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1. 发明公开

EP3065523A4 LEAD WIRE CUT-AND-CLINCH DEVICE 审中-公开
标题翻译： CUT-AND-CLINCH VORRICHTUNGFÜRZULEITUNGSDRAHT
公开(公告)号：EP3065523A4
公开(公告)日：2017-05-17
申请号：EP13896709
申请日：2013-10-28
申请人： FUJI MACHINE MFG
发明人： ASAO KANAME , DEGURA KAZUYA , MIZUNO YASUNARI , HIGASHI TOSHIMI
IPC分类号： H05K13/04 , H05K13/08
CPC分类号： H05K13/0473 , H05K13/08 , Y10T29/4913 , Y10T29/49139 , Y10T29/4914 , Y10T29/53174
摘要： Whether or not a lead wire has been normally cut and clinched can be reliably detected. A contact pipe is arranged in lead wire insertion holes of a pair of fixed pawls in a state of being electrically insulated from the fixed pawls. In a case where the lead wire is shorter than a set length after the lead wire is inserted into the lead wire insertion holes, a clearance of the pair of lead wire insertion holes is widened by a set amount in the event of outward bending of the lead wire and is narrowed by a set amount in the event of inward bending (S4). A cut-and-clinch operation is performed with S4 bypassed in a case where the length of the lead wire is at least the set length (S5) . In any case, if conduction between the fixed pawl and the contact pipe by the lead wire is detected in both of the fixed pawls in any of S2 to S5, the lead wire insertion is determined to have been normally performed (S6) and a transition to the next operation is made (S7). In the event of no conduction detection, an abnormality is determined and an electronic-circuit-component mounting machine is stopped (S8).
摘要翻译：能够可靠地检测出导线是否正常切断并紧固。接触管以与固定爪电绝缘的状态布置在一对固定爪的引线插入孔中。在引线插入引线插入孔之后引线短于设定长度的情况下，如果引线插入孔向外弯曲，则一对引线插入孔的间隙扩大设定量引线并在向内弯曲时缩小一定量（S4）。在导线的长度至少为设定长度的情况下（S5），在S4中进行切断和敲弯操作。在任何情况下，如果在S2至S5中的任一个中的两个固定爪中检测到固定爪与接触管之间由导线引起的导通，则确定导线插入已被正常执行（S6）进行下一个操作（S7）。在不导通检测的情况下，确定异常并且电子电路元件安装机停止（S8）。

2. 发明公开

EP3107623A1 FILTERED FEEDTHROUGH ASSEMBLY FOR IMPLANTABLE MEDICAL ELECTRONIC DEVICES 审中-公开
标题翻译： GEFILTERTEDURCHFÜHRUNGSANORDNUNGFÜRIMPLANTIERBARE MEDISINISCHE ELEKTRONISCHE VORRICHTUNGEN
公开(公告)号：EP3107623A1
公开(公告)日：2016-12-28
申请号：EP15707517.7
申请日：2015-02-20
申请人： Cardiac Pacemakers, Inc.
发明人： BARRY, Patrick J. , WHITE, Randy , GIESE, Troy A. , BLOOD, James E. , LYDEN, Michael J. , MOHN, Robert M.
IPC分类号： A61N1/375
CPC分类号： H05K1/0231 , A61N1/08 , A61N1/086 , A61N1/3754 , H05K1/115 , H05K1/181 , H05K3/10 , H05K3/32 , H05K3/4038 , H05K5/0247 , H05K5/04 , H05K2201/10015 , Y10T29/49139
摘要： A filtered feedthrough assembly for an implantable medical device includes a ferrule, an electrical insulator coupled to the ferrule by a connection element, a plurality of feedthrough conductors extending through the electrical insulator, a printed circuit board (PCB), and a plurality of capacitors. The PCB is coupled to the ferrule or the electrical insulator, and includes one or more ground layers and a plurality of vias. The connection element is electrically coupled to the ground layer through the vias. The capacitor has a ground terminal electrically coupled to the ground layer through at least one of the vias, and a conductor terminal electrically coupled to the feedthrough conductor.
摘要翻译：用于可植入医疗装置的经滤波的馈通组件包括套圈，通过连接元件耦合到套圈的电绝缘体，延伸穿过电绝缘体的多个馈通导体，印刷电路板（PCB）和多个电容器。 PCB耦合到套圈或电绝缘体，并且包括一个或多个接地层和多个通孔。连接元件通过通孔电耦合到接地层。电容器具有通过至少一个通孔电耦合到接地层的接地端子，以及电耦合到馈通导体的导体端子。

