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1. 发明申请

US20120018008A1 Apparatus for supplying source 审中-公开
标题翻译：用于供应源的装置
公开(公告)号：US20120018008A1
公开(公告)日：2012-01-26
申请号：US12926823
申请日：2010-12-10
申请人： Dong Joo Shin , Sung Taek Lim , Choon Keun Lee
发明人： Dong Joo Shin , Sung Taek Lim , Choon Keun Lee
IPC分类号： F99Z99/00
CPC分类号： B05C1/0813 , B05C1/0804 , B05C1/0808 , B05C1/0817 , B05C1/0826 , B29C39/18 , B29C39/44 , Y10T137/7287
摘要： Disclosed herein is an apparatus for supplying a source for constantly maintaining a film source water level in a source reservoir.The apparatus for supplying a source according to the present invention includes a source reservoir into which a liquid-phase film source is injected; a carrier film that is horizontally delivered from one side of the source reservoir; a casting roller that is rotated along the delivery direction of the carrier film and applies the liquid-phase film source injected into the source reservoir to the carrier film; a water level control plate that is vertically driven in the source reservoir to control the liquid-phase film source level; and a plate driving unit that moves the water level control plate up and down.
摘要翻译：本文公开了一种用于供应源以持续保持源储罐中的膜源水位的装置。根据本发明的用于供应源的装置包括其中注入液相膜源的源储存器; 从源储存器的一侧水平地传送的载体膜; 沿着载体膜的传送方向旋转的浇铸辊，将注入到所述源容器中的液相膜源施加到载体膜上; 水位控制板，其在源储液器中垂直驱动以控制液相膜源水平; 以及上下移动水位控制板的板驱动单元。

2. 发明申请

US20130000965A1 DIELECTRIC COMPOSITION, MULTILAYERED PRINTED CIRCUIT BOARD COMPRISING DIELECTRIC LAYER MANUFACTURED THEREOF, AND METHOD FOR PREPARING THE MULTILAYERED PRINTED CIRCUIT BOARD 审中-公开
标题翻译：电介质组合物，包含其制造的电介质层的多层印刷电路板以及制备多层印刷电路板的方法
公开(公告)号：US20130000965A1
公开(公告)日：2013-01-03
申请号：US13469614
申请日：2012-05-11
申请人： Dong Joo SHIN , Seong Min Chin , Moon Soo Park , Sung Taek Lim , Sung Hyun Kim , Choon Keun Lee
发明人： Dong Joo SHIN , Seong Min Chin , Moon Soo Park , Sung Taek Lim , Sung Hyun Kim , Choon Keun Lee
IPC分类号： H05K1/00 , C08K3/26 , C08K3/36 , H01B19/04
CPC分类号： H05K3/4676 , H01B3/40 , H05K1/0373 , H05K3/38 , H05K2201/0209 , H05K2203/0773
摘要： Disclosed herein are a dielectric composition of a multilayered circuit board including two types of inorganic fillers of 10 to 60 parts by weight with respect to an epoxy resin of 100 parts by weight, a multilayered printed circuit board including a dielectric layer manufactured of the dielectric composition, and a method for preparing the multilayered printed circuit board.According to the present invention, by mixing two types of inorganic fillers such as SiO2 and CaCO3 in manufacturing the dielectric layer of the multilayered circuit board, a high adhesive strength to a plating layer can be achieved without using a fluoride-based solution including 3NH4HF2 as an oxidant while etching the dielectric layer and furthermore, an environmentally hazardous substance can be prevented from being discharged.
摘要翻译：本文公开了一种多层电路板的电介质组合物，其包含相对于100重量份的环氧树脂为10至60重量份的两种类型的无机填料，包括由电介质组合物制成的电介质层的多层印刷电路板以及制备多层印刷电路板的方法。根据本发明，通过在制造多层电路板的电介质层中混合两种无机填料如SiO 2和CaCO 3，可以在不使用包含3NH 4 HF 2的氟化物溶液作为氧化剂，同时蚀刻电介质层，此外，可以防止对环境有害的物质的排出。

