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11. 发明授权

US07358751B2 Contact pin assembly and contactor card 有权
标题翻译：接触销总成和接触器卡
公开(公告)号：US07358751B2
公开(公告)日：2008-04-15
申请号：US11152513
申请日：2005-06-14
申请人： Kyle K. Kirby , Warren M. Farnworth , James M. Wark , William M. Hiatt , David R. Hembree , Alan G. Wood
发明人： Kyle K. Kirby , Warren M. Farnworth , James M. Wark , William M. Hiatt , David R. Hembree , Alan G. Wood
IPC分类号： G01R31/02
CPC分类号： G01R1/0735 , G01R1/07314 , H01L23/13 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H01R12/714 , H01R13/24 , H01R2201/20 , H05K3/326 , H05K7/1069 , H05K2201/0314 , H05K2201/09036 , H05K2201/10378 , Y10T29/49165 , Y10T29/49174 , Y10T29/49204 , Y10T29/49222 , H01L2224/05599
摘要： A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.
摘要翻译：提供了柔性接触销组件和接触器卡系统。柔性接触销组件包括由基板的一部分形成的接触销，其中触头销顺从地保持通过柔性联接结构悬挂在基板内。衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

12. 发明授权

US07341881B2 Methods of packaging and testing microelectronic imaging devices 有权
标题翻译：微电子成像装置的封装和测试方法
公开(公告)号：US07341881B2
公开(公告)日：2008-03-11
申请号：US11409058
申请日：2006-04-24
申请人： Charles M. Watkins , David R. Hembree , Peter A. Benson , Salman Akram
发明人： Charles M. Watkins , David R. Hembree , Peter A. Benson , Salman Akram
IPC分类号： H01L21/00
CPC分类号： H01L27/14625 , H01L24/94 , H01L27/14618 , H01L27/14634 , H01L27/1469 , H01L31/0203 , H01L2224/48091 , H01L2224/48227 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： Microelectronic imaging devices and methods of packaging microelectronic imaging devices are disclosed herein. In one embodiment, a microelectronic imaging device includes a microelectronic die having an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads electrically coupled to the integrated circuit. The imaging device further includes a cover over the image sensor and a plurality of interconnects in and/or on the cover that are electrically coupled to corresponding bond-pads of the die. The interconnects provide external electrical contacts for the bond-pads of the die. The interconnects can extend through the cover or along a surface of the cover.
摘要翻译：本文公开了微电子成像装置和包装微电子成像装置的方法。在一个实施例中，微电子成像装置包括具有集成电路的微电子管芯，电耦合到集成电路的图像传感器，以及电耦合到集成电路的多个接合焊盘。所述成像装置还包括覆盖在所述图像传感器上的盖和在所述盖中和/或盖上的多个互连件，其电耦合到所述管芯的相应接合焊盘。互连件为模具的焊盘提供外部电触头。互连可以延伸穿过盖或沿着盖的表面。

13. 发明授权

US07297563B2 Method of making contact pin card system 失效
标题翻译：制造接触针卡系统的方法
公开(公告)号：US07297563B2
公开(公告)日：2007-11-20
申请号：US11152433
申请日：2005-06-14
申请人： Kyle K. Kirby , Warren M. Farnworth , James M. Wark , William M. Hiatt , David R. Hembree , Alan G. Wood
发明人： Kyle K. Kirby , Warren M. Farnworth , James M. Wark , William M. Hiatt , David R. Hembree , Alan G. Wood
IPC分类号： H01L21/66 , H01L23/48 , H01K3/10 , H05K1/11
CPC分类号： G01R1/0735 , G01R1/07314 , H01L23/13 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H01R12/714 , H01R13/24 , H01R2201/20 , H05K3/326 , H05K7/1069 , H05K2201/0314 , H05K2201/09036 , H05K2201/10378 , Y10T29/49165 , Y10T29/49174 , Y10T29/49204 , Y10T29/49222 , H01L2224/05599
摘要： A compliant contact pin contactor card method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.
摘要翻译：提供一种兼容的接触针接触器卡制造方法。柔性接触销组件包括由基板的一部分形成的接触销，其中触头销顺从地保持通过柔性联接结构悬挂在基板内。衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

