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    • 92. 发明授权
    • Optimization of critical dimensions and pitch of patterned features in and above a substrate
    • 优化衬底中和图案上的图案特征的临界尺寸和间距
    • US08283706B2
    • 2012-10-09
    • US12136766
    • 2008-06-10
    • James M. CleevesRoy E. Scheuerlein
    • James M. CleevesRoy E. Scheuerlein
    • H01L29/80
    • H01L27/105H01L23/528H01L2924/0002H01L2924/00
    • A die is formed with different and optimized critical dimensions in different device levels and areas of those device levels using photolithography and etch techniques. One aspect of the invention provides for a memory array formed above a substrate, with driver circuitry formed in the substrate. A level of the memory array consists of, for example, parallel rails and a fan-out region. It is desirable to maximize density of the rails and minimize cost of lithography for the entire memory array. This can be achieved by forming the rails at a tighter pitch than the CMOS circuitry beneath it, allowing cheaper lithography tools to be used when forming the CMOS, and similarly by optimizing lithography and etch techniques for a device level to produce a tight pitch in the rails, and a more relaxed pitch in the less-critical fan-out region.
    • 在使用光刻和蚀刻技术的不同器件级别和那些器件级别的区域中,使用不同且优化的临界尺寸形成管芯。 本发明的一个方面提供了形成在衬底上的存储器阵列,其中驱动电路形成在衬底中。 存储器阵列的一个级别包括例如平行轨道和扇出区域。 希望使轨道的密度最大化并最小化整个存储器阵列的光刻成本。 这可以通过以比它下面的CMOS电路更紧的间距形成轨道来实现,从而允许在形成CMOS时使用更便宜的光刻工具,并且类似地通过优化用于器件级别的光刻和蚀刻技术以在 轨道,并且在不太关键的扇出区域更放松。
    • 96. 发明授权
    • Damascene method of making a nonvolatile memory device
    • 制作非易失性存储器件的镶嵌方法
    • US08222091B2
    • 2012-07-17
    • US13309857
    • 2011-12-02
    • Vinod Robert PurayathGeorge MatamisJames KaiTakashi Orimoto
    • Vinod Robert PurayathGeorge MatamisJames KaiTakashi Orimoto
    • H01L21/82
    • H01L27/101H01L27/1021
    • A method of making a device includes providing a first device level containing first semiconductor rails separated by first insulating features, forming a sacrificial layer over the first device level, patterning the sacrificial layer and the first semiconductor rails in the first device level to form a plurality of second rails extending in a second direction, wherein the plurality of second rails extend at least partially into the first device level and are separated from each other by rail shaped openings which extend at least partially into the first device level, forming second insulating features between the plurality of second rails, removing the sacrificial layer, and forming second semiconductor rails between the second insulating features in a second device level over the first device level. The first semiconductor rails extend in a first direction. The second semiconductor rails extend in the second direction different from the first direction.
    • 一种制造器件的方法包括提供包含由第一绝缘特征分开的第一半导体轨道的第一器件电平,在第一器件电平上形成牺牲层,在第一器件电平图形化牺牲层和第一半导体轨道以形成多个 的第二轨道,其沿着第二方向延伸,其中所述多个第二轨道至少部分地延伸到所述第一装置水平面并且通过至少部分地延伸到所述第一装置水平的轨道形开口彼此分开, 所述多个第二轨道,去除所述牺牲层,以及在所述第二设备水平上的第二设备水平的所述第二绝缘特征之间形成第二半导体轨道。 第一半导体轨道沿第一方向延伸。 第二半导体轨道沿与第一方向不同的第二方向延伸。
    • 97. 发明授权
    • Double patterning method
    • 双重图案化方法
    • US08178286B2
    • 2012-05-15
    • US13155754
    • 2011-06-08
    • Michael Chan
    • Michael Chan
    • G03F7/26
    • H01L21/0273H01L21/0331H01L21/3081H01L21/3086H01L21/31144H01L21/32139H01L27/101
    • A method of making a device includes forming a first photoresist layer over an underlying layer, patterning the first photoresist layer to form a first photoresist pattern comprising a first grid, rendering the first photoresist pattern insoluble to a solvent, forming a second photoresist layer over the first photoresist pattern, patterning the second photoresist layer to form a second photoresist pattern over the underlying layer, where the second photoresist pattern is a second grid which overlaps the first grid to form a photoresist web, and etching the underlying layer using the photoresist web as a mask.
    • 制造器件的方法包括在下层上形成第一光致抗蚀剂层,图案化第一光致抗蚀剂层以形成包括第一栅格的第一光致抗蚀剂图案,使第一光致抗蚀剂图案不溶于溶剂,在第 第一光致抗蚀剂图案,图案化第二光致抗蚀剂层以在下层上形成第二光致抗蚀剂图案,其中第二光致抗蚀剂图案是与第一栅格重叠以形成光致抗蚀剂幅材的第二栅格,并且使用光致抗蚀剂幅材蚀刻下层 一个面具
    • 99. 发明申请
    • DAMASCENE METHOD OF MAKING A NONVOLATILE MEMORY DEVICE
    • 制造非易失性存储器件的DAMASCENE方法
    • US20120077318A1
    • 2012-03-29
    • US13309857
    • 2011-12-02
    • Vinod Robert PURAYATHGeorge MATAMISJames KAITakashi ORIMOTO
    • Vinod Robert PURAYATHGeorge MATAMISJames KAITakashi ORIMOTO
    • H01L21/82
    • H01L27/101H01L27/1021
    • A method of making a device includes providing a first device level containing first semiconductor rails separated by first insulating features, forming a sacrificial layer over the first device level, patterning the sacrificial layer and the first semiconductor rails in the first device level to form a plurality of second rails extending in a second direction, wherein the plurality of second rails extend at least partially into the first device level and are separated from each other by rail shaped openings which extend at least partially into the first device level, forming second insulating features between the plurality of second rails, removing the sacrificial layer, and forming second semiconductor rails between the second insulating features in a second device level over the first device level. The first semiconductor rails extend in a first direction. The second semiconductor rails extend in the second direction different from the first direction.
    • 一种制造器件的方法包括提供包含由第一绝缘特征分开的第一半导体轨道的第一器件电平,在第一器件电平上形成牺牲层,在第一器件电平图形化牺牲层和第一半导体轨道以形成多个 的第二轨道,其沿着第二方向延伸,其中所述多个第二轨道至少部分地延伸到所述第一装置水平面并且通过至少部分地延伸到所述第一装置水平的轨道形开口彼此分开, 所述多个第二轨道,去除所述牺牲层,以及在所述第二设备水平上的第二设备水平的所述第二绝缘特征之间形成第二半导体轨道。 第一半导体轨道沿第一方向延伸。 第二半导体轨道沿与第一方向不同的第二方向延伸。