3. 发明公开

EP2987118A1 DUAL INTERFACE MODULE AND DUAL INTERFACE CARD HAVING A DUAL INTERFACE MODULE MANUFACTURED USING LASER WELDING 审中-公开
标题翻译： DOPPELSCHNITTSTELLENMODUL UND DOPPELSCHNITTSTELLENKARTE MIT DOPPELSCHNITTSTELLENMODUL，HERGESTELLT DURCH LASERSCHWISSEN
公开(公告)号：EP2987118A1
公开(公告)日：2016-02-24
申请号：EP14784718.0
申请日：2014-04-16
申请人： Identive Group, Inc.
发明人： VOGT, Werner
IPC分类号： G06K19/06
CPC分类号： H05K1/112 , G06K19/07775 , H01L2224/48091 , H01L2224/48227 , H05K1/113 , H05K3/328 , H05K2201/10098 , H05K2201/10674 , Y10T29/49018 , Y10T29/49139 , H01L2924/00014
摘要： A dual interface module comprises a substrate layer having at least two first through-holes, two contact pads on a first side of the substrate, at least two connection pads on a second side of the substrate, at least one electronic element on the second side of the substrate, an antenna pad comprising an antenna on the second side of the substrate, at least two first connection elements in the first through-holes, each first element electrically connecting one of the contact pads with one of the connection pads, at least two second connection elements, each second element electrically connecting one of the connection pads with the electronic element, and two third connection elements, each third element electrically connecting the electronic element with the antenna pad. The module can be arranged on a plastic card body or in a cavity in a plastic card body to form a dual interface card.
摘要翻译：描述了双接口模块及其制造方法。衬底层设置有至少一个双接口部分。在每个双界面部分中在基板中形成至少两个第一通孔。第一连接元件布置在每个第一通孔中。每个第一连接元件连接到布置在基板的第一侧上的接触焊盘。每个第一连接元件连接到布置在基板的第二侧上的连接焊盘。在每个双接口部分中，至少一个电子元件布置在衬底的第二侧上。在每个双接口部分中的基板中形成两个第二通孔。具有第一侧和第二侧的两个焊盘布置在衬底层的第二侧上。

4. 发明公开

EP2816877A1 Guarded printed circuit board islands 审中-公开
标题翻译： GeschützteLeiterplatteninseln
公开(公告)号：EP2816877A1
公开(公告)日：2014-12-24
申请号：EP14172907.9
申请日：2014-06-18
申请人： Keithley Instruments, Inc.
发明人： Niemann, James , Sobolewski, Gregory , Rice, Martin , Goeke, Wayne
IPC分类号： H05K1/02 , H05K1/14
CPC分类号： H05K1/0213 , H05K1/0225 , H05K1/0256 , H05K1/142 , H05K1/145 , H05K3/306 , H05K3/4038 , H05K3/4697 , H05K2201/0792 , H05K2201/09063 , H05K2201/093 , H05K2201/09618 , H05K2201/0969 , H05K2201/09981 , Y10T29/49139
摘要： A device with low dielectric absorption includes a printed circuit board (PCB) (300), a component connection area (302) including a first conductor (310) layered on a top surface of the component connection area and a second conductor (316) layered on a bottom surface of the component connection area, an aperture (304) surrounding the component connection area, a low-leakage component (306, 308) connecting the component connection area to the PCB across the aperture, and a guard (314, 318) composed of a third conductor (314) at least substantially surrounding the aperture on a top surface of the PCB and a fourth conductor (318) at least substantially surrounding the aperture on a bottom surface of the PCB.
摘要翻译：具有低介电吸收率的器件包括印刷电路板（PCB）（300），包括层叠在部件连接区域的顶表面上的第一导体（310）和第二导体（316）的部件连接区域（302）在所述部件连接区域的底表面上，围绕所述部件连接区域的孔（304），将所述部件连接区域连接到穿过所述孔的所述PCB的低泄漏部件（306,308）以及防护件（314,318 ），其由至少基本上围绕所述PCB的顶表面上的所述孔的第三导体（314）和至少基本上围绕所述PCB的底表面上的所述孔的第四导体（318）组成。

5. 发明公开

EP2768291A1 Component built-in board and method of manufacturing the same, and mounting body 有权
标题翻译：面板与用于制备内置组件和处理物，以及在安装体
公开(公告)号：EP2768291A1
公开(公告)日：2014-08-20
申请号：EP14155680.3
申请日：2014-02-19
申请人： FUJIKURA LTD.
发明人： Munakata, Koji , Hitaka, Shin
IPC分类号： H05K1/18 , H05K3/46
CPC分类号： H05K1/186 , H01L24/19 , H01L2224/0401 , H01L2224/04105 , H01L2224/16225 , H01L2924/12042 , H01L2924/1531 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H05K1/185 , H05K3/32 , H05K3/46 , H05K3/4673 , Y10T29/49139 , H01L2924/00
摘要： A component built-in board(1) of multi-layer structure that has a plurality of unit boards stacked therein and is configured having a plurality of electronic components (90) built in thereto in a stacking direction, wherein the plurality of unit boards include : a double-sided board (10) that includes a first insulating layer(11), a first wiring layer (12) formed on both surfaces of the first insulating layer (11), and a first interlayer conductive layer(13) that penetrates the first insulating layer (11) and is connected to the first wiring layer(12), and that comprises an opening(19) in which the electronic component (90) is housed; and an intermediate board (20) that includes a second insulating layer (21), a first adhesive layer(22) provided on both surfaces of the second insulating layer(21), and a second interlayer conductive layer(23) that penetrates the second insulating layer (21) along with the firstadhesive layer(22), and the double-sided board (10) is disposed in each of a layer above and a layer below the intermediate board(20).