3. 发明申请

US20120292424A1 SLITTER 审中-公开
公开(公告)号：US20120292424A1
公开(公告)日：2012-11-22
申请号：US13448243
申请日：2012-04-16
申请人： Dong Joo Shin , Sung Taek Lim , Choon Keun Lee
发明人： Dong Joo Shin , Sung Taek Lim , Choon Keun Lee
IPC分类号： B65H35/02
CPC分类号： B65H35/02 , B65H35/08 , B65H2601/511 , B65H2701/12 , B65H2701/1752 , B65H2701/1864 , B65H2701/20
摘要： Disclosed herein is a slitter. The slitter according to the exemplary embodiment of the present invention includes an unwinding part from which an insulating film is consecutively taken out; a plurality of transfer rollers that transfer the insulating film supplied from the unwinding part in one direction; a wheel knife that senses an air pocket formed on the insulating film taken out from the unwinding part to form fine holes on the insulating film; a cutter that is disposed between the transfer rollers and cuts, at a predetermined interval, the insulating film transferred in one direction through the transfer roller; and a winding part individually winding the insulating film divided at a predetermined interval by the cutter.
摘要翻译：本文公开了一种分切机。根据本发明的示例性实施例的分切机包括：连续取出绝缘膜的退绕部; 多个转印辊，其从一个方向转印从退绕部供给的绝缘膜; 感测从所述退绕部取出的绝缘膜上形成的空气袋的轮刮刀，在所述绝缘膜上形成细孔; 以预定间隔设置在转印辊和切口之间的切割器，所述绝缘膜沿一个方向通过转印辊转印; 以及通过切割器以预定的间隔分开地卷绕绝缘膜的绕组部分。

4. 发明申请

US20110200753A1 APPARATUS AND METHOD FOR MANUFACTURING SUBSTRATE 审中-公开
标题翻译：用于制造基板的装置和方法
公开(公告)号：US20110200753A1
公开(公告)日：2011-08-18
申请号：US12762924
申请日：2010-04-19
申请人： Dong Joo Shin , Choon Keun Lee , Sung Taek Lim
发明人： Dong Joo Shin , Choon Keun Lee , Sung Taek Lim
IPC分类号： B05D3/12 , B05C11/00
CPC分类号： B05D3/002 , H01L21/67109 , H01L21/6776 , H05K3/022 , H05K3/146 , H05K3/381 , H05K2203/085 , H05K2203/1545
摘要： Disclosed herein is an apparatus for manufacturing a substrate, including: a first chamber supplying an insulation layer; a second chamber including a roughening roller roughening at least one side of the insulation layer supplied from the first chamber, an evaporator depositing a metal layer on the roughened insulation layer, and a pressing roller pressing the insulation layer and the metal layer; and a third chamber storing the insulation layer including the metal layer formed thereon, the insulation layer being taken out from the second chamber. The apparatus for manufacturing a substrate is advantageous in that substrates are continuously produced, thus increasing the productivity of the substrates and preventing the substrates from being contaminated by the air.
摘要翻译：本文公开了一种用于制造衬底的装置，包括：提供绝缘层的第一腔室; 第二室，包括使从第一室供应的绝缘层的至少一侧粗糙化的粗糙化辊;在粗糙化绝缘层上沉积金属层的蒸发器;以及按压绝缘层和金属层的加压辊; 以及第三室，存储包括形成在其上的金属层的绝缘层，绝缘层从第二室取出。用于制造基板的装置的优点在于，连续地生产基板，从而提高基板的生产率并防止基板被空气污染。

5. 发明申请

US20090219671A1 COATING SOLUTION FOR FORMING HIGH DIELECTRIC CONSTANT THIN FILM AND METHOD FOR FORMING DIELECTRIC THIN FILM USING THE SAME 失效
标题翻译：用于形成高介电常数薄膜的涂料溶液和使用其形成介电薄膜的方法
公开(公告)号：US20090219671A1
公开(公告)日：2009-09-03
申请号：US12437657
申请日：2009-05-08
申请人： Jun Hee BAE , Seung Hyun Kim , Yul Kyo Chung , Won Hoon Song , Sung Taek Lim , Hyun Ju Jin
发明人： Jun Hee BAE , Seung Hyun Kim , Yul Kyo Chung , Won Hoon Song , Sung Taek Lim , Hyun Ju Jin
IPC分类号： H01G4/10 , B05D5/12 , H01L29/12
CPC分类号： H01L21/02282 , H01G4/1218 , H01G4/33 , H01L21/02186 , H01L21/316 , H05K1/162 , H05K2201/0175 , H05K2201/0179
摘要： Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.
摘要翻译：本文公开了用于形成电介质薄膜的涂布溶液和使用该涂布溶液形成电介质薄膜的方法。涂布溶液包含钛醇盐，β-二酮或其衍生物，以及具有给电子基团的苯甲酸衍生物。该方法包括将涂布溶液旋涂在基材上以形成薄膜，并在低温下干燥薄膜以使薄膜结晶。含钛涂层溶液高度稳定。此外，涂布溶液能够形成薄膜，而不管基板的种类如何，并且可以用于在PCB的生产过程中以在线模式形成电介质薄膜。