14. 发明授权

US07250780B2 Probe card for semiconductor wafers having mounting plate and socket 失效
标题翻译：带安装板和插座的半导体晶圆探头卡
公开(公告)号：US07250780B2
公开(公告)日：2007-07-31
申请号：US10742729
申请日：2003-12-19
申请人： David R. Hembree , Warren M. Farnworth , Salman Akram , Alan G. Wood , C. Patrick Doherty , Andrew J. Krivy
发明人： David R. Hembree , Warren M. Farnworth , Salman Akram , Alan G. Wood , C. Patrick Doherty , Andrew J. Krivy
IPC分类号： G01R1/073 , G01R31/28
CPC分类号： G01R31/2886
摘要： A probe card for testing semiconductor wafers, and a method and system for testing wafers using the probe card are provided. The probe card is configured for use with a conventional testing apparatus, such as a wafer probe handler, in electrical communication with test circuitry. The probe card includes an interconnect substrate having contact members for establishing electrical communication with contact locations on the wafer. The probe card also includes a membrane for physically and electrically connecting the interconnect substrate to the testing apparatus, and a compressible member for cushioning the pressure exerted on the interconnect substrate by the testing apparatus. The interconnect substrate can be formed of silicon with raised contact members having penetrating projections. Alternately the contact members can be formed as indentations for testing bumped wafers. The membrane can be similar to multi layered TAB tape including metal foil conductors attached to a flexible, electrically-insulating, elastomeric tape. The probe card can be configured to contact all of the dice on the wafer at the same time, so that test signals can be electronically applied to selected dice as required.
摘要翻译：提供了用于测试半导体晶片的探针卡，以及使用探针卡测试晶片的方法和系统。探针卡被配置用于与测试电路电气通信的常规测试装置，例如晶片探测器处理器。探针卡包括具有用于与晶片上的接触位置建立电连通的接触构件的互连基板。探针卡还包括用于将互连基板物理和电连接到测试装置的膜，以及用于缓冲由测试装置施加在互连基板上的压力的可压缩构件。互连衬底可以由具有穿透突起的凸起接触构件的硅形成。或者，接触构件可以形成为用于测试凸起的晶片的凹陷。膜可以类似于多层TAB带，其包括附接到柔性，电绝缘的弹性体带的金属箔导体。探针卡可以配置为同时接触晶片上的所有骰子，以便测试信号可以根据需要以电子方式应用于选定的骰子。

15. 发明授权

US07245136B2 Methods of processing a workpiece, methods of communicating signals with respect to a wafer, and methods of communicating signals within a workpiece processing apparatus 有权
标题翻译：处理工件的方法，相对于晶片传送信号的方法，以及在工件处理装置内传送信号的方法
公开(公告)号：US07245136B2
公开(公告)日：2007-07-17
申请号：US09827248
申请日：2001-04-04
申请人： David R. Hembree
发明人： David R. Hembree
IPC分类号： G01R31/26 , G01R31/06
CPC分类号： H01L21/67253 , H01L21/67248
摘要： An electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus are provided. One embodiment of an electronic device workpiece processing apparatus includes a chuck including a surface, an electrical coupling adjacent the surface, and electrical interconnect configured to connect with the electrical coupling of the chuck and conduct signal within the chuck; an intermediate member having a first surface and a second surface and the intermediate member including: and electrical coupling adjacent the first surface and configured to couple with the electrical coupling of the chuck; an electrical coupling adjacent the second surface; and an electrical interconnect configured to connect the electrical coupling adjacent the first surface and the electrical coupling adjacent the second surface; and an electronic device workpiece configured to couple with the second surface of the intermediate member, the electronic device workpiece including a sensor and an electrical coupling configured to provide electrical connection of the sensor with the electrical coupling of the second surface of the intermediate member.
摘要翻译：提供一种电子设备工件处理设备和在电子设备工件处理设备内传送信号的方法。电子设备工件处理设备的一个实施例包括：卡盘，其包括表面，邻近表面的电耦合;以及被配置为与卡盘的电耦合连接并且卡盘内的导通信号的电互连; 具有第一表面和第二表面的中间构件，所述中间构件包括：与所述第一表面相邻的并且被配置为与所述卡盘的电耦合耦合的电耦合; 邻近第二表面的电耦合; 以及电互连，其被配置为将邻近所述第一表面的所述电耦合和邻近所述第二表面的所述电耦合连接; 以及电子设备工件，被配置为与所述中间构件的第二表面联接，所述电子设备工件包括传感器和电耦合，所述电耦合被配置为提供所述传感器与所述中间构件的第二表面的电耦合的电连接。

