在单个等离子体溅射反应器中，第一步骤以高能离子将晶片而不是目标物喷射，以从通孔的底部除去阻挡层，而不是从侧壁排出，第二步骤溅射沉积第二阻挡层，例如的Ta / TaN，通过底部和侧壁。这两个步骤可以通过施加到靶，通过室压力或通过晶片偏置的功率来区分。第二步骤可以包括从通孔底部同时移除第一阻挡层并将第二阻挡层溅射到通孔侧壁上。

9. 发明授权

US07838441B2 Deposition and densification process for titanium nitride barrier layers 失效
标题翻译：氮化钛阻挡层的沉积和致密化过程
公开(公告)号：US07838441B2
公开(公告)日：2010-11-23
申请号：US12426815
申请日：2009-04-20
申请人： Amit Khandelwal , Avgerinos V. Gelatos , Christophe Marcadal , Mei Chang
发明人： Amit Khandelwal , Avgerinos V. Gelatos , Christophe Marcadal , Mei Chang
IPC分类号： H01L21/768
CPC分类号： H01L21/28556 , H01L21/321 , H01L21/76843 , H01L21/76862
摘要： In one embodiment, a method for forming a titanium nitride barrier material on a substrate is provided which includes depositing a titanium nitride layer on the substrate by a metal-organic chemical vapor deposition (MOCVD) process, and thereafter, densifying the titanium nitride layer by exposing the substrate to a plasma process. In one example, the MOCVD process and the densifying plasma process is repeated to form a barrier stack by depositing a second titanium nitride layer on the first titanium nitride layer. In another example, a third titanium nitride layer is deposited on the second titanium nitride layer. Subsequently, the method provides depositing a conductive material on the substrate and exposing the substrate to a annealing process. In one example, each titanium nitride layer may have a thickness of about 15 Å and the titanium nitride barrier stack may have a copper diffusion potential of less than about 5×1010 atoms/cm2.
摘要翻译：在一个实施例中，提供了一种在衬底上形成氮化钛阻挡材料的方法，其包括通过金属 - 有机化学气相沉积（MOCVD）工艺在衬底上沉积氮化钛层，然后通过以下步骤致密化氮化钛层：将衬底暴露于等离子体工艺。在一个实例中，通过在第一氮化钛层上沉积第二氮化钛层来重复MOCVD工艺和致密等离子体工艺以形成势垒堆叠。在另一示例中，在第二氮化钛层上沉积第三氮化钛层。随后，该方法提供在衬底上沉积导电材料并将衬底暴露于退火过程。在一个示例中，每个氮化钛层可以具有约15埃的厚度，氮化钛阻挡层可以具有小于约5×10 10原子/ cm 2的铜扩散电位。

10. 发明授权

US07691742B2 Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA 失效
标题翻译：使用钽前体TAIMATA的含钽材料的原子层沉积
公开(公告)号：US07691742B2
公开(公告)日：2010-04-06
申请号：US12365310
申请日：2009-02-04
申请人： Christophe Marcadal , Rongjun Wang , Hua Chung , Nirmalya Maity
发明人： Christophe Marcadal , Rongjun Wang , Hua Chung , Nirmalya Maity
IPC分类号： H01L21/44 , H01L21/285
CPC分类号： H01L29/495 , C23C16/18 , C23C16/30 , C23C16/45553 , H01L21/28079 , H01L21/28562 , H01L21/76843 , H01L21/76864 , H01L29/4958 , H01L29/517
摘要： In one embodiment, a method for forming a tantalum-containing material on a substrate is provided which includes heating a liquid tantalum precursor containing tertiaryamylimido-tris(dimethylamido) tantalum (TAIMATA) to a temperature of at least 30° C. to form a tantalum precursor gas and exposing the substrate to a continuous flow of a carrier gas during an atomic layer deposition process. The method further provides exposing the substrate to the tantalum precursor gas by pulsing the tantalum precursor gas into the carrier gas and adsorbing the tantalum precursor gas on the substrate to form a tantalum precursor layer thereon. Subsequently, the tantalum precursor layer is exposed to at least one secondary element-containing gas by pulsing the secondary element-containing gas into the carrier gas while forming a tantalum barrier layer on the substrate. The tantalum barrier layer may contain tantalum, tantalum nitride, tantalum silicon nitride, tantalum boron nitride, tantalum phosphorous nitride or tantalum oxynitride.
摘要翻译：在一个实施方案中，提供了一种用于在基底上形成含钽材料的方法，其包括将含有叔戊酰亚氨基 - 三（二甲基氨基）钽（TAIMATA）的液体钽前体加热至至少30℃的温度以形成钽前体气体，并在原子层沉积过程中将衬底暴露于载气的连续流动。该方法进一步通过将钽前体气体脉冲到载气中并将钽前驱体气体吸附在基底上以在其上形成钽前体层而使衬底暴露于钽前体气体。随后，通过在衬底上形成钽阻挡层，将含二次元素的气体脉冲送入载气中，使钽前体层暴露于至少一个含二元素气体。钽阻挡层可以包含钽，氮化钽，氮化钽，氮化硼，氮化钽或氮氧化钽。

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