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11. 发明授权

US08063298B2 Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields 有权
标题翻译：形成具有相邻导热场的嵌入式热电冷却器的方法
公开(公告)号：US08063298B2
公开(公告)日：2011-11-22
申请号：US11563443
申请日：2006-11-27
申请人： David A. Koester , Randall G. Alley
发明人： David A. Koester , Randall G. Alley
IPC分类号： H01L35/02 , H01L35/34
CPC分类号： H01L35/34
摘要： A method of forming a thermoelectric device may include providing a substrate having a surface, and thermally coupling a thermoelectric p-n couple to a first portion of the surface of a substrate. Moreover, the thermoelectric p-n couple may include a p-type thermoelectric element and an n-type thermoelectric element. In addition, a thermally conductive field layer may be formed on a second portion of the surface of the substrate adjacent the first portion of the surface of the substrate. Related structures are also discussed.
摘要翻译：形成热电装置的方法可以包括提供具有表面的基板，并将热电p-n耦合热耦合到基板的表面的第一部分。此外，热电p-n耦合可以包括p型热电元件和n型热电元件。此外，导热场层可以形成在衬底表面的与衬底表面的第一部分相邻的第二部分上。还讨论了相关结构。

12. 发明授权

US07855397B2 Electronic assemblies providing active side heat pumping 有权
标题翻译：电子组件提供主动侧热泵
公开(公告)号：US07855397B2
公开(公告)日：2010-12-21
申请号：US12016720
申请日：2008-01-18
申请人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko von Windheim
发明人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko von Windheim
IPC分类号： H01L33/00 , H01L23/34 , H01L35/02 , H01L21/00
CPC分类号： H01L23/38 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L27/16 , H01L2224/0401 , H01L2224/05111 , H01L2224/05144 , H01L2224/05147 , H01L2224/05568 , H01L2224/05611 , H01L2224/05644 , H01L2224/06102 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16 , H01L2224/16235 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/0106 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/00014 , H01L2924/014 , H01L2224/13099 , H01L2924/00 , H01L2224/05552 , H01L2924/0105
摘要： An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate. Related methods and structures are also discussed.
摘要翻译：电子组件可以包括封装衬底，集成电路（IC）半导体芯片，多个金属互连结构和热电热泵。集成电路（IC）半导体芯片可以具有包括其上的输入/输出焊盘和与有源侧相反的背面的有源侧，并且IC半导体芯片可以布置成有效侧面向封装基板的第一表面。多个金属互连结构可以在IC半导体芯片的有源侧和封装基板的第一表面之间，并且多个金属互连结构可以在IC半导体芯片的有源侧和第一表面之间提供机械连接的包装基板。热电热泵可以耦合到封装衬底，热电热泵构造成主动地泵送IC半导体芯片和封装衬底之间的热量。还讨论了相关的方法和结构。

13. 发明授权

US07838759B2 Methods of forming thermoelectric devices including electrically insulating matrices between conductive traces 有权
标题翻译：在导电迹线之间形成包括电绝缘矩阵的热电装置的方法
公开(公告)号：US07838759B2
公开(公告)日：2010-11-23
申请号：US11472913
申请日：2006-06-22
申请人： Randall G. Alley , David A. Koester
发明人： Randall G. Alley , David A. Koester
IPC分类号： H01L35/10 , H01L35/34
CPC分类号： H01L35/10 , H01L35/08 , H01L35/32 , H01L35/34 , Y10T29/4913
摘要： A method of forming a thermoelectric device may include forming a pattern of conductive traces, and forming an electrically insulating matrix between the conductive traces of the pattern of conductive traces. In addition, a plurality of thermoelectric elements may be electrically and mechanically coupled to the pattern of conductive traces so that each conductive trace of the pattern of conductive traces has one of the plurality of thermoelectric elements thereon. In addition, the plurality of thermoelectric elements may be free of the electrically insulating matrix. Related methods and structures are also discussed.
摘要翻译：形成热电装置的方法可以包括形成导电迹线图案，以及在导电迹线图案的导电迹线之间形成电绝缘矩阵。此外，多个热电元件可以电连接和机械耦合到导电迹线图案，使得导电迹线图案的每个导电迹线都具有多个热电元件之一。另外，多个热电元件可以没有电绝缘基体。还讨论了相关的方法和结构。