16. 发明授权

US07166915B2 Multi-chip module system 有权
标题翻译：多芯片模块系统
公开(公告)号：US07166915B2
公开(公告)日：2007-01-23
申请号：US10032734
申请日：2001-12-28
申请人： Salman Akram , David R. Hembree , James M. Wark
发明人： Salman Akram , David R. Hembree , James M. Wark
IPC分类号： H01L23/34
CPC分类号： H01L23/5382 , H01L2924/0002 , Y10S438/977 , H01L2924/00
摘要： Multi-chip module systems and method of fabrication thereof wherein the equivalent of a failed die of a multi-chip module (MCM) is added to the module in a vacancy position previously constructed with appropriate electrical connections. A variety of different dice may be attached to the same vacancy position of an MCM by means of adapters, wherein each adapter has the same footprint, but different adapters are capable of accommodating different numbers and types of dice.
摘要翻译：多芯片模块系统及其制造方法，其中将多芯片模块（MCM）的故障芯片的等同物添加到先前用适当的电连接构造的空位中的模块中。各种不同的骰子可以通过适配器连接到MCM的相同空位，其中每个适配器具有相同的占位面积，但是不同的适配器能够容纳不同数量和类型的骰子。

17. 发明授权

US06784113B2 Chip on board and heat sink attachment methods 失效
标题翻译：船上芯片和散热片附件方法
公开(公告)号：US06784113B2
公开(公告)日：2004-08-31
申请号：US10200929
申请日：2002-07-22
申请人： David R. Hembree
发明人： David R. Hembree
IPC分类号： H01L2148
CPC分类号： H01L23/3121 , H01L21/4871 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73253 , H01L2224/73265 , H01L2224/85002 , H01L2224/8592 , H01L2224/92247 , H01L2924/00014 , H01L2924/01079 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/18161 , H01L2924/19041 , H01L2924/00 , H01L2224/05599
摘要： A process for forming a thermally enhanced Chip On Board semiconductor device with a heat sink is described. In one aspect, a thermally conductive-filled gel elastomer or a silicon elastomeric material or elastomeric material, if the material is to be removed, is applied to the die surface to which the heat sink is to be bonded. During the subsequent glob top application and curing steps, difficult-to-remove glob top material which otherwise may be misapplied to the die surface adheres to the upper surface of the elastomer material. The elastomer material is removed by peeling prior to adhesion bonding of the heat sink to the die. In another aspect, the thermally conductive-filled gel elastomer is applied between a die surface and the inside attachment surface of a cap-style heat sink to eliminate overpressure on the die/substrate interface.
摘要翻译：描述了一种用于形成具有散热器的散热增强型片上半导体器件的工艺。在一个方面，如果要除去材料，则将导热填充的凝胶弹性体或硅弹性体材料或弹性体材料施加到待结合散热器的模具表面。在后续的全球顶部应用和固化步骤中，难以去除的球形材料，否则可能被错误地应用到模具表面附着到弹性体材料的上表面。在将散热器粘附到模具之前，通过剥离除去弹性体材料。在另一方面，将导热填充的凝胶弹性体施加在模具表面和盖式散热器的内部附接表面之间，以消除模具/衬底界面上的过压。

