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    • 2. 发明授权
    • Method of storing GaN substrate, stored substrate, and semiconductor device and method of its manufacture
    • 存储GaN衬底,存储衬底和半导体器件的方法及其制造方法
    • US08227826B2
    • 2012-07-24
    • US12877086
    • 2010-09-07
    • Hideyuki IjiriSeiji Nakahata
    • Hideyuki IjiriSeiji Nakahata
    • H01L27/15H01L29/267H01L29/22H01L29/227H01L33/00
    • H01L33/0075C30B29/406C30B33/00
    • Affords a method of storing GaN substrates from which semiconductor devices of favorable properties can be manufactured, the stored substrates, and semiconductor devices and methods of manufacturing the semiconductor devices. In the GaN substrate storing method, a GaN substrate (1) is stored in an atmosphere having an oxygen concentration of 18 vol. % or less, and/or a water-vapor concentration of 12 g/m3 or less. Surface roughness Ra of a first principal face on, and roughness Ra of a second principal face on, the GaN substrate stored by the storing method are brought to no more than 20 nm and to no more than 20 μm, respectively. In addition, the GaN substrates are rendered such that the principal faces form an off-axis angle with the (0001) plane of from 0.05° to 2° in the direction, and from 0° to 1° in the direction.
    • 提供一种存储可以制造具有良好特性的半导体器件的GaN衬底的方法,存储的衬底以及半导体器件以及制造半导体器件的方法。 在GaN衬底存储方法中,将GaN衬底(1)储存在氧气浓度为18体积%的气氛中。 %以下,和/或12g / m 3以下的水蒸气浓度。 通过存储方法储存的GaN衬底上的第一主面的表面粗糙度Ra和第二主面的粗糙度Ra分别为不大于20nm且不大于20μm。 此外,使GaN基板使得主面与(0001)面在<100°方向上形成从0.05°至2°的偏轴角度,并且在<0001方向上从0°到1°, 11 20>方向。
    • 4. 发明授权
    • Method of preparing and storing GaN substrate, prepared and stored GaN substrate, and semiconductor device and method of its manufacture
    • 制备和存储GaN衬底,制备和存储的GaN衬底的方法以及半导体器件及其制造方法
    • US08476158B2
    • 2013-07-02
    • US13188475
    • 2011-07-22
    • Hideyuki IjiriSeiji Nakahata
    • Hideyuki IjiriSeiji Nakahata
    • H01L21/28H01L21/3205
    • H01L29/2003C30B29/406C30B33/00H01L33/0075H01L33/16
    • A GaN substrate storage method of storing, within an atmosphere in which the oxygen concentration is not greater than 15 vol. % and the water-vapor concentration is not greater than 20 g/m3, a GaN substrate (1) having a planar first principal face (1m), and whose plane orientation in an arbitrary point (P) along the first principal face (1m) and separated 3 mm or more from the outer edge thereof has an off-inclination angle Δα of −10° or more, 10° or less with respect to the plane orientation of an arbitrarily designated crystalline plane (1a) that is inclined 50° or more, 90° or less with respect to a plane (1c), being either the (0001) plane or the (000 1) plane, through the arbitrary point. In this way a method of storing GaN substrates whose principal-face plane orientation is other than (0001) or (000 1), with which semiconductor devices of favorable properties can be manufactured is made available.