14. 再颁专利

USRE41801E1 Thin-film thermoelectric device and fabrication method of same 失效
标题翻译：薄膜热电元件及其制造方法
公开(公告)号：USRE41801E1
公开(公告)日：2010-10-05
申请号：US10404144
申请日：1998-03-31
申请人： Rama Venkatasubramanian
发明人： Rama Venkatasubramanian
IPC分类号： H01L21/44
CPC分类号： B82Y10/00 , H01L35/08 , H01L35/30 , H01L35/32 , Y10S257/93
摘要： A termoelectric thermoelectric device and method for manufacturing the thermoelectric device. The thermoelectric thermoelectric device includes at least one deposited film of a thermoelectric material having opposed first and second major surfaces separated by a thickness of the at least one deposited film with the at least one deposited film being patterned to define a plurality of thermoelements arranged in a matrix pattern having rows of alternating conductivity type, a first header having formed thereon a first interconnecting member with the first header mounted on the first major surface of the deposited film such that the first interconnecting member is connected to one side of the plurality of thermoelements and connects adjacent thermoelements of an opposite conductivity type, and a second header having formed thereon a second interconnecting member with the second heads mounted on the second major surface of the deposited film such that the second interconnecting member is connected to an opposite side of said plurality of thermoelements and connects adjacent thermoelements of an opposite conductivity type.
摘要翻译：一种电动热电装置及其制造方法。所述热电热电装置包括至少一个热电材料沉积膜，所述热电材料具有相对的第一和第二主表面，所述相对的第一和第二主表面被所述至少一个沉积膜的厚度隔开，所述至少一个沉积膜被图案化以限定多个热电元件具有交替导电类型的行的矩阵图案;第一集管，其上形成有第一互连构件，其中第一集管安装在沉积膜的第一主表面上，使得第一互连构件连接到多个热电偶的一侧，连接相反导电类型的相邻热电元件，以及第二集管，其上形成有第二互连构件，其中第二头安装在沉积膜的第二主表面上，使得第二互连构件连接到所述多个热电偶并连接相邻的热电偶相反的导电类型。

15. 发明授权

US07679203B2 Methods of forming thermoelectric devices using islands of thermoelectric material and related structures 有权
标题翻译：使用热电材料岛和相关结构形成热电装置的方法
公开(公告)号：US07679203B2
公开(公告)日：2010-03-16
申请号：US11681303
申请日：2007-03-02
申请人： Jayesh Bharathan , David A. Koester , Randall G. Alley , Rama Venkatasubramanian , Pratima Addepalli , Bing Shen , Cynthia Watkins
发明人： Jayesh Bharathan , David A. Koester , Randall G. Alley , Rama Venkatasubramanian , Pratima Addepalli , Bing Shen , Cynthia Watkins
IPC分类号： H01L37/00
CPC分类号： H01L35/34 , H01L35/32 , Y10S257/93
摘要： A method of forming a thermoelectric device may include forming a plurality of islands of thermoelectric material on a deposition substrate. The plurality of islands of thermoelectric material may be bonded to a header substrate so that the plurality of islands are between the deposition substrate and the header substrate. More particularly, the islands of thermoelectric material may be epitaxial islands of thermoelectric material having crystal structures aligned with a crystal structure of the deposition substrate. Related structures are also discussed.
摘要翻译：形成热电装置的方法可以包括在沉积基板上形成多个热电材料岛。多个热电材料岛可以结合到集管基板，使得多个岛在沉积基板和集管基板之间。更具体地，热电材料岛可以是具有与沉积基板的晶体结构对准的晶体结构的热电材料的外延岛。还讨论了相关结构。