6. 发明申请

US20080100986A1 Capacitor embedded printed circuit board and manufacturing method thereof 审中-公开
标题翻译：电容器嵌入式印刷电路板及其制造方法
公开(公告)号：US20080100986A1
公开(公告)日：2008-05-01
申请号：US11907563
申请日：2007-10-15
申请人： Seung Hyun Sohn , Yul Kyo Chung , Sung Taek Lim , Hyung Mi Jung
发明人： Seung Hyun Sohn , Yul Kyo Chung , Sung Taek Lim , Hyung Mi Jung
IPC分类号： H01G4/00 , H01L21/20
CPC分类号： H01G4/33 , H01G4/228 , H05K1/162 , H05K3/388 , H05K3/4069 , H05K3/4652 , H05K2201/0179 , H05K2201/035 , H05K2201/09509 , H05K2201/09763
摘要： Provided is a method of manufacturing a capacitor embedded printed circuit board. In the method, a laminated body is prepared, including a laminated plate having first and second copper films on both sides thereof, where at least one bottom electrode is provided on at least one side. A dielectric layer is formed on the at least one bottom electrode. A metal layer is formed on a top surface of the dielectric layer where a capacitor is to be formed. A conductive paste layer is formed on at least one region of a top surface of the metal layer, where the conductive paste layer and the metal layer is provided as a top electrode. An insulation resin layers are formed on both sides of the laminated plate, respectively. A conductive via is formed in the insulation resin layer such that it is connected to the conductive paste layer.
摘要翻译：提供一种制造电容器嵌入式印刷电路板的方法。在该方法中，制备层压体，其包括其两侧具有第一和第二铜膜的层压板，其中在至少一侧上设置有至少一个底部电极。在所述至少一个底部电极上形成介电层。在要形成电容器的电介质层的顶表面上形成金属层。在金属层的顶表面的至少一个区域上形成导电浆料层，其中导电浆料层和金属层设置为顶部电极。绝缘树脂层分别形成在层压板的两侧。导电通孔形成在绝缘树脂层中，使其与导电糊层连接。

7. 发明授权

US07887879B2 Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same 失效
公开(公告)号：US07887879B2
公开(公告)日：2011-02-15
申请号：US12437672
申请日：2009-05-08
申请人： Jun Hee Bae , Seung Hyun Kim , Yul Kyo Chung , Won Hoon Song , Sung Taek Lim , Hyun Ju Jin
发明人： Jun Hee Bae , Seung Hyun Kim , Yul Kyo Chung , Won Hoon Song , Sung Taek Lim , Hyun Ju Jin
IPC分类号： B05D3/12 , B05D1/40 , B05D5/12
CPC分类号： H01L21/02282 , H01G4/1218 , H01G4/33 , H01L21/02186 , H01L21/316 , H05K1/162 , H05K2201/0175 , H05K2201/0179
摘要： Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.

8. 发明授权

US07540913B2 Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same 失效
标题翻译：用于形成高介电常数薄膜的涂布溶液及使用其形成介电薄膜的方法
公开(公告)号：US07540913B2
公开(公告)日：2009-06-02
申请号：US11541673
申请日：2006-10-03
申请人： Jun Hee Bae , Seung Hyun Kim , Yul Kyo Chung , Won Hoon Song , Sung Taek Lim , Hyun Ju Jin
发明人： Jun Hee Bae , Seung Hyun Kim , Yul Kyo Chung , Won Hoon Song , Sung Taek Lim , Hyun Ju Jin
IPC分类号： C09D185/00
CPC分类号： H01L21/02282 , H01G4/1218 , H01G4/33 , H01L21/02186 , H01L21/316 , H05K1/162 , H05K2201/0175 , H05K2201/0179
摘要： Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.
摘要翻译：本文公开了用于形成电介质薄膜的涂布溶液和使用该涂布溶液形成电介质薄膜的方法。涂布溶液包含钛醇盐，β-二酮或其衍生物，以及具有给电子基团的苯甲酸衍生物。该方法包括将涂布溶液旋涂在基材上以形成薄膜，并在低温下干燥薄膜以使薄膜结晶。含钛涂层溶液高度稳定。此外，涂布溶液能够形成薄膜，而不管基板的种类如何，并且可以用于在PCB的生产过程中以在线模式形成电介质薄膜。