18. 发明授权

US06720652B2 Apparatus providing redundancy for fabricating highly reliable memory modules 失效
标题翻译：提供用于制造高度可靠的存储器模块的冗余的装置
公开(公告)号：US06720652B2
公开(公告)日：2004-04-13
申请号：US10213185
申请日：2002-08-05
申请人： Salman Akram , James M. Wark , David R. Hembree
发明人： Salman Akram , James M. Wark , David R. Hembree
IPC分类号： H01L2334
CPC分类号： H01L23/5382 , H01L24/97 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/14 , H05K1/0292 , H05K1/0295 , H05K2201/0979 , H05K2201/10159 , H05K2201/10674 , H01L2924/00014 , H01L2924/00
摘要： A method and apparatus for repair of a multi-chip module, such as a memory module, is provided, where at least one redundant or auxiliary chip attach location is provided on the substrate of the multi-chip module. The auxiliary chip attach location preferably provides contacts for attachment of more than one type of replacement semiconductor chip. Accordingly, when one or more chips on the multi-chip module are found to be completely or partially defective, at least one replacement chip can be selected and attached to the auxiliary location to provide additional memory to bring the module back to its design capacity.
摘要翻译：提供了一种用于修复诸如存储器模块的多芯片模块的方法和装置，其中在多芯片模块的基板上提供至少一个冗余或辅助芯片连接位置。辅助芯片安装位置优选地提供用于连接多于一种类型的替换半导体芯片的触点。因此，当发现多芯片模块上的一个或多个芯片完全或部分缺陷时，可以选择至少一个替换芯片并附加到辅助位置，以提供额外的存储器以使模块回到其设计能力。

19. 发明授权

US06703640B1 Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching 有权
标题翻译：用于连接到半导体的装置中的弹簧元件和附接方法
公开(公告)号：US06703640B1
公开(公告)日：2004-03-09
申请号：US09510828
申请日：2000-02-23
申请人： David R. Hembree , Salman Akram , Derek Gochnour
发明人： David R. Hembree , Salman Akram , Derek Gochnour
IPC分类号： H01L2329
CPC分类号： G01R1/0466
摘要： A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element. The spring element also includes conductive material to increase the thermal and electrical conductivity of the spring element.
摘要翻译：提供了用于测试半导体的临时封装中的弹簧元件。弹簧元件被压缩以将半导体以裸半导体管芯的形式或作为封装的一部分压在互连结构上。弹簧元件构造成使得其提供足够的压力以保持半导体上的触点与互连结构电接触。向弹簧元件添加和/或移除材料，使其具有所需的弹性模量。弹簧元件的形状也可以改变以改变弹性元件的弹性模量，弹簧常数和力传递能力。弹簧元件还包括导电材料以增加弹簧元件的导热性和导电性。

20. 发明授权

US06630371B2 Chip on board and heat sink attachment methods 有权
公开(公告)号：US06630371B2
公开(公告)日：2003-10-07
申请号：US10189097
申请日：2002-07-02
申请人： David R. Hembree
发明人： David R. Hembree
IPC分类号： H01L2148
CPC分类号： H01L23/3121 , H01L21/4871 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73253 , H01L2224/73265 , H01L2224/85002 , H01L2224/8592 , H01L2224/92247 , H01L2924/00014 , H01L2924/01079 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/18161 , H01L2924/19041 , H01L2924/00 , H01L2224/05599
摘要： A process for forming a thermally enhanced Chip On Board semiconductor device with a heat sink is described. In one aspect, a thermally conducting filled gel elastomer material or a silicon elastomeric material or elastomeric material, if the material is to be removed, is applied to the die surface to which the heat sink is to be bonded. During the subsequent glob top application and curing steps, difficult-to-remove glob top material which otherwise may be misapplied to the die surface adheres to the upper surface of the elastomer material. The elastomer material is removed by peeling prior to adhesion bonding of the heat sink to the die. In another aspect, the thermally conducting filled gel elastomer material is applied between a die surface and the inside attachment surface of a cap-style heat sink to eliminate overpressure on the die/substrate interface.

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