16. 发明授权

US07523617B2 Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics 有权
标题翻译：用于微处理器和其他电子设备热点热管理的薄膜热电装置
公开(公告)号：US07523617B2
公开(公告)日：2009-04-28
申请号：US10970378
申请日：2004-10-22
申请人： Rama Venkatasubramanian , Randall G. Alley , Pratima Addepalli , Anil J. Reddy , Edward P. Siivola , Brooks C. O'Quinn , Kip D. Coonley , John Posthill , Thomas Colpitts
发明人： Rama Venkatasubramanian , Randall G. Alley , Pratima Addepalli , Anil J. Reddy , Edward P. Siivola , Brooks C. O'Quinn , Kip D. Coonley , John Posthill , Thomas Colpitts
IPC分类号： F25B21/02 , F25D23/00 , F28D15/00 , H05K7/20
CPC分类号： F25B21/02 , F25B2321/003 , H01L35/30 , H01L2924/0002 , H01L2924/00
摘要： A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.
摘要翻译：一种用于控制固体介质中的发热装置的温度的结构，系统和方法，其中热量从所述介质提取到至少一个热提取装置中，所述热提取装置将热量散发到除了介质之外的环境中与散热装置热耦合的散热器; 并且来自介质的热量通过将散热器热耦合到介质的第一热界面材料散发到散热器中。

17. 发明申请

US20090072385A1 Electronic Assemblies Providing Active Side Heat Pumping and Related Methods and Structures 有权
标题翻译：提供有源侧热泵的电子组件及相关方法和结构
公开(公告)号：US20090072385A1
公开(公告)日：2009-03-19
申请号：US12016720
申请日：2008-01-18
申请人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko Von Windheim
发明人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko Von Windheim
IPC分类号： H01L23/38 , H01L21/58
CPC分类号： H01L23/38 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L27/16 , H01L2224/0401 , H01L2224/05111 , H01L2224/05144 , H01L2224/05147 , H01L2224/05568 , H01L2224/05611 , H01L2224/05644 , H01L2224/06102 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16 , H01L2224/16235 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/0106 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/00014 , H01L2924/014 , H01L2224/13099 , H01L2924/00 , H01L2224/05552 , H01L2924/0105
摘要： An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate. Related methods and structures are also discussed.
摘要翻译：电子组件可以包括封装衬底，集成电路（IC）半导体芯片，多个金属互连结构和热电热泵。集成电路（IC）半导体芯片可以具有包括其上的输入/输出焊盘和与有源侧相反的背面的有源侧，并且IC半导体芯片可以布置成有效侧面向封装基板的第一表面。多个金属互连结构可以在IC半导体芯片的有源侧和封装基板的第一表面之间，并且多个金属互连结构可以在IC半导体芯片的有源侧和第一表面之间提供机械连接的包装基板。热电热泵可以耦合到封装衬底，热电热泵构造成主动地泵送IC半导体芯片和封装衬底之间的热量。还讨论了相关的方法和结构。

18. 发明申请

US20080264464A1 Temperature Control Including Integrated Thermoelectric Sensing and Heat Pumping Devices and Related Methods and Systems 审中-公开
标题翻译：包括集成热电传感和热泵设备的温度控制及相关方法和系统
公开(公告)号：US20080264464A1
公开(公告)日：2008-10-30
申请号：US12166953
申请日：2008-07-02
申请人： SERI LEE , JESKO VON WINDHEIM , RAMASWAMY MAHADEVAN
发明人： SERI LEE , JESKO VON WINDHEIM , RAMASWAMY MAHADEVAN
IPC分类号： H01L35/34 , H01L35/28
CPC分类号： F25B21/02 , A61F7/007 , A61F2007/0075 , F25B2321/021 , H01L35/32
摘要： A temperature control system may include a thermoelectric device, and a controller electrically coupled to the thermoelectric device. The controller may be configured to apply an AC signal to the thermoelectric device, and to sense an electrical characteristic of the thermoelectric device using the AC signal. The controller may also be configured to generate an electrical control signal to pump heat through the thermoelectric device responsive to sensing the electrical characteristic of the thermoelectric device using the AC signal. Related methods are also discussed.
摘要翻译：温度控制系统可以包括热电装置和电耦合到热电装置的控制器。控制器可以被配置为向热电装置施加AC信号，并且使用AC信号感测热电装置的电特性。控制器还可以被配置为响应于使用AC信号感测热电装置的电特性而产生电控制信号以泵送通过热电装置的热量。还讨论了相关方法。