9. 发明授权

US07417870B2 Multi-layer board with decoupling function 有权
标题翻译：多层板具有去耦功能
公开(公告)号：US07417870B2
公开(公告)日：2008-08-26
申请号：US11709156
申请日：2007-02-22
申请人： Sung Taek Lim , Yul Kyo Chung
发明人： Sung Taek Lim , Yul Kyo Chung
IPC分类号： H05K1/18
CPC分类号： H05K1/0231 , H01L2924/15311 , H05K1/162 , H05K1/185 , H05K2201/0179 , H05K2201/09509 , H05K2201/10636 , H05K2201/10643 , H05K2201/10734 , Y02P70/611
摘要： A multi-layer board having a superior decoupling function in a low frequency band and a radio frequency band. The multi-layer board includes a board body having a plurality of stacked dielectric layers, power terminals connected through a via, ground terminals connected through a via and an integrated circuit component connected to the power and ground terminals. The multi-layer board also includes a power line unit connected to the power terminals and the integrated circuit component and a ground line unit connected to the ground terminals and the integrated circuit component. The multi-layer board further includes at least one multilayer chip capacitor mounted on the board body and connected between the power terminal and the ground terminal formed on the board body and at least one thin film capacitor mounted inside the board body and connected between the power line unit and the ground line unit.
摘要翻译：一种在低频带和无线电频带中具有优异的去耦功能的多层板。多层板包括具有多层堆叠电介质层的电路板，通过通孔连接的电源端子，通过通孔连接的接地端子和连接到电源接地端子的集成电路部件。多层板还包括连接到电源端子和集成电路部件的电力线单元和连接到接地端子和集成电路部件的接地线单元。多层板还包括安装在板体上并连接在电源端子和形成在电路板主体上的接地端子之间的至少一个多层片式电容器，以及安装在电路板主体内并连接在电源之间的至少一个薄膜电容器线路单元和地线单元。

10. 发明申请

US20070194876A1 Multi-layer board with decoupling function 有权
标题翻译：多层板具有去耦功能
公开(公告)号：US20070194876A1
公开(公告)日：2007-08-23
申请号：US11709156
申请日：2007-02-22
申请人： Sung Taek Lim , Yul Kyo Chung
发明人： Sung Taek Lim , Yul Kyo Chung
IPC分类号： H01F27/28
CPC分类号： H05K1/0231 , H01L2924/15311 , H05K1/162 , H05K1/185 , H05K2201/0179 , H05K2201/09509 , H05K2201/10636 , H05K2201/10643 , H05K2201/10734 , Y02P70/611
摘要： A multi-layer board having a superior decoupling function in a low frequency band and a radio frequency band. The multi-layer board includes a board body having a plurality of stacked dielectric layers, power terminals connected through a via, ground terminals connected through a via and an integrated circuit component connected to the power and ground terminals. The multi-layer board also includes a power line unit connected to the power terminals and the integrated circuit component and a ground line unit connected to the ground terminals and the integrated circuit component. The multi-layer board further includes at least one multilayer chip capacitor mounted on the board body and connected between the power terminal and the ground terminal formed on the board body and at least one thin film capacitor mounted inside the board body and connected between the power line unit and the ground line unit.
摘要翻译：一种在低频带和无线电频带中具有优异的去耦功能的多层板。多层板包括具有多层堆叠电介质层的电路板，通过通孔连接的电源端子，通过通孔连接的接地端子和连接到电源接地端子的集成电路部件。多层板还包括连接到电源端子和集成电路部件的电力线单元和连接到接地端子和集成电路部件的接地线单元。多层板还包括安装在板体上并连接在电源端子和形成在电路板主体上的接地端子之间的至少一个多层片式电容器，以及安装在电路板主体内并连接在电源之间的至少一个薄膜电容器线路单元和地线单元。

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