6. 发明授权

EP2232644B1 SEALED PIN HEADER, PIN HEADER CONTACT PIN AND METHOD FOR PROVIDING A SEALED ELECTRICAL CONNECTION BETWEEN ELECTRONIC DEVICES 有权
标题翻译：密封端子销头部件连接销头部部接触连接销AND METHOD FOR PROVIDING ELECTRONIC安排之间的密封电气连接
公开(公告)号：EP2232644B1
公开(公告)日：2014-08-20
申请号：EP07870488.9
申请日：2007-12-19
申请人： Delphi International Operations Luxembourg S.à r.l.
发明人： SANDER, Reinhard
IPC分类号： H01R12/58 , H01R13/03 , H01R13/52
CPC分类号： H01R12/585 , H01R12/58 , H01R13/03 , H01R13/521 , Y10T29/49139

7. 发明公开

EP2555238A4 MULTICHIP MODULE, PRINTED WIRING BOARD UNIT, METHOD FOR MANUFACTURING MULTICHIP MODULE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD UNIT 审中-公开
标题翻译：多芯片组件，PCB，METHOD FOR多芯片组件及其制造方法的的电路板的生产
公开(公告)号：EP2555238A4
公开(公告)日：2013-06-12
申请号：EP10848956
申请日：2010-03-31
申请人： FUJITSU LTD
发明人： FUKUZONO KENJI
IPC分类号： H01L25/065 , H01L25/07 , H01L25/10 , H01L25/11 , H01L25/18 , H05K1/02
CPC分类号： H01L23/4006 , H01L23/13 , H01L23/36 , H01L25/18 , H01L2023/4037 , H01L2023/4062 , H01L2224/16225 , H01L2224/16235 , H01L2224/17181 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06589 , H01L2924/15192 , H01L2924/15311 , H05K1/0209 , H05K1/021 , H05K1/141 , H05K3/0061 , H05K2201/09054 , Y10T29/49139 , H01L2924/00
摘要： A multichip module includes an arithmetic element that is a semiconductor element that executes arithmetic processing and a memory element that is arranged opposite the arithmetic element and that is a semiconductor element that stores therein data. Then, the multichip module includes the arithmetic element mounted thereon and includes a package board that includes, on a surface on which the arithmetic element is mounted, an external terminal that connects another part. Furthermore, the multichip module includes a reinforcing part on a surface at the opposite side from the surface of the package board on which the external terminal and that is arranged such that the reinforcing part covers an area from outside the peripheral portion of the arithmetic element to a predetermined position located on the central side of the package board.

8. 发明公开

EP2560467A1 Method for mounting a component to an electric circuit board, electric circuit board and electric circuit board arrangement 审中-公开
标题翻译：用于安装在电动印刷电路板上的部件的方法，电印刷电路板和电路板组件
公开(公告)号：EP2560467A1
公开(公告)日：2013-02-20
申请号：EP12177850.0
申请日：2012-07-25
申请人： BIOTRONIK SE & Co. KG
发明人： Primavera, Anthony A.
IPC分类号： H05K1/18 , H05K1/11 , H05K1/14 , H05K3/36
CPC分类号： H05K1/183 , H05K1/116 , H05K1/144 , H05K1/145 , H05K3/0044 , H05K3/368 , H05K2201/041 , H05K2201/09572 , H05K2201/09645 , H05K2201/10303 , H05K2201/10454 , H05K2201/10515 , H05K2203/0228 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144
摘要： The invention pertains to a method for mounting a component (50) to an electric circuit board (10), comprising the steps:
- providing at least one cavity (40) in the electric circuit board (10, 100);
- arranging the component (50) in the cavity (40);
- generating in the at least one cavity (40) mechanical and/or electrical connections simultaneously to at least two locations of the component (50).
The invention also pertains to a method for making an electric circuit board arrangement (200) comprising at least one electric circuit board (300, 400, 500), comprising the steps:
- providing at least one cavity (340, 440, 540) and/or through-hole (320, 420, 520) in the at least one electric circuit board (300, 400, 500);
- arranging the component (50) in the at least one cavity (340, 440) and/or in a through-hole (320, 420) being mechanically and/or electrically connectable by contact in the at least one cavity (340, 440) and/or through-hole (320, 420) and
- stacking one or more electric circuit boards (400, 500) on top of the at least one electric circuit board (300) and coupling the electric circuit boards (300, 400, 500) by solderable terminal pads (52, 54) of the component (50).
摘要翻译：本发明涉及一种用于在电路板（10）的部件（50）安装到包括以下步骤： - 在所述电路板（10，100）提供至少一个空腔（40）; - 在空腔布置部件（50）（40）; - 发生在所述至少一个空腔（40）的机械和/或电连接的同时与组分（50）的至少两个位置。因此，本发明涉及一种用于制造电路板装置（200），包括至少一个电路板（300，400，500）的方法，包括以下步骤： - 提供至少一个腔体（340，440，540）和 /或通孔中的至少一个电路板（300，400，500）（320，420，520）; - 布置在所述至少一个空腔中的成分（50）（340，440）和/或通孔（320，420）被机械地和/或电连接通过在所述至少一个腔体（440接触340，）和/或通孔（320，420），以及 - 叠加在所述至少一个电路板（300）的顶部上的一个或多个电路板（400,500），以及将所述电路板（300，400， 500）由组件（50）的可焊接端子焊盘（52，54）。