19. 发明授权

US07235735B2 Thermoelectric devices utilizing double-sided Peltier junctions and methods of making the devices 有权
标题翻译：利用双面珀尔帖接头的热电器件和制造器件的方法
公开(公告)号：US07235735B2
公开(公告)日：2007-06-26
申请号：US10413211
申请日：2003-04-15
申请人： Rama Venkatasubramanian , Edward P. Siivola
发明人： Rama Venkatasubramanian , Edward P. Siivola
IPC分类号： H01L35/04
CPC分类号： B82Y10/00 , H01L35/08 , H01L35/16 , H01L35/30 , H01L35/32
摘要： A thermoelectric device and method of manufacturing the device, where thermoelectric elements of opposite conductivity type are located on respective opposing sides of a heat source member. Heat sinks are disposed on opposite sides of the thermoelectric elements. Peltier metal contacts are positioned between the thermoelectric elements and each of the heat source member and heat sinks. A plurality of devices may be arranged together in a thermally parallel, electrically series arrangement, or in a thermally parallel, electrically parallel arrangement. The arrangement of the elements allow the direction of current flow through the pairs of elements to be substantially the same as the direction of current flow through the metal contacts.
摘要翻译：一种制造该器件的热电装置及其制造方法，其中相反导电类型的热电元件位于热源部件的相对侧上。散热器设置在热电元件的相对侧上。珀耳帖金属触点位于热电元件与热源元件和散热片之间。多个装置可以以热平行，电串联布置或热平行并联的方式布置在一起。这些元件的布置允许电流流过成对元件的方向与流过金属触点的电流方向基本相同。

20. 发明授权

US07838760B2 Trans-thermoelectric device 有权
标题翻译：跨热电器件
公开(公告)号：US07838760B2
公开(公告)日：2010-11-23
申请号：US10536463
申请日：2003-11-25
申请人： Rama Venkatasubramanian , Kip D. Coonley , Edward P. Siivola , Michael Puchan , Randall G. Alley , Pratima Addepalli , Brooks C. O'Quinn , Thomas Colpitts , Mary Napier
发明人： Rama Venkatasubramanian , Kip D. Coonley , Edward P. Siivola , Michael Puchan , Randall G. Alley , Pratima Addepalli , Brooks C. O'Quinn , Thomas Colpitts , Mary Napier
IPC分类号： H01L35/30 , F25B21/02
CPC分类号： B82Y10/00 , H01L35/16 , H01L35/30 , H01L35/32 , H01L2924/0002 , H01L2924/00
摘要： A thermoelectric device having at least one unipolar couple element (22) including two legs (22a) of a same electrical conductivity type. A first-temperature stage (24) is connected to one of the two legs. A second-temperature stage (28) is connected across the legs of the at least one unipolar couple element. A third-temperature stage (30) is connected to the other of the two legs. Methods for cooling an object and for thermoelectric power conversion utilize the at least one unipolar couple element to respectively cool an object and produce electrical power.
摘要翻译：一种具有至少一个单极耦合元件（22）的热电器件，其包括具有相同导电类型的两个支脚（22a）。第一温度级（24）连接到两条腿之一。第二温度级（28）跨越至少一个单极耦合元件的腿连接。第三温度台（30）连接到两条腿中的另一条。用于冷却物体和用于热电功率转换的方法利用至少一个单极耦合元件来分别冷却物体并产生电力。

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