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    • 91. 发明申请
    • Apparatus and method for directing gas towards a specimen
    • 用于将气体引向试样的装置和方法
    • US20050199806A1
    • 2005-09-15
    • US10799145
    • 2004-03-12
    • Hagay CafriEitan Pinhasi
    • Hagay CafriEitan Pinhasi
    • H01J37/02H01J37/28H01J37/305H01J37/32
    • H01J37/28H01J37/026H01J37/3056H01J2237/006H01J2237/0213H01J2237/31744
    • The invention provides an apparatus and a method for directing gas towards a specimen, said apparatus includes: (i) means for directing a beam of charged particles towards the specimen; and (ii) a gas conduit providing gas to an area of incidence of said beam of charged particles onto said specimen. The gas conduit includes an intermediate portion having a first end for receiving the inert gas and a substantially sealed second end. The intermediate portion has a first and second apertures that are positioned such as to define a space through which the beam of charged particles can propagate. The intermediate portion is shaped such as to allow a first portion of the inert gas to exit the second aperture and to allow a second portion of the gas to propagate towards the second end and to be returned through the second aperture.
    • 本发明提供了一种用于将气体引导到试样的装置和方法,所述装置包括:(i)用于将带电粒子束引向样品的装置; 和(ii)气体导管,其向所述样品上的所述带电粒子束的入射区域提供气体。 气体导管包括具有用于接收惰性气体的第一端和基本密封的第二端的中间部分。 中间部分具有第一和第二孔,所述第一和第二孔被定位成限定了带电粒子束可以传播的空间。 中间部分成形为允许惰性气体的第一部分离开第二孔,并允许气体的第二部分朝向第二端传播并通过第二孔返回。
    • 95. 发明授权
    • System and method for process variation monitor
    • 过程变化监控系统和方法
    • US06862491B2
    • 2005-03-01
    • US10155255
    • 2002-05-22
    • Evgeni LevinGilad AlmogyEfrat Rozenman
    • Evgeni LevinGilad AlmogyEfrat Rozenman
    • G01N21/956G01N21/95G06T7/00H01L21/66G06F19/00
    • G06T7/001G01N21/9501G01N21/956G01N21/95607G01N2021/8896G06T2207/30148Y10S430/146
    • A method to extend the process monitoring capabilities of a semiconductor wafer optical inspection system so as to be able to detect low-resolution effects of process variations over the surface of a wafer at much higher sensitivity than heretofore possible. The method consists, in essence, of grouping sensed pixels by geometric blocks over the inspected surface and comparing each block with a corresponding one from another die on the same wafer, from another wafer or from a stored model image. In one embodiment of the invention, pixel values are compared directly and differences are thresholded at a considerably lower level than during a defects detection process. In another embodiment, there is calculated a signature for each block, based on the sensed light intensity values, and corresponding signatures are compared.
    • 扩展半导体晶片光学检查系统的过程监控能力的方法,以便能够以比以前更高的灵敏度检测晶片表面上的工艺变化的低分辨率效应。 本方法基本上包括通过检查表面上的几何块对感测像素进行分组,并将每个块与来自另一个晶片上的另一个晶片的对应的一个块,从另一个晶片或从存储的模型图像进行比较。 在本发明的一个实施例中,像素值被直接比较,并且差异以比在缺陷检测处理期间低得多的阈值阈值化。 在另一个实施例中,基于感测的光强度值计算每个块的签名,并对相应的签名进行比较。
    • 97. 发明申请
    • Specimen current mapper
    • 样本电流映射器
    • US20040084622A1
    • 2004-05-06
    • US10695620
    • 2003-10-27
    • Applied Materials Israel Ltd
    • Alexander KadyshevitchDror ShemeshYaniv BramiDmitry Shur
    • H01J037/252G01N023/225
    • H01L22/34H01J37/32935H01J2237/281H01J2237/2815H01L21/67253H01L22/12H01L2924/3011
    • A method for process monitoring includes receiving a sample having a first layer that is at least partly conductive and a second layer formed over the first layer, following production of contact openings in the second layer. A beam of charged particles is directed along a beam axis that deviates substantially in angle from a normal to a surface of the sample, so as to irradiate one or more of the contact openings in each of a plurality of locations distributed over at least a region of the sample. A specimen current flowing through the first layer is measured in response to irradiation of the one or more of the contact openings at each of the plurality of locations. A map of at least the region of the sample is created, indicating the specimen current measured in response to the irradiation at the plurality of the locations.
    • 一种用于过程监测的方法包括在第二层中产生接触开口之后,接收具有至少部分导电的第一层的样品和在第一层上形成的第二层。 带电粒子束沿着光束轴线被引导,所述光束轴线基本上偏离于与样品表面的法线的角度,以便照射分布在至少一个区域上的多个位置中的每一个中的一个或多个接触开口 的样品。 响应于多个位置中的每一个处的一个或多个接触开口的照射来测量流过第一层的样本电流。 产生至少样品区域的图,指示响应于多个位置处的照射测量的样本电流。
    • 98. 发明申请
    • System and method for process variation monitor
    • 过程变化监控系统和方法
    • US20030219153A1
    • 2003-11-27
    • US10155255
    • 2002-05-22
    • Applied Materials Israel Ltd
    • Evgeni LevinGilad AlmogyEfrat Rozenman
    • G06K009/00
    • G06T7/001G01N21/9501G01N21/956G01N21/95607G01N2021/8896G06T2207/30148Y10S430/146
    • A method to extend the process monitoring capabilities of a semiconductor wafer optical inspection system so as to be able to detect low-resolution effects of process variations over the surface of a wafer at much higher sensitivity than heretofore possible. The method consists, in essence, of grouping sensed pixels by geometric blocks over the inspected surface and comparing each block with a corresponding one from another die on the same wafer, from another wafer or from a stored model image. In one embodiment of the invention, pixel values are compared directly and differences are thresholded at a considerably lower level than during a defects detection process. In another embodiment, there is calculated a signature for each block, based on the sensed light intensity values, and corresponding signatures are compared.
    • 扩展半导体晶片光学检查系统的过程监控能力的方法,以便能够以比以前更高的灵敏度检测晶片表面上的工艺变化的低分辨率效应。 本方法基本上包括通过检查表面上的几何块对感测像素进行分组,并将每个块与来自另一个晶片上的另一个晶片的对应的一个块,从另一个晶片或从存储的模型图像进行比较。 在本发明的一个实施例中,像素值被直接比较,并且差异以比在缺陷检测处理期间低得多的阈值阈值化。 在另一个实施例中,基于感测的光强度值计算每个块的签名,并对相应的签名进行比较。