9. 发明公开

EP2406648A1 OBERFLÄCHENMONTIERBARER MAGNETFELDSENSOR MIT EINEM HALBLEITERCHIP UND VERFAHREN ZUR HERSTELLUNG EINER SCHALTUNGSPLATINE MIT EINEM MAGNETFELDSENSOR 有权
标题翻译：表面半导体芯片和方法安装磁性传感器用于生产电路板，磁性传感器
公开(公告)号：EP2406648A1
公开(公告)日：2012-01-18
申请号：EP10711173.4
申请日：2010-03-05
申请人： Conti Temic Microelectronic GmbH
发明人： FLOCK, Stefan , KRELLA, Uwe , STEGER, Jürgen
IPC分类号： G01R33/09 , G01R33/00
CPC分类号： G01R33/0047 , G01R33/0052 , G01R33/091 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , Y10T29/49139 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a surface-mountable magnetic field sensor (1) comprising a semiconductor chip (4), to a magnetic field measuring device (30), and to a method for producing and populating a circuit board (24) having a magnetic field sensor (1). The magnetic field sensor (1) comprises a semiconductor chip (4), which is arranged on a flat-conductor substrate (5). At least three flat-conductor electrodes (6 to 9), which protrude out of a plastic housing side (10), are electrically connected to the semiconductor chip (4). The flat-conductor substrate (5) and the semiconductor chip (4) are embedded in a plastic housing (11). The plastic housing (11) can be inserted with the embedded semiconductor chip (4) into a magnetic field gap (12), with the flat-conductor electrodes (6 to 9) protruding, wherein the flat-conductor electrodes (6 to 9) comprise bends (13 to 16) at a distance from the plastic housing side (10), the bends being surface-mountable on a circuit board (24).

10. 发明授权

EP1277243B1 PIEZOKERAMISCHER MEHRSCHICHTBAUTEIL FÜR MESSGERÄTE SOWIE DESSEN HERSTELLUNGSVERFAHREN 有权
标题翻译：压电陶瓷复合材料部件，用于测量及其制造方法
公开(公告)号：EP1277243B1
公开(公告)日：2012-01-04
申请号：EP00958371.7
申请日：2000-08-03
申请人： Endress + Hauser GmbH + Co. KG
发明人： LOPATIN, Sergej , GETMAN, Igor , PANITCH, Anatoliy , WUSEWKER, Yuriy
IPC分类号： H01L41/083 , H01L41/047 , G01F23/296 , G01P15/09
CPC分类号： G01F23/2968 , G01P15/09 , H01L41/0472 , H01L41/0835 , H01L41/1132 , Y10T29/42 , Y10T29/49128 , Y10T29/4913 , Y10T29/49135 , Y10T29/49139 , Y10T29/49146 , Y10T29/49165 , Y10T29/49798
摘要： The invention relates to an electromechanical drive or a sensor element comprised of stacked piezoelectric elements. The drive or sensor element is provided for measuring instruments and also operates at very high temperatures. To this end, the novel drive or sensor element (10) comprises several piezoelectric ceramic layers (12a - f), whereby each electrode layer (16a - e) is arranged between the two facing surfaces of each set of directly adjacent piezoelectric ceramic layers. Wire-shaped connectors (18 a - b), which are provided for electrically contacting the electrode layers (16a - e) and which lead out of said electrode layers (16a - e), extend inside grooves (14a - d) located in the electrode layers (16a - e).

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