    • 一种GaN衬底存储方法,其在氧浓度不大于15体积%的气氛中, %,水蒸气浓度不大于20g / m 3,具有平面第一主面(1μm)的GaN衬底(1),并且其沿着第一主面(1m)的任意点(P)的面取向 )并且从其外边缘分离出3mm以上的角度具有相对于倾斜50°的任意指定的晶面(1a)的平面取向为-10°以上,10°以下的偏斜角度Δα 或更多,90°或更小,相对于(0001)面或(0001)面的平面(1c),通过该任意点。 以这种方式,可以获得存储其主面平面取向不同于(0001)或(000 1)的GaN衬底的方法,可以制造具有良好特性的半导体器件。
    • 5. 发明申请
    • Method of Storing GaN Substrate, Stored Substrate, and Semiconductor Device and Method of Its Manufacture
    • 存储GaN衬底,存储衬底和半导体器件的方法及其制造方法
    • US20100326876A1
    • 2010-12-30
    • US12877086
    • 2010-09-07
    • Hideyuki IjiriSeiji Nakahata
    • Hideyuki IjiriSeiji Nakahata
    • B65D90/00
    • H01L33/0075C30B29/406C30B33/00
    • Affords a method of storing GaN substrates from which semiconductor devices of favorable properties can be manufactured, the stored substrates, and semiconductor devices and methods of manufacturing the semiconductor devices. In the GaN substrate storing method, a GaN substrate (1) is stored in an atmosphere having an oxygen concentration of 18 vol. % or less, and/or a water-vapor concentration of 12 g/m3 or less. Surface roughness Ra of a first principal face on, and roughness Ra of a second principal face on, the GaN substrate stored by the storing method are brought to no more than 20 nm and to no more than 20 μm, respectively. In addition, the GaN substrates are rendered such that the principal faces form an off-axis angle with the (0001) plane of from 0.05° to 2° in the direction, and from 0° to 1° in the direction.
    • 提供一种存储可以制造具有良好特性的半导体器件的GaN衬底的方法,存储的衬底以及半导体器件以及制造半导体器件的方法。 在GaN衬底存储方法中,将GaN衬底(1)储存在氧气浓度为18体积%的气氛中。 %以下,和/或12g / m 3以下的水蒸气浓度。 通过存储方法储存的GaN衬底上的第一主面的表面粗糙度Ra和第二主面的粗糙度Ra分别为不大于20nm且不大于20μm。 此外,使GaN基板使得主面与(0001)面在<100°方向上形成从0.05°至2°的偏轴角度,并且在<0001方向上从0°到1°, 11 20>方向。
    • 10. 发明申请
    • Method of Storing GaN Substrate, Stored Substrate, and Semiconductor Device and Method of Its Manufacture
    • 存储GaN衬底,存储衬底和半导体器件的方法及其制造方法
    • US20080003440A1
    • 2008-01-03
    • US11762786
    • 2007-06-14
    • Hideyuki IjiriSeiji Nakahata
    • Hideyuki IjiriSeiji Nakahata
    • B32B9/00B32B15/04
    • H01L33/0075C30B29/406C30B33/00
    • Affords a method of storing GaN substrates from which semiconductor devices of favorable properties can be manufactured, the stored substrates, and semiconductor devices and methods of manufacturing the semiconductor devices. In the GaN substrate storing method, a GaN substrate (1) is stored in an atmosphere having an oxygen concentration of 18 vol. % or less, and/or a water-vapor concentration of 12 g/m3 or less. Surface roughness Ra of a first principal face on, and roughness Ra of a second principal face on, the GaN substrate stored by the storing method are brought to no more than 20 nm and to no more than 20 μm, respectively. In addition, the GaN substrates are rendered such that the principal faces form an off-axis angle with the (0001) plane of from 0.05° to 2° in the direction, and from 0° to 1° in the direction.
    • 提供一种存储可以制造具有良好特性的半导体器件的GaN衬底的方法,存储的衬底以及半导体器件以及制造半导体器件的方法。 在GaN衬底存储方法中,将GaN衬底(1)储存在氧气浓度为18体积%的气氛中。 %以下,和/或12g / m 3以下的水蒸气浓度。 通过存储方法存储的GaN衬底的第一主面的表面粗糙度Ra和第二主面的粗糙度Ra分别为20nm以上且不超过20μm。 此外,使GaN基板在<1 100>方向上的主面与(0001)面成为0.05°至2°的离轴角,并且从 在<11 20>方向上为0